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authorLinus Torvalds <torvalds@linux-foundation.org>2014-01-25 05:13:49 +0400
committerLinus Torvalds <torvalds@linux-foundation.org>2014-01-25 05:13:49 +0400
commit91466574be1a3701fab4abf5ac1539b556575a81 (patch)
tree89373ef6b0c9e024a9688207b832552dfbcca666 /include
parent09da8dfa98682d871987145ed11e3232accac860 (diff)
parentc698a4492f01127ca90fc28cd5157f3d616fe4ff (diff)
downloadlinux-91466574be1a3701fab4abf5ac1539b556575a81.tar.xz
Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui: "This time, the biggest change is the work of representing hardware thermal properties in device tree infrastructure. This work includes the introduction of a device tree bindings for describing the hardware thermal behavior and limits, and also a parser to read and interpret the data, and build thermal zones and thermal binding parameters. It also contains three examples on how to use the new representation on sensor devices, using three different drivers to accomplish it. One driver is in thermal subsystem, the TI SoC thermal, and the other two drivers are in hwmon subsystem. Actually, this would be the first step of the complete work because we still need to check other potential drivers to be converted and then validate the proposed API. But the reason why I include it in this pull request is that, first, this change does not hurt any others without using this approach, second, the principle and concept of this change would not break after converting the remaining drivers. BTW, as you can see, there are several points in this change that do not belong to thermal subsystem. Because it has been suggested by Guenter R that in such cases, it is recommended to send the complete series via one single subsystem. Specifics: - representing hardware thermal properties in device tree infrastructure - fix a regression that the imx thermal driver breaks system suspend. - introduce ACPI INT3403 thermal driver to retrieve temperature data from the INT3403 ACPI device object present on some systems. - introduce debug statement for thermal core and step_wise governor. - assorted fixes and cleanups for thermal core, cpu cooling, exynos thrmal, intel powerclamp and imx thermal driver" * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (34 commits) thermal: remove const flag from .ops of imx thermal Thermal: update thermal zone device after setting emul_temp intel_powerclamp: Fix cstate counter detection. thermal: imx: add necessary clk operation Thermal cpu cooling: return error if no valid cpu frequency entry thermal: fix cpu_cooling max_level behavior thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST thermal: debug: add debug statement for core and step_wise thermal: imx_thermal: add module device table drivers: thermal: Mark function as static in x86_pkg_temp_thermal.c thermal:samsung: fix compilation warning thermal: imx: correct suspend/resume flow thermal: exynos: fix error return code Thermal: ACPI INT3403 thermal driver MAINTAINERS: add thermal bindings entry in thermal domain arm: dts: make OMAP4460 bandgap node to belong to OCP arm: dts: make OMAP443x bandgap node to belong to OCP arm: dts: add cooling properties on omap5 cpu node arm: dts: add omap5 thermal data arm: dts: add omap5 CORE thermal data ...
Diffstat (limited to 'include')
-rw-r--r--include/dt-bindings/thermal/thermal.h17
-rw-r--r--include/linux/cpu_cooling.h25
-rw-r--r--include/linux/thermal.h32
3 files changed, 72 insertions, 2 deletions
diff --git a/include/dt-bindings/thermal/thermal.h b/include/dt-bindings/thermal/thermal.h
new file mode 100644
index 000000000000..59822a995858
--- /dev/null
+++ b/include/dt-bindings/thermal/thermal.h
@@ -0,0 +1,17 @@
+/*
+ * This header provides constants for most thermal bindings.
+ *
+ * Copyright (C) 2013 Texas Instruments
+ * Eduardo Valentin <eduardo.valentin@ti.com>
+ *
+ * GPLv2 only
+ */
+
+#ifndef _DT_BINDINGS_THERMAL_THERMAL_H
+#define _DT_BINDINGS_THERMAL_THERMAL_H
+
+/* On cooling devices upper and lower limits */
+#define THERMAL_NO_LIMIT (-1UL)
+
+#endif
+
diff --git a/include/linux/cpu_cooling.h b/include/linux/cpu_cooling.h
index a5d52eea8232..c303d383def1 100644
--- a/include/linux/cpu_cooling.h
+++ b/include/linux/cpu_cooling.h
@@ -24,6 +24,7 @@
#ifndef __CPU_COOLING_H__
#define __CPU_COOLING_H__
+#include <linux/of.h>
#include <linux/thermal.h>
#include <linux/cpumask.h>
@@ -36,6 +37,24 @@ struct thermal_cooling_device *
cpufreq_cooling_register(const struct cpumask *clip_cpus);
/**
+ * of_cpufreq_cooling_register - create cpufreq cooling device based on DT.
+ * @np: a valid struct device_node to the cooling device device tree node.
+ * @clip_cpus: cpumask of cpus where the frequency constraints will happen
+ */
+#ifdef CONFIG_THERMAL_OF
+struct thermal_cooling_device *
+of_cpufreq_cooling_register(struct device_node *np,
+ const struct cpumask *clip_cpus);
+#else
+static inline struct thermal_cooling_device *
+of_cpufreq_cooling_register(struct device_node *np,
+ const struct cpumask *clip_cpus)
+{
+ return NULL;
+}
+#endif
+
+/**
* cpufreq_cooling_unregister - function to remove cpufreq cooling device.
* @cdev: thermal cooling device pointer.
*/
@@ -48,6 +67,12 @@ cpufreq_cooling_register(const struct cpumask *clip_cpus)
{
return NULL;
}
+static inline struct thermal_cooling_device *
+of_cpufreq_cooling_register(struct device_node *np,
+ const struct cpumask *clip_cpus)
+{
+ return NULL;
+}
static inline
void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
{
diff --git a/include/linux/thermal.h b/include/linux/thermal.h
index b268d3cf7ae3..f7e11c7ea7d9 100644
--- a/include/linux/thermal.h
+++ b/include/linux/thermal.h
@@ -25,6 +25,7 @@
#ifndef __THERMAL_H__
#define __THERMAL_H__
+#include <linux/of.h>
#include <linux/idr.h>
#include <linux/device.h>
#include <linux/workqueue.h>
@@ -143,6 +144,7 @@ struct thermal_cooling_device {
int id;
char type[THERMAL_NAME_LENGTH];
struct device device;
+ struct device_node *np;
void *devdata;
const struct thermal_cooling_device_ops *ops;
bool updated; /* true if the cooling device does not need update */
@@ -172,7 +174,7 @@ struct thermal_zone_device {
int emul_temperature;
int passive;
unsigned int forced_passive;
- const struct thermal_zone_device_ops *ops;
+ struct thermal_zone_device_ops *ops;
const struct thermal_zone_params *tzp;
struct thermal_governor *governor;
struct list_head thermal_instances;
@@ -242,8 +244,31 @@ struct thermal_genl_event {
};
/* Function declarations */
+#ifdef CONFIG_THERMAL_OF
+struct thermal_zone_device *
+thermal_zone_of_sensor_register(struct device *dev, int id,
+ void *data, int (*get_temp)(void *, long *),
+ int (*get_trend)(void *, long *));
+void thermal_zone_of_sensor_unregister(struct device *dev,
+ struct thermal_zone_device *tz);
+#else
+static inline struct thermal_zone_device *
+thermal_zone_of_sensor_register(struct device *dev, int id,
+ void *data, int (*get_temp)(void *, long *),
+ int (*get_trend)(void *, long *))
+{
+ return NULL;
+}
+
+static inline
+void thermal_zone_of_sensor_unregister(struct device *dev,
+ struct thermal_zone_device *tz)
+{
+}
+
+#endif
struct thermal_zone_device *thermal_zone_device_register(const char *, int, int,
- void *, const struct thermal_zone_device_ops *,
+ void *, struct thermal_zone_device_ops *,
const struct thermal_zone_params *, int, int);
void thermal_zone_device_unregister(struct thermal_zone_device *);
@@ -256,6 +281,9 @@ void thermal_zone_device_update(struct thermal_zone_device *);
struct thermal_cooling_device *thermal_cooling_device_register(char *, void *,
const struct thermal_cooling_device_ops *);
+struct thermal_cooling_device *
+thermal_of_cooling_device_register(struct device_node *np, char *, void *,
+ const struct thermal_cooling_device_ops *);
void thermal_cooling_device_unregister(struct thermal_cooling_device *);
struct thermal_zone_device *thermal_zone_get_zone_by_name(const char *name);
int thermal_zone_get_temp(struct thermal_zone_device *tz, unsigned long *temp);