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2020-10-17Merge tag 'thermal-v5.10-rc1' of ↵Linus Torvalds2-1/+6
git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux Pull thermal updates from Daniel Lezcano: - Fix Kconfig typo "acces" -> "access" (Colin Ian King) - Use dev_error_probe() to simplify the error handling on imx and imx8 platforms (Anson Huang) - Use dedicated kobj_to_dev() instead of container_of() in the sysfs core code (Tian Tao) - Fix coding style by adding braces to a one line conditional statement on rcar (Geert Uytterhoeven) - Add DT binding documentation for the r8a774e1 platform and update the Kconfig description supporting RZ/G2 SoCs (Lad Prabhakar) - Simplify the return expression of stm_thermal_prepare on the stm32 platform (Qinglang Miao) - Fix the unit in the function documentation for the idle injection cooling device (Zhuguang Qing) - Remove an unecessary mutex_init() in the core code (Qinglang Miao) - Add support for keep alive events in the core code and the specific int340x (Srinivas Pandruvada) - Remove unused thermal zone variable in devfreq and cpufreq cooling devices (Zhuguang Qing) - Add the A100's THS controller support (Yangtao Li) - Add power management on the omap3's bandgap sensor (Adam Ford) - Fix a missing nlmsg_free in the netlink core error path (Jing Xiangfeng) * tag 'thermal-v5.10-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: thermal: core: Adding missing nlmsg_free() in thermal_genl_sampling_temp() thermal: ti-soc-thermal: Enable addition power management thermal: sun8i: Add A100's THS controller support thermal: sun8i: add TEMP_CALIB_MASK for calibration data in sun50i_h6_ths_calibrate dt-bindings: thermal: sun8i: Add binding for A100's THS controller thermal: cooling: Remove unused variable *tz thermal: int340x: Add keep alive response method thermal: core: Add new event for sending keep alive notifications thermal: int340x: Provide notification for OEM variable change thermal: core: remove unnecessary mutex_init() thermal/idle_inject: Fix comment of idle_duration_us and name of latency_ns thermal: Kconfig: Update description for RCAR_GEN3_THERMAL config thermal: stm32: simplify the return expression of stm_thermal_prepare() dt-bindings: thermal: rcar-gen3-thermal: Add r8a774e1 support thermal: rcar_thermal: Add missing braces to conditional statement thermal: Use kobj_to_dev() instead of container_of() thermal: imx8mm: Use dev_err_probe() to simplify error handling thermal: imx: Use dev_err_probe() to simplify error handling drivers: thermal: Kconfig: fix spelling mistake "acces" -> "access"
2020-10-12dt-bindings: thermal: sun8i: Add binding for A100's THS controllerYangtao Li1-1/+5
Add a binding for A100's ths controller. Signed-off-by: Yangtao Li <frank@allwinnertech.com> Reviewed-by: Rob Herring <robh@kernel.org> Acked-by: Maxime Ripard <mripard@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/8280af8ad82ed340c0ef1c171684aaad91600679.1595572867.git.frank@allwinnertech.com
2020-10-12dt-bindings: thermal: rcar-gen3-thermal: Add r8a774e1 supportLad Prabhakar1-0/+1
Document RZ/G2H (R8A774E1) SoC bindings. Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1594811350-14066-3-git-send-email-prabhakar.mahadev-lad.rj@bp.renesas.com
2020-10-07dt-bindings: Explicitly allow additional properties in common schemasRob Herring2-0/+4
In order to add meta-schema checks for additional/unevaluatedProperties being present, all schema need to make this explicit. As common/shared schema are included by other schemas, they should always allow for additionalProperties. Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Krzysztof Kozlowski <krzk@kernel.org> Acked-by: Sebastian Reichel <sre@kernel.org> Acked-by: Chanwoo Choi <cw00.choi@samsung.com> Acked-By: Vinod Koul <vkoul@kernel.org> Acked-by: Lee Jones <lee.jones@linaro.org> Acked-by: Geert Uytterhoeven <geert+renesas@glider.be> Acked-by: Srinivas Kandagatla <srinivas.kandagatla@linaro.org> Acked-by: Ulf Hansson <ulf.hansson@linaro.org> Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> Acked-by: Guenter Roeck <linux@roeck-us.net> Link: https://lore.kernel.org/r/20201005183830.486085-5-robh@kernel.org Signed-off-by: Rob Herring <robh@kernel.org>
2020-10-06dt-bindings: Another round of adding missing 'additionalProperties'Rob Herring4-0/+13
Another round of wack-a-mole. The json-schema default is additional unknown properties are allowed, but for DT all properties should be defined. Cc: Linus Walleij <linus.walleij@linaro.org> Cc: Stephen Boyd <sboyd@kernel.org> Cc: Shawn Guo <shawnguo@kernel.org> Cc: Bjorn Andersson <bjorn.andersson@linaro.org> Cc: Baolin Wang <baolin.wang7@gmail.com> Cc: Mauro Carvalho Chehab <mchehab@kernel.org> Cc: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com> Cc: "David S. Miller" <davem@davemloft.net> Cc: Bjorn Helgaas <bhelgaas@google.com> Cc: Liam Girdwood <lgirdwood@gmail.com> Cc: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Guenter Roeck <linux@roeck-us.net> Reviewed-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Acked-By: Vinod Koul <vkoul@kernel.org> Acked-by: Lee Jones <lee.jones@linaro.org> Acked-by: Ulf Hansson <ulf.hansson@linaro.org> Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> # for iio Acked-by: Thierry Reding <treding@nvidia.com> Acked-by: Mark Brown <broonie@kernel.org> Reviewd-by: Corey Minyard <cminyard@mvista.com> Acked-by: Pavel Machek <pavel@ucw.cz> Acked-by: Sebastian Reichel <sre@kernel.org> Link: https://lore.kernel.org/r/20201002234143.3570746-1-robh@kernel.org Signed-off-by: Rob Herring <robh@kernel.org>
2020-10-06Merge branch 'dt/linus' into dt/nextRob Herring1-1/+1
2020-09-15dt-bindings: thermal: imx8mm-thermal: Add i.MX 8M Nano compatibleKrzysztof Kozlowski1-3/+7
DTSes with new i.MX 8M SoCs introduce their own compatibles so add them to fix dtbs_check warnings like: arch/arm64/boot/dts/freescale/imx8mn-evk.dt.yaml: tmu@30260000: compatible:0: 'fsl,imx8mn-tmu' is not one of ['fsl,imx8mm-tmu', 'fsl,imx8mp-tmu'] From schema: Documentation/devicetree/bindings/thermal/imx8mm-thermal.yaml arch/arm64/boot/dts/freescale/imx8mn-evk.dt.yaml: tmu@30260000: compatible: ['fsl,imx8mn-tmu', 'fsl,imx8mm-tmu'] is too long arch/arm64/boot/dts/freescale/imx8mn-evk.dt.yaml: tmu@30260000: compatible: Additional items are not allowed ('fsl,imx8mm-tmu' was unexpected) Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Rob Herring <robh@kernel.org>
2020-08-18dt-bindings: Use Shawn Guo's preferred e-mail for i.MX bindingsFabio Estevam1-1/+1
Use Shawn Guo's kernel.org address for the i.MX related bindings as per the MAINTAINERS entries. Signed-off-by: Fabio Estevam <festevam@gmail.com> Link: https://lore.kernel.org/r/20200818111245.17047-1-festevam@gmail.com Signed-off-by: Rob Herring <robh@kernel.org>
2020-08-14dt-bindings: Whitespace clean-ups in schema filesRob Herring2-26/+25
Clean-up incorrect indentation, extra spaces, long lines, and missing EOF newline in schema files. Most of the clean-ups are for list indentation which should always be 2 spaces more than the preceding keyword. Found with yamllint (which I plan to integrate into the checks). Cc: linux-arm-kernel@lists.infradead.org Cc: linux-clk@vger.kernel.org Cc: dri-devel@lists.freedesktop.org Cc: linux-spi@vger.kernel.org Cc: linux-gpio@vger.kernel.org Cc: linux-remoteproc@vger.kernel.org Cc: linux-hwmon@vger.kernel.org Cc: linux-i2c@vger.kernel.org Cc: linux-fbdev@vger.kernel.org Cc: linux-iio@vger.kernel.org Cc: linux-input@vger.kernel.org Cc: linux-pm@vger.kernel.org Cc: linux-media@vger.kernel.org Cc: alsa-devel@alsa-project.org Cc: linux-mmc@vger.kernel.org Cc: linux-mtd@lists.infradead.org Cc: netdev@vger.kernel.org Cc: linux-rtc@vger.kernel.org Cc: linux-serial@vger.kernel.org Cc: linux-usb@vger.kernel.org Acked-by: Sam Ravnborg <sam@ravnborg.org> Signed-off-by: Rob Herring <robh@kernel.org>
2020-08-07Merge tag 'thermal-v5.9-rc1' of ↵Linus Torvalds15-604/+21
git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux Pull thermal updates from Daniel Lezcano: - Add support to enable/disable the thermal zones resulting on core code and drivers cleanup (Andrzej Pietrasiewicz) - Add generic netlink support for userspace notifications: events, temperature and discovery commands (Daniel Lezcano) - Fix redundant initialization for a ret variable (Colin Ian King) - Remove the clock cooling code as it is used nowhere (Amit Kucheria) - Add the rcar_gen3_thermal's r8a774e1 support (Marian-Cristian Rotariu) - Replace all references to thermal.txt in the documentation to the corresponding yaml files (Amit Kucheria) - Add maintainer entry for the IPA (Lukasz Luba) - Add support for MSM8939 for the tsens (Shawn Guo) - Update power allocator and devfreq cooling to SPDX licensing (Lukasz Luba) - Add Cannon Lake Low Power PCH support (Sumeet Pawnikar) - Add tsensor support for V2 mediatek thermal system (Henry Yen) - Fix thermal zone lookup by ID for the core code (Thierry Reding) * tag 'thermal-v5.9-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (40 commits) thermal: intel: intel_pch_thermal: Add Cannon Lake Low Power PCH support thermal: mediatek: Add tsensor support for V2 thermal system thermal: mediatek: Prepare to add support for other platforms thermal: Update power allocator and devfreq cooling to SPDX licensing MAINTAINERS: update entry to thermal governors file name prefixing thermal: core: Add thermal zone enable/disable notification thermal: qcom: tsens-v0_1: Add support for MSM8939 dt-bindings: tsens: qcom: Document MSM8939 compatible thermal: core: Fix thermal zone lookup by ID thermal: int340x: processor_thermal: fix: update Jasper Lake PCI id thermal: imx8mm: Support module autoloading thermal: ti-soc-thermal: Fix reversed condition in ti_thermal_expose_sensor() MAINTAINERS: Add maintenance information for IPA thermal: rcar_gen3_thermal: Do not shadow thcode variable dt-bindings: thermal: Get rid of thermal.txt and replace references thermal: core: Move initialization after core initcall thermal: netlink: Improve the initcall ordering net: genetlink: Move initialization to core_initcall thermal: rcar_gen3_thermal: Add r8a774e1 support thermal/drivers/clock_cooling: Remove clock_cooling code ...
2020-08-05Merge tag 'devicetree-for-5.9' of ↵Linus Torvalds3-72/+115
git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux Pull Devicetree updates from Rob Herring: - Improve device links cycle detection and breaking. Add more bindings for device link dependencies. - Refactor parsing 'no-map' in __reserved_mem_alloc_size() - Improve DT unittest 'ranges' and 'dma-ranges' test case to check differing cell sizes - Various http to https link conversions - Add a schema check to prevent 'syscon' from being used by itself without a more specific compatible - A bunch more DT binding conversions to schema * tag 'devicetree-for-5.9' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (55 commits) of: reserved-memory: remove duplicated call to of_get_flat_dt_prop() for no-map node of: unittest: Use bigger address cells to catch parser regressions dt-bindings: memory-controllers: Convert mmdc to json-schema dt-bindings: mtd: Convert imx nand to json-schema dt-bindings: mtd: Convert gpmi nand to json-schema dt-bindings: iio: io-channel-mux: Fix compatible string in example code of: property: Add device link support for pinctrl-0 through pinctrl-8 of: property: Add device link support for multiple DT bindings dt-bindings: phy: ti: phy-gmii-sel: convert bindings to json-schema dt-bindings: mux: mux.h: drop a duplicated word dt-bindings: misc: Convert olpc,xo1.75-ec to json-schema dt-bindings: aspeed-lpc: Replace HTTP links with HTTPS ones dt-bindings: drm/bridge: Replace HTTP links with HTTPS ones drm/tilcdc: Replace HTTP links with HTTPS ones dt-bindings: iommu: renesas,ipmmu-vmsa: Add r8a774e1 support dt-bindings: fpga: Replace HTTP links with HTTPS ones dt-bindings: virtio: Replace HTTP links with HTTPS ones dt-bindings: media: imx274: Add optional input clock and supplies dt-bindings: i2c-gpio: Use 'deprecated' keyword on deprecated properties dt-bindings: interrupt-controller: Fix typos in loongson,liointc.yaml ...
2020-08-04Merge tag 'arm-dt-5.9' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/socLinus Torvalds1-0/+2
Pull ARM SoC DT updates from Arnd Bergmann: "As usual, there are many patches addressing minor issues in existing DTS files, such as DTC warnings, or adding support for additional peripherals. There are three added SoCs in existing product families: - Amazon: Alpine v3 is a 16-core Cortex-A72 SoC from Amazon's Annapurna Labs, otherwise known as AL73400 or first-generation Graviton, and following the already supported Cortex-A1`5 and Cortex-A57 based Alpine chips. This one is added together with the official Evaluation platform. - Qualcomm: The Snapdragon SDM630 platform is a family of mid-range mobile phone chips from 2017 based on Cortex-A53 or Kryo 260 CPUs. A total of five end-user products are added based on these, all Android phones from Sony: Xperia 10, 10 Plus, XA2, XA2 Plus and XA2 Ultra. - Renesas: RZ/G2H (r8a774e1) is currently the top model in the Renesas RZ/G family, and apparently closely related to the RZ/G2N and RZ/G2M models we already support but has a faster GPU and additional on-chip peripherals. It is added along with the HopeRun HiHope RZ/G2H development board A small number of new boards for already supported SoCs also debut: - Allwinner sunxi: Only one new machine, revision v1.2 of the Pine64 PinePhone (non-Android) smartphone, containing minor changes compared to earlier versions. - Amlogic Meson: WeTek Core2 is an Amlogic S912 (GXM) based Set-top-box - Aspeed: EthanolX is AMD's EPYC data center rerence platform, using an ASpeed AST2600 baseboard management controller. - Mediatek: Lenovo IdeaPad Duet 10.1" (kukui/krane) is a new Chromebook based on the MT8183 (Helio P60t) SoC. - Nvidia Tegra: ASUS Google Nexus 7 and Acer Iconia Tab A500 are two Android tablets from around 2012 using Tegra 3 and Tegra 2, respectively. Thanks to PostmarketOS, these can now run mainline kernels and become useful again. The Jetson Xavier NX Developer Kit uses a SoM and carrier board for the Tegra194, their latest 64-bit chip based on Carmel CPU cores and Volta graphics. - NXP i.MX: Five new boards based on the 32-bit i.MX6 series are added: The MYiR MYS-6ULX single-board computer, and four different models of industrial computers from Protonic. - Qualcomm: MikroTik RouterBoard 3011 is a rackmounted router based on the 32-bit IPQ8064 networking SoC Three older phones get added, the Snapdragon 808 (msm8992) based Xiaomi Libra (Mi 4C) and Microsoft Lumia 950, originally running Windows Phone, and the Snapdragon 810 (msm8994) based Sony Xperia Z5. - Renesas: In addition to the HiHope RZ/G2H board mentioned above, we gain support for board versions 3.0 and 4.0 of the earlier RZ/G2M and RZ/G2N reference boards. Beacon EmbeddedWorks adds another SoM+Carrier development board for RZ/G2M. - Rockchips: Radxa Rock Pi N8 development board and the VMARC RK3288 SoM it is based on, using the high-end 32-bit rk3288 SoC. Notable updates to existing platforms are usually for added on-chip peripherals, including: - ASpeed AST2xxx (various) - Allwinner (cpufreq, thermal, Pinephone touchscreen) - Amlogic Meson (audio, gpu dvdfs, board updates) - Arm Versatile - Broadcom (board updates for switch ports, Raspberry pi clock updates) - Hisilicon (various) - Intel/Altera SoCFPGA (various) - Marvell Armada 7xxx/8xxx (smmu) - Marvell MMP (GPU on mmp2/mmp3) - Mediatek mt8183 (USB, pericfg) - NXP Layerscape (VPU, thermal, DSPI) - NXP i.MX (VPU, bindings, board updates) - Nvidia Tegra194 (GPU) - Qualcomm (GPU, Interconnect, ...) - Renesas R-Car (SPI, IPMMU, board updates) - STMicroelectronics STM32 (various) - Samsung Exynos (various) - Socionext Uniphier (updates to serial, and pcie) - TI K3 (serdes, usb3, audio, sd, chipid) - TI OMAP (IPU/DSP remoteproc changes, dropping platform data)" * tag 'arm-dt-5.9' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (605 commits) arm64: dts: meson: odroid-n2: add jack audio output support arm64: dts: meson: odroid-n2: enable audio loopback ARM: dts: berlin: Align L2 cache-controller nodename with dtschema arm64: dts: qcom: Add Microsoft Lumia 950 (Talkman) device tree arm64: dts: qcom: Add Xiaomi Libra (Mi 4C) device tree arm64: dts: qcom: msm8992: Add RPMCC node arm64: dts: qcom: msm8992: Add PSCI support. arm64: dts: qcom: msm8992: Add PMU node arm64: dts: qcom: msm8992: Add BLSP2_UART2 and I2C nodes arm64: dts: qcom: msm8992: Add SPMI PMIC arbiter device arm64: dts: qcom: msm8992: Add a SCM node arm64: dts: qcom: msm8992: Add a proper CPU map arm64: dts: qcom: bullhead: Move UART pinctrl to SoC arm64: dts: qcom: bullhead: Add qcom,msm-id arm64: dts: qcom: msm8992: Fix SDHCI1 arm64: dts: qcom: msm8992: Modernize the DTS style arm64: dts: qcom: Add support for Sony Xperia Z5 (SoMC Sumire-RoW) arm64: dts: qcom: Move msm8994-smd-rpm contents to lg-bullhead. arm64: dts: qcom: msm8994: Add support for SMD RPM arm64: dts: qcom: msm8992: Add a label to rpm-requests ...
2020-07-27dt-bindings: tsens: qcom: Document MSM8939 compatibleKonrad Dybcio1-0/+1
It adds compatible for MSM8939 TSENS device. Signed-off-by: Konrad Dybcio <konradybcio@gmail.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Shawn Guo <shawn.guo@linaro.org> Tested-by: Konrad Dybcio <konradybcio@gmail.com> /* on Asus Z00T smartphone */ Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200629144926.665-2-shawn.guo@linaro.org
2020-07-21dt-bindings: thermal: Get rid of thermal.txt and replace referencesAmit Kucheria14-604/+20
Now that we have yaml bindings for the thermal subsystem, get rid of the old bindings (thermal.txt). Replace all references to thermal.txt in the Documentation with a link to the appropriate YAML bindings using the following search and replace pattern: - If the reference is specific to the thermal-sensor-cells property, replace with a pointer to thermal-sensor.yaml - If the reference is to the cooling-cells property, replace with a pointer to thermal-cooling-devices.yaml - If the reference is generic thermal bindings, replace with a reference to thermal*.yaml. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/e9aacd33071a00568b67e110fa3bcc4d86d3e1e4.1595245166.git.amit.kucheria@linaro.org
2020-07-15MAINTAINERS: update Amit Kucheria's email to a single email addressAmit Kucheria1-1/+1
Emails currently go to different mailboxes. Switch to the kernel.org address so I can forward them to a single mailbox. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Link: https://lore.kernel.org/r/8cbb7004a6a9b846a8d827f514f33f1a265dd5d4.1593498024.git.amit.kucheria@linaro.org Signed-off-by: Rob Herring <robh@kernel.org>
2020-07-09Merge tag 'devicetree-fixes-for-5.8-2' into dt/nextRob Herring3-3/+3
Devicetree fixes for v5.8, take 2: - Sync dtc to upstream to pick up fixes for I2C bus checks and quiet warnings - Various fixes for DT binding check warnings - A couple of build fixes/improvements for binding checks - ReST formatting improvements for writing-schema.rst - Document reference fixes
2020-06-30dt-bindings: thermal: k3: Fix the reg propertyFabio Estevam1-1/+1
Adjust the reg property to fix the following warning seen with 'make dt_binding_check': Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml: example-0: thermal@42050000:reg:0: [0, 1107623936, 0, 604] is too long Signed-off-by: Fabio Estevam <festevam@gmail.com> Link: https://lore.kernel.org/r/20200630122527.28640-1-festevam@gmail.com Signed-off-by: Rob Herring <robh@kernel.org>
2020-06-30dt-bindings: thermal: Remove soc unit addressFabio Estevam2-2/+2
Remove the soc unit address to fix the following warnings seen with 'make dt_binding_check': Documentation/devicetree/bindings/thermal/thermal-sensor.example.dts:22.20-49.11: Warning (unit_address_vs_reg): /example-0/soc@0: node has a unit name, but no reg or ranges property Documentation/devicetree/bindings/thermal/thermal-zones.example.dts:23.20-50.11: Warning (unit_address_vs_reg): /example-0/soc@0: node has a unit name, but no reg or ranges property Signed-off-by: Fabio Estevam <festevam@gmail.com> Link: https://lore.kernel.org/r/20200630121804.27887-1-festevam@gmail.com [robh: also fix thermal-zones.yaml example] Signed-off-by: Rob Herring <robh@kernel.org>
2020-06-21dt-bindings: thermal: qcom-tsens: Add compatible for sm8150, sm8250Amit Kucheria1-0/+2
Added tsens bindings for sm8150 and sm8250 Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Link: https://lore.kernel.org/r/c3361043e66139812bd4cd85b917659d85e1564f.1591684754.git.amit.kucheria@linaro.org Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
2020-06-15dt-bindings: thermal: Convert qoriq to json-schemaAnson Huang2-71/+114
Convert the qoriq thermal binding to DT schema format using json-schema Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Signed-off-by: Rob Herring <robh@kernel.org>
2020-06-13Merge tag 'thermal-v5.8-rc1' of ↵Linus Torvalds5-0/+730
git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux Pull thermal updates from Daniel Lezcano: - Add the hwmon support on the i.MX SC (Anson Huang) - Thermal framework cleanups (self-encapsulation, pointless stubs, private structures) (Daniel Lezcano) - Use the PM QoS frequency changes for the devfreq cooling device (Matthias Kaehlcke) - Remove duplicate error messages from platform_get_irq() error handling (Markus Elfring) - Add support for the bandgap sensors (Keerthy) - Statically initialize .get_mode/.set_mode ops (Andrzej Pietrasiewicz) - Add Renesas R-Car maintainer entry (Niklas Söderlund) - Fix error checking after calling ti_bandgap_get_sensor_data() for the TI SoC thermal (Sudip Mukherjee) - Add latency constraint for the idle injection, the DT binding and the change the registering function (Daniel Lezcano) - Convert the thermal framework binding to the Yaml schema (Amit Kucheria) - Replace zero-length array with flexible-array on i.MX 8MM (Gustavo A. R. Silva) - Thermal framework cleanups (alphabetic order for heads, replace module.h by export.h, make file naming consistent) (Amit Kucheria) - Merge tsens-common into the tsens driver (Amit Kucheria) - Fix platform dependency for the Qoriq driver (Geert Uytterhoeven) - Clean up the rcar_thermal_update_temp() function in the rcar thermal driver (Niklas Söderlund) - Fix the TMSAR register for the TMUv2 on the Qoriq platform (Yuantian Tang) - Export GDDV, OEM vendor variables, and don't require IDSP for the int340x thermal driver - trivial conflicts fixed (Matthew Garrett) * tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (48 commits) thermal/int340x_thermal: Don't require IDSP to exist thermal/int340x_thermal: Export OEM vendor variables thermal/int340x_thermal: Export GDDV thermal: qoriq: Update the settings for TMUv2 thermal: rcar_thermal: Clean up rcar_thermal_update_temp() thermal: qoriq: Add platform dependencies drivers: thermal: tsens: Merge tsens-common.c into tsens.c thermal/of: Rename of-thermal.c thermal/governors: Prefix all source files with gov_ thermal/drivers/user_space: Sort headers alphabetically thermal/drivers/of-thermal: Sort headers alphabetically thermal/drivers/cpufreq_cooling: Replace module.h with export.h thermal/drivers/cpufreq_cooling: Sort headers alphabetically thermal/drivers/clock_cooling: Include export.h thermal/drivers/clock_cooling: Sort headers alphabetically thermal/drivers/thermal_hwmon: Include export.h thermal/drivers/thermal_hwmon: Sort headers alphabetically thermal/drivers/thermal_helpers: Include export.h thermal/drivers/thermal_helpers: Sort headers alphabetically thermal/core: Replace module.h with export.h ...
2020-06-11dt-bindings: Remove more cases of 'allOf' containing a '$ref'Rob Herring1-3/+2
Another round of 'allOf' removals that came in this cycle. json-schema versions draft7 and earlier have a weird behavior in that any keywords combined with a '$ref' are ignored (silently). The correct form was to put a '$ref' under an 'allOf'. This behavior is now changed in the 2019-09 json-schema spec and '$ref' can be mixed with other keywords. The json-schema library doesn't yet support this, but the tooling now does a fixup for this and either way works. This has been a constant source of review comments, so let's change this treewide so everyone copies the simpler syntax. Signed-off-by: Rob Herring <robh@kernel.org>
2020-05-30dt-bindings: thermal: rcar-thermal: Add device tree support for r8a7742Lad Prabhakar1-0/+1
Add thermal sensor support for r8a7742 SoC. The Renesas RZ/G1H (r8a7742) thermal sensor module is identical to the R-Car Gen2 family. No driver change is needed due to the fallback compatible value "renesas,rcar-gen2-thermal". Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com> Reviewed-by: Marian-Cristian Rotariu <marian-cristian.rotariu.rb@bp.renesas.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: Rob Herring <robh@kernel.org>
2020-05-29dt-bindings: thermal: Convert i.MX to json-schemaAnson Huang2-61/+102
Convert the i.MX thermal binding to DT schema format using json-schema Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Reviewed-by: Dong Aisheng <aisheng.dong@nxp.com> Signed-off-by: Rob Herring <robh@kernel.org>
2020-05-28dt-bindings: thermal: rcar-gen3-thermal: Convert bindings to json-schemaNiklas Söderlund2-60/+99
Convert Renesas R-Car Gen3 Thermal bindings documentation to json-schema. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: Rob Herring <robh@kernel.org>
2020-05-22dt-bindings: thermal: Add yaml bindings for thermal zonesAmit Kucheria1-0/+341
As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The thermal-zone binding is a software abstraction to capture the properties of each zone - how often they should be checked, the temperature thresholds (trips) at which mitigation actions need to be taken and the level of mitigation needed at those thresholds. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/44e5c68bc654ccaf88945f70dc875fa186dd1480.1585748882.git.amit.kucheria@linaro.org
2020-05-22dt-bindings: thermal: Add yaml bindings for thermal cooling-devicesAmit Kucheria1-0/+116
As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The property #cooling-cells is required in each device that acts as a cooling device - whether active or passive. So any device that can throttle its performance to passively reduce heat dissipation (e.g. CPUs, GPUs) and any device that can actively dissipate heat at different levels (e.g. fans) will contain this property. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/7a9ead7fb67585fb70ab3ffd481e7d567e96970e.1585748882.git.amit.kucheria@linaro.org
2020-05-22dt-bindings: thermal: Add yaml bindings for thermal sensorsAmit Kucheria1-0/+72
As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The property #thermal-sensor-cells is required in each device that acts as a thermal sensor. It is used to uniquely identify the instance of the thermal sensor inside the system. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/a91b5603caea5b8854cc9f5325448e4c7228c328.1585748882.git.amit.kucheria@linaro.org
2020-05-19dt-bindings: thermal: Add the idle cooling deviceDaniel Lezcano1-0/+145
Some devices are not able to cool down by reducing their voltage / frequency because it could be not available or the system does not allow voltage scaling. In this configuration, it is not possible to use this strategy and the idle injection cooling device can be used instead. One idle cooling device is now present for the CPU as implemented by the combination of the idle injection framework belonging to the power capping framework and the thermal cooling device. The missing part is the DT binding providing a way to describe how the cooling device will work on the system. A first iteration was done by making the cooling device to point to the idle state. Unfortunately it does not make sense because it would need to duplicate the idle state description for each CPU in order to have a different phandle and make the thermal internal framework happy. It was proposed to add an cooling-cells to <3>, unfortunately the thermal framework is expecting a value of <2> as stated by the documentation and it is not possible from the cooling device generic code to loop this third value to the back end cooling device. Another proposal was to add a child 'thermal-idle' node as the SCMI does. This approach allows to have a self-contained configuration for the idle cooling device without colliding with the cpufreq cooling device which is based on the CPU node. In addition, it allows to have the cpufreq cooling device and the idle cooling device to co-exist together as shown in the example. Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Link: https://lore.kernel.org/r/20200429103644.5492-2-daniel.lezcano@linaro.org
2020-05-14dt-bindings: Fix incorrect 'reg' property sizesRob Herring2-4/+4
The examples template is a 'simple-bus' with a size of 1 cell for had between 2 and 4 cells which really only errors on I2C or SPI type devices with a single cell. The easiest fix in most cases is to change the 'reg' property to for 1 cell address and size. In some cases with child devices having 2 cells, that doesn't make sense so a bus node is needed. Acked-by: Stephen Boyd <sboyd@kernel.org> # clk Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Acked-by: Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: Rob Herring <robh@kernel.org>
2020-05-12dt-bindings: thermal: Convert UniPhier thermal monitor to json-schemaKunihiko Hayashi2-65/+59
Convert the UniPhier thermal monitor binding to DT schema format. Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> Signed-off-by: Rob Herring <robh@kernel.org>
2020-05-11dt-bindings: thermal: Convert i.MX8MM to json-schemaAnson Huang2-15/+58
Convert the i.MX8MM thermal binding to DT schema format using json-schema Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Rob Herring <robh@kernel.org>
2020-05-03dt-bindings: Remove cases of 'allOf' containing a '$ref'Rob Herring1-4/+3
json-schema versions draft7 and earlier have a weird behavior in that any keywords combined with a '$ref' are ignored (silently). The correct form was to put a '$ref' under an 'allOf'. This behavior is now changed in the 2019-09 json-schema spec and '$ref' can be mixed with other keywords. The json-schema library doesn't yet support this, but the tooling now does a fixup for this and either way works. This has been a constant source of review comments, so let's change this treewide so everyone copies the simpler syntax. Scripted with ruamel.yaml with some manual fixups. Some minor whitespace changes from the script. Signed-off-by: Rob Herring <robh@kernel.org> Acked-by: Maxime Ripard <mripard@kernel.org> Acked-by: Lee Jones <lee.jones@linaro.org> Acked-By: Vinod Koul <vkoul@kernel.org> Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com> Acked-by: Wolfram Sang <wsa@the-dreams.de> # for I2C Reviewed-by: Linus Walleij <linus.walleij@linaro.org> Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> #for-iio Reviewed-by: Stephen Boyd <sboyd@kernel.org> # clock Signed-off-by: Rob Herring <robh@kernel.org>
2020-04-17dt-bindings: Clean-up schema indentation formattingRob Herring1-5/+5
Fix various inconsistencies in schema indentation. Most of these are list indentation which should be 2 spaces more than the start of the enclosing keyword. This doesn't matter functionally, but affects running scripts which do transforms on the schema files. Signed-off-by: Rob Herring <robh@kernel.org> Acked-by: Maxime Ripard <mripard@kernel.org> Acked-by: Lee Jones <lee.jones@linaro.org> Acked-By: Vinod Koul <vkoul@kernel.org> Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com> Signed-off-by: Rob Herring <robh@kernel.org>
2020-04-14dt-bindings: thermal: k3: Add VTM bindings documentationKeerthy1-0/+56
Add VTM bindings documentation. In the Voltage Thermal Management Module(VTM), K3 AM654 supplies a voltage reference and a temperature sensor feature that are gathered in the band gap voltage and temperature sensor (VBGAPTS) module. The band gap provides current and voltage reference for its internal circuits and other analog IP blocks. The analog-to-digital converter (ADC) produces an output value that is proportional to the silicon temperature. Signed-off-by: Keerthy <j-keerthy@ti.com> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200407055116.16082-2-j-keerthy@ti.com
2020-04-08Merge tag 'thermal-v5.7-rc1' of ↵Linus Torvalds5-2/+125
git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux Pull thermal updates from Daniel Lezcano: - Convert tsens configuration DT binding to yaml (Rajeshwari) - Add interrupt support on the rcar sensor (Niklas Söderlund) - Add a new Spreadtrum thermal driver (Baolin Wang) - Add thermal binding for the fsl scu board, a new API to retrieve the sensor id bound to the thermal zone and i.MX system controller sensor (Anson Huang)) - Remove warning log when a deferred probe is requested on Exynos (Marek Szyprowski) - Add the thermal monitoring unit support for imx8mm with its DT bindings (Anson Huang) - Rephrase the Kconfig text for clarity (Linus Walleij) - Use the gpio descriptor for the ti-soc-thermal (Linus Walleij) - Align msg structure to 4 bytes for i.MX SC, fix the Kconfig dependency, add the __may_be unused annotation for PM functions and the COMPILE_TEST option for imx8mm (Anson Huang) - Fix a dependency on regmap in Kconfig for qoriq (Yuantian Tang) - Add DT binding and support for the rcar gen3 r8a77961 and improve the error path on the rcar init function (Niklas Söderlund) - Cleanup and improvements for the tsens Qcom sensor (Amit Kucheria) - Improve code by removing lock and caching values in the rcar thermal sensor (Niklas Söderlund) - Cleanup in the qoriq drivers and add a call to imx_thermal_unregister_legacy_cooling in the removal function (Anson Huang) - Remove redundant 'maxItems' in tsens and sprd DT bindings (Rob Herring) - Change the thermal DT bindings by making the cooling-maps optional (Yuantian Tang) - Add Tiger Lake support (Sumeet Pawnikar) - Use scnprintf() for avoiding potential buffer overflow (Takashi Iwai) - Make pkg_temp_lock a raw_spinlock_t(Clark Williams) - Fix incorrect data types by changing them to signed on i.MX SC (Anson Huang) - Replace zero-length array with flexible-array member (Gustavo A. R. Silva) - Add support for i.MX8MP in the driver and in the DT bindings (Anson Huang) - Fix return value of the cpufreq_set_cur_state() function (Willy Wolff) - Remove abusing and scary WARN_ON in the cpufreq cooling device (Daniel Lezcano) - Fix build warning of incorrect argument type reported by sparse on imx8mm (Anson Huang) - Fix stub for the devfreq cooling device (Martin Blumenstingl) - Fix cpu idle cooling documentation (Sergey Vidishev) * tag 'thermal-v5.7-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (52 commits) Documentation: cpu-idle-cooling: Fix diagram for 33% duty cycle thermal: devfreq_cooling: inline all stubs for CONFIG_DEVFREQ_THERMAL=n thermal: imx8mm: Fix build warning of incorrect argument type thermal/drivers/cpufreq_cooling: Remove abusing WARN_ON thermal/drivers/cpufreq_cooling: Fix return of cpufreq_set_cur_state thermal: imx8mm: Add i.MX8MP support dt-bindings: thermal: imx8mm-thermal: Add support for i.MX8MP thermal: qcom: tsens.h: Replace zero-length array with flexible-array member thermal: imx_sc_thermal: Fix incorrect data type thermal: int340x_thermal: Use scnprintf() for avoiding potential buffer overflow thermal: int340x: processor_thermal: Add Tiger Lake support thermal/x86_pkg_temp: Make pkg_temp_lock a raw_spinlock_t dt-bindings: thermal: make cooling-maps property optional dt-bindings: thermal: qcom-tsens: Remove redundant 'maxItems' dt-bindings: thermal: sprd: Remove redundant 'maxItems' thermal: imx: Calling imx_thermal_unregister_legacy_cooling() in .remove thermal: qoriq: Sort includes alphabetically thermal: qoriq: Use devm_add_action_or_reset() to handle all cleanups thermal: rcar_thermal: Remove lock in rcar_thermal_get_current_temp() thermal: rcar_thermal: Do not store ctemp in rcar_thermal_priv ...
2020-04-01dt-bindings: thermal: tsens: Set 'additionalProperties: false'Rob Herring1-10/+18
Ensure the node only contains the properties listed in the schema by setting 'additionalProperties: false'. Doing this requires reworking the interrupt properties schemas so that they are defined in the main 'properties' section. Fixes: a877e768f655 ("dt-bindings: thermal: tsens: Convert over to a yaml schema") Cc: Andy Gross <agross@kernel.org> Cc: Bjorn Andersson <bjorn.andersson@linaro.org> Cc: Amit Kucheria <amit.kucheria@linaro.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Daniel Lezcano <daniel.lezcano@linaro.org> Cc: linux-arm-msm@vger.kernel.org Cc: linux-pm@vger.kernel.org Cc: devicetree@vger.kernel.org Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
2020-04-01dt-bindings: thermal: tsens: Fix nvmem-cell-names schemaRob Herring1-5/+4
There's a typo 'nvmem-cells-names' in the schema which means the correct 'nvmem-cell-names' in the examples are not checked. The possible values are wrong too both in that the 2nd entry is not specified correctly and the values are just wrong based on the dts files in the kernel. Fixes: a877e768f655 ("dt-bindings: thermal: tsens: Convert over to a yaml schema") Cc: Andy Gross <agross@kernel.org> Cc: Bjorn Andersson <bjorn.andersson@linaro.org> Cc: Amit Kucheria <amit.kucheria@linaro.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Daniel Lezcano <daniel.lezcano@linaro.org> Cc: linux-arm-msm@vger.kernel.org Cc: linux-pm@vger.kernel.org Cc: devicetree@vger.kernel.org Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
2020-03-31docs: dt: fix references to ap806-system-controller.txtMauro Carvalho Chehab1-1/+1
ap806-system-controller.txt was renamed to ap80x-system-controller.txt. Update its references accordingly. Fixes: 2537831bbc19 ("dt-bindings: ap80x: replace AP806 with AP80x") Signed-off-by: Mauro Carvalho Chehab <mchehab+huawei@kernel.org> Acked-by: Bartosz Golaszewski <bgolaszewski@baylibre.com> Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> Signed-off-by: Rob Herring <robh@kernel.org>
2020-03-31dt-bindings: thermal: rcar-thermal: Convert bindings to json-schemaNiklas Söderlund2-78/+139
Convert Renesas R-Car Thermal bindings documentation to json-schema. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: Rob Herring <robh@kernel.org>
2020-03-31dt-bindings: Add missing 'additionalProperties: false'Rob Herring1-0/+2
Setting 'additionalProperties: false' is frequently omitted, but is important in order to check that there aren't extra undocumented properties in a binding. Ideally, we'd just add this automatically and make this the default, but there's some cases where it doesn't work. For example, if a common schema is referenced, then properties in the common schema aren't part of what's considered for 'additionalProperties'. Also, sometimes there are bus specific properties such as 'spi-max-frequency' that go into bus child nodes, but aren't defined in the child node's schema. So let's stick with the json-schema defined default and add 'additionalProperties: false' where needed. This will be a continual review comment and game of wack-a-mole. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Neil Armstrong <narmstrong@baylibre.com> Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> Acked-by: Alexandru Ardelean <alexandru.ardelean@analog.com> Reviewed-by: Benjamin Gaignard <benjamin.gaignard@st.com> Acked-by: Stephen Boyd <sboyd@kernel.org> # clock Acked-by: Lee Jones <lee.jones@linaro.org>
2020-03-27dt-bindings: Clean-up schema errors due to missing 'addtionalProperties: false'Rob Herring1-0/+2
Numerous schemas are missing 'additionalProperties: false' statements which ensures a binding doesn't have any extra undocumented properties or child nodes. Fixing this reveals various missing properties, so let's fix all those occurrences. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Neil Armstrong <narmstrong@baylibre.com> Acked-by: Alexandru Ardelean <alexandru.ardelean@analog.com> Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> #for-iio Acked-by: Stephen Boyd <sboyd@kernel.org> # clock Acked-by: Lee Jones <lee.jones@linaro.org> Reviewed-by: Linus Walleij <linus.walleij@linaro.org> Cc: dri-devel@lists.freedesktop.org Cc: netdev@vger.kernel.org Cc: Guillaume La Roque <glaroque@baylibre.com> Cc: linux-arm-kernel@lists.infradead.org Cc: Mark Brown <broonie@kernel.org> Cc: linux-iio@vger.kernel.org Cc: Lars-Peter Clausen <lars@metafoo.de> Cc: linux-clk@vger.kernel.org Cc: Thomas Gleixner <tglx@linutronix.de> Cc: Kevin Hilman <khilman@baylibre.com> Cc: "David S. Miller" <davem@davemloft.net> Cc: Hartmut Knaack <knaack.h@gmx.de> Cc: Peter Meerwald-Stadler <pmeerw@pmeerw.net> Cc: linux-amlogic@lists.infradead.org Cc: linux-pm@vger.kernel.org Cc: Masahiro Yamada <yamada.masahiro@socionext.com> Cc: Bartosz Golaszewski <bgolaszewski@baylibre.com> Cc: Liam Girdwood <lgirdwood@gmail.com> Cc: Mauro Carvalho Chehab <mchehab@kernel.org> Cc: linux-gpio@vger.kernel.org Cc: Daniel Lezcano <daniel.lezcano@linaro.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-media@vger.kernel.org Cc: Lee Jones <lee.jones@linaro.org>
2020-03-23dt-bindings: thermal: imx8mm-thermal: Add support for i.MX8MPAnson Huang1-2/+2
Add thermal binding doc for Freescale's i.MX8MP Thermal Monitoring Unit. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1584674791-9717-1-git-send-email-Anson.Huang@nxp.com
2020-03-20dt-bindings: thermal: make cooling-maps property optionalYuantian Tang1-1/+1
Cooling-maps doesn't have to be a required property because there may be no cooling device on system, or there are no enough cooling devices for each thermal zone in multiple thermal zone cases since cooling devices can't be shared. So make this property optional to remove such limitations. For thermal zones with no cooling-maps, there could be critic trips that can trigger CPU reset or shutdown. So they still can take actions. Signed-off-by: Yuantian Tang <andy.tang@nxp.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200309045411.21859-1-andy.tang@nxp.com
2020-03-20dt-bindings: thermal: qcom-tsens: Remove redundant 'maxItems'Rob Herring1-1/+0
There's no need to specify 'maxItems' with the same value as the number of entries in 'items'. A meta-schema update will catch future cases. Cc: Andy Gross <agross@kernel.org> Cc: Bjorn Andersson <bjorn.andersson@linaro.org> Cc: Amit Kucheria <amit.kucheria@linaro.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Daniel Lezcano <daniel.lezcano@linaro.org> Cc: linux-arm-msm@vger.kernel.org Cc: linux-pm@vger.kernel.org Cc: devicetree@vger.kernel.org Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200313214552.845-2-robh@kernel.org
2020-03-20dt-bindings: thermal: sprd: Remove redundant 'maxItems'Rob Herring1-1/+0
There's no need to specify 'maxItems' with the same value as the number of entries in 'items'. A meta-schema update will catch future cases. Cc: Orson Zhai <orsonzhai@gmail.com> Cc: Baolin Wang <baolin.wang7@gmail.com> Cc: Chunyan Zhang <zhang.lyra@gmail.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Daniel Lezcano <daniel.lezcano@linaro.org> Cc: Amit Kucheria <amit.kucheria@verdurent.com> Cc: linux-pm@vger.kernel.org Cc: devicetree@vger.kernel.org Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Baolin Wang <baolin.wang7@gmail.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200313214552.845-1-robh@kernel.org
2020-03-20dt-bindings: thermal: rcar-gen3-thermal: Add r8a77961 supportGeert Uytterhoeven1-0/+1
Document R-Car M3-W+ (R8A77961) SoC bindings. Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200306105503.24267-2-geert+renesas@glider.be
2020-03-12dt-bindings: thermal: imx8mm-thermal: Add binding doc for i.MX8MMAnson Huang1-0/+15
Add thermal binding doc for Freescale's i.MX8MM Thermal Monitoring Unit. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1582947862-11073-1-git-send-email-Anson.Huang@nxp.com
2020-03-12dt-bindings: thermal: sprd: Add the Spreadtrum thermal documentationBaolin Wang1-0/+108
Add the Spreadtrum thermal documentation. Signed-off-by: Baolin Wang <baolin.wang@unisoc.com> Signed-off-by: Baolin Wang <baolin.wang7@gmail.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/444e45ce0a9b390b2502dfcefd1ddb36948fa8e1.1582013101.git.baolin.wang7@gmail.com
2020-02-29dt-bindings: thermal: tsens: Add configuration in yamlRajeshwari1-0/+1
Added configuration in dt-bindings for SC7180. Signed-off-by: Rajeshwari <rkambl@codeaurora.org> Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Acked-by: Rob Herring <robh@kernel.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1578317369-16045-3-git-send-email-rkambl@codeaurora.org
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