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authorPunit Agrawal <punit.agrawal@arm.com>2014-06-03 13:59:58 +0400
committerZhang Rui <rui.zhang@intel.com>2014-06-30 06:20:27 +0400
commitdd354b84d47ec8ca53686bdb3cc1aecdeb75bef5 (patch)
treefab1eb7735d8d3c24639f0d32204e032742f8c30
parentca9521b770c988bb6bb8eea1241f7a487dab6ff1 (diff)
downloadlinux-dd354b84d47ec8ca53686bdb3cc1aecdeb75bef5.tar.xz
thermal: Bind cooling devices with the correct arguments
When binding cooling devices to thermal zones created from the device tree the minimum and maximum cooling states are in the wrong order leading to failure to bind. Fix the order of cooling states in the call to thermal_zone_bind_cooling_device to fix this. Cc:Zhang Rui <rui.zhang@intel.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Reviewed-by: Stephen Boyd <sboyd@codeaurora.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
-rw-r--r--drivers/thermal/of-thermal.c4
1 files changed, 2 insertions, 2 deletions
diff --git a/drivers/thermal/of-thermal.c b/drivers/thermal/of-thermal.c
index a95ee2889b19..4b2b999b7611 100644
--- a/drivers/thermal/of-thermal.c
+++ b/drivers/thermal/of-thermal.c
@@ -156,8 +156,8 @@ static int of_thermal_bind(struct thermal_zone_device *thermal,
ret = thermal_zone_bind_cooling_device(thermal,
tbp->trip_id, cdev,
- tbp->min,
- tbp->max);
+ tbp->max,
+ tbp->min);
if (ret)
return ret;
}