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2022-03-26Merge tag 'devicetree-for-5.18' of ↵Linus Torvalds2-7/+7
git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux Pull devicetree updates from Rob Herring: - Add Krzysztof Kozlowski as co-maintainer for DT bindings providing much needed help. - DT schema validation now takes DTB files as input rather than intermediate YAML files. This decouples the validation from the source level syntax information. There's a bunch of schema fixes as a result of switching to DTB based validation which exposed some errors and incomplete schemas and examples. - Kbuild improvements to explicitly warn users running 'make dt_binding_check' on missing yamllint - Expand DT_SCHEMA_FILES kbuild variable to take just a partial filename or path instead of the full path to 1 file. - Convert various bindings to schema format: mscc,vsc7514-switch, multiple GNSS bindings, ahci-platform, i2c-at91, multiple UFS bindings, cortina,gemini-sata-bridge, cortina,gemini-ethernet, Atmel SHA, Atmel TDES, Atmel AES, armv7m-systick, Samsung Exynos display subsystem, nuvoton,npcm7xx-timer, samsung,s3c2410-i2c, zynqmp_dma, msm/mdp4, rda,8810pl-uart - New schemas for u-boot environment variable partition, TI clksel - New compatible strings for Renesas RZ/V2L SoC - Vendor prefixes for Xen, HPE, deprecated Synopsys, deprecated HiSilicon - Add/fix schemas for QEMU Arm 'virt' machine - Drop unused of_alias_get_alias_list() function - Add a script to check DT unittest EXPECT message output. Pass messages also now print by default at PR_INFO level to help test automation. * tag 'devicetree-for-5.18' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (96 commits) dt-bindings: kbuild: Make DT_SCHEMA_LINT a recursive variable dt-bindings: nvmem: add U-Boot environment variables binding dt-bindings: ufs: qcom: Add SM6350 compatible string dt-bindings: dmaengine: sifive,fu540-c000: include generic schema dt-bindings: gpio: pca95xx: drop useless consumer example Revert "of: base: Introduce of_alias_get_alias_list() to check alias IDs" dt-bindings: virtio,mmio: Allow setting devices 'dma-coherent' dt-bindings: gnss: Add two more chips dt-bindings: gnss: Rewrite sirfstar binding in YAML dt-bindings: gnss: Modify u-blox to use common bindings dt-bindings: gnss: Rewrite common bindings in YAML dt-bindings: ata: ahci-platform: Add rk3568-dwc-ahci compatible dt-bindings: ata: ahci-platform: Add power-domains property dt-bindings: ata: ahci-platform: Convert DT bindings to yaml dt-bindings: kbuild: Use DTB files for validation dt-bindings: kbuild: Pass DT_SCHEMA_FILES to dt-validate dt-bindings: Add QEMU virt machine compatible dt-bindings: arm: Convert QEMU fw-cfg to DT schema dt-bindings: i2c: at91: Add SAMA7G5 compatible strings list dt-bindings: i2c: convert i2c-at91 to json-schema ...
2022-03-08dt-bindings: thermal: tsens: Add msm8953 compatibleLuca Weiss1-0/+1
Document the compatible string for tsens found in msm8953. Signed-off-by: Luca Weiss <luca@z3ntu.xyz> Acked-by: Konrad Dybcio <konrad.dybcio@somainline.org> Acked-by: Amit Kucheria <amitk@kernel.org> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20220220201909.445468-3-luca@z3ntu.xyz Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-03-08dt-bindings: thermal: Add sm8150 compatible string for LMhThara Gopinath1-0/+1
Extend the LMh dt binding document to include compatible string supporting sm8150 SoC. Signed-off-by: Thara Gopinath <thara.gopinath@linaro.org> Acked-by: Rob Herring <robh@kernel.org> Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20220106173138.411097-4-thara.gopinath@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-03-08dt-bindings: thermal: samsung: Convert to dtschemaKrzysztof Kozlowski2-106/+184
Convert the Samsung Exynos SoC Thermal Management Unit bindings to DT schema format. Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20220122132554.65192-2-krzysztof.kozlowski@canonical.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-02-04dt-bindings: Improve phandle-array schemasRob Herring2-7/+7
The 'phandle-array' type is a bit ambiguous. It can be either just an array of phandles or an array of phandles plus args. Many schemas for phandle-array properties aren't clear in the schema which case applies though the description usually describes it. The array of phandles case boils down to needing: items: maxItems: 1 The phandle plus args cases should typically take this form: items: - items: - description: A phandle - description: 1st arg cell - description: 2nd arg cell With this change, some examples need updating so that the bracketing of property values matches the schema. Signed-off-by: Rob Herring <robh@kernel.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Acked-by: Vinod Koul <vkoul@kernel.org> Acked-by: Ulf Hansson <ulf.hansson@linaro.org> Acked-by: Georgi Djakov <djakov@kernel.org> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com> Acked-by: Stephen Boyd <sboyd@kernel.org> Acked-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Acked-by: Marc Kleine-Budde <mkl@pengutronix.de> Link: https://lore.kernel.org/r/20220119015038.2433585-1-robh@kernel.org
2022-01-13Merge tag 'devicetree-for-5.17' of ↵Linus Torvalds3-28/+60
git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux Pull devicetree updates from Rob Herring: "Bindings: - DT schema conversions for Samsung clocks, RNG bindings, Qcom Command DB and rmtfs, gpio-restart, i2c-mux-gpio, i2c-mux-pinctl, Tegra I2C and BPMP, pwm-vibrator, Arm DSU, and Cadence macb - DT schema conversions for Broadcom platforms: interrupt controllers, STB GPIO, STB waketimer, STB reset, iProc MDIO mux, iProc PCIe, Cygnus PCIe PHY, PWM, USB BDC, BCM6328 LEDs, TMON, SYSTEMPORT, AMAC, Northstar 2 PCIe PHY, GENET, moca PHY, GISB arbiter, and SATA - Add binding schemas for Tegra210 EMC table, TI DC-DC converters, - Clean-ups of MDIO bus schemas to fix 'unevaluatedProperties' issues - More fixes due to 'unevaluatedProperties' enabling - Data type fixes and clean-ups of binding examples found in preparation to move to validating DTB files directly (instead of intermediate YAML representation. - Vendor prefixes for T-Head Semiconductor, OnePlus, and Sunplus - Add various new compatible strings DT core: - Silence a warning for overlapping reserved memory regions - Reimplement unittest overlay tracking - Fix stack frame size warning in unittest - Clean-ups of early FDT scanning functions - Fix handling of "linux,usable-memory-range" on EFI booted systems - Add support for 'fail' status on CPU nodes - Improve error message in of_phandle_iterator_next() - kbuild: Disable duplicate unit-address warnings for disabled nodes" * tag 'devicetree-for-5.17' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (114 commits) dt-bindings: net: mdio: Drop resets/reset-names child properties dt-bindings: clock: samsung: convert S5Pv210 to dtschema dt-bindings: clock: samsung: convert Exynos5410 to dtschema dt-bindings: clock: samsung: convert Exynos5260 to dtschema dt-bindings: clock: samsung: extend Exynos7 bindings with UFS dt-bindings: clock: samsung: convert Exynos7 to dtschema dt-bindings: clock: samsung: convert Exynos5433 to dtschema dt-bindings: i2c: maxim,max96712: Add bindings for Maxim Integrated MAX96712 dt-bindings: iio: adi,ltc2983: Fix 64-bit property sizes dt-bindings: power: maxim,max17040: Fix incorrect type for 'maxim,rcomp' dt-bindings: interrupt-controller: arm,gic-v3: Fix 'interrupts' cell size in example dt-bindings: iio/magnetometer: yamaha,yas530: Fix invalid 'interrupts' in example dt-bindings: clock: imx5: Drop clock consumer node from example dt-bindings: Drop required 'interrupt-parent' dt-bindings: net: ti,dp83869: Drop value on boolean 'ti,max-output-impedance' dt-bindings: net: wireless: mt76: Fix 8-bit property sizes dt-bindings: PCI: snps,dw-pcie-ep: Drop conflicting 'max-functions' schema dt-bindings: i2c: st,stm32-i2c: Make each example a separate entry dt-bindings: net: stm32-dwmac: Make each example a separate entry dt-bindings: net: Cleanup MDIO node schemas ...
2022-01-11Merge tag 'thermal-5.17-rc1' of ↵Linus Torvalds1-0/+76
git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm Pull thermal control updates from Rafael Wysocki: "These add a new driver for Renesas RZ/G2L TSU, update a few existing thermal control drivers and clean up the tmon utility. Specifics: - Add new TSU driver and DT bindings for the Renesas RZ/G2L platform (Biju Das). - Fix missing check when calling reset_control_deassert() in the rz2gl thermal driver (Biju Das). - In preparation for FORTIFY_SOURCE performing compile-time and run-time field bounds checking for memcpy(), avoid intentionally writing across neighboring fields in the int340x thermal control driver (Kees Cook). - Fix RFIM mailbox write commands handling in the int340x thermal control driver (Sumeet Pawnikar). - Fix PM issue occurring in the iMX thermal control driver during suspend/resume by implementing PM runtime support in it (Oleksij Rempel). - Add 'const' annotation to thermal_cooling_ops in the Intel powerclamp driver (Rikard Falkeborn). - Fix missing ADC bit set in the iMX8MP thermal driver to enable the sensor (Paul Gerber). - Drop unused local variable definition from tmon (ran jianping)" * tag 'thermal-5.17-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: thermal/drivers/int340x: Fix RFIM mailbox write commands thermal/drivers/rz2gl: Add error check for reset_control_deassert() thermal/drivers/imx8mm: Enable ADC when enabling monitor thermal/drivers: Add TSU driver for RZ/G2L dt-bindings: thermal: Document Renesas RZ/G2L TSU thermal/drivers/intel_powerclamp: Constify static thermal_cooling_device_ops thermal/drivers/imx: Implement runtime PM support thermal: tools: tmon: remove unneeded local variable thermal: int340x: Use struct_group() for memcpy() region
2021-12-17dt-bindings: thermal: tegra186-bpmp: Convert to json-schemaThierry Reding2-33/+42
Convert the Tegra186 (and later) BPMP thermal device tree bindings from the free-form text format to json-schema. Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Thierry Reding <treding@nvidia.com>
2021-12-14dt-bindings: thermal: Convert Broadcom TMON to YAMLFlorian Fainelli2-23/+56
Convert the Broadcom AVS TMON Device Tree binding to YAML to help with validation. Signed-off-by: Florian Fainelli <f.fainelli@gmail.com> Link: https://lore.kernel.org/r/20211208003727.3596577-12-f.fainelli@gmail.com Signed-off-by: Rob Herring <robh@kernel.org>
2021-11-30dt-bindings: thermal: Document Renesas RZ/G2L TSUBiju Das1-0/+76
Document the Thermal Sensor Unit(TSU) in the RZ/G2L SoC. Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com> Reviewed-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20211130155757.17837-2-biju.das.jz@bp.renesas.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2021-11-29dt-bindings: thermal: Fix definition of cooling-maps contribution propertyNiklas Söderlund1-5/+4
When converting the thermal-zones bindings to yaml the definition of the contribution property changed. The intention is the same, an integer value expressing a ratio of a sum on how much cooling is provided by the device to the zone. But after the conversion the integer value is limited to the range 0 to 100 and expressed as a percentage. This is problematic for two reasons. - This do not match how the binding is used. Out of the 18 files that make use of the property only two (ste-dbx5x0.dtsi and ste-hrefv60plus.dtsi) sets it at a value that satisfy the binding, 100. The remaining 16 files set the value higher and fail to validate. - Expressing the value as a percentage instead of a ratio of the sum is confusing as there is nothing to enforce the sum in the zone is not greater then 100. This patch restore the pre yaml conversion description and removes the value limitation allowing the usage of the bindings to validate. Fixes: 1202a442a31fd2e5 ("dt-bindings: thermal: Add yaml bindings for thermal zones") Reported-by: Kieran Bingham <kieran.bingham+renesas@ideasonboard.com> Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Link: https://lore.kernel.org/r/20211109103045.1403686-1-niklas.soderlund+renesas@ragnatech.se Signed-off-by: Rob Herring <robh@kernel.org>
2021-11-12dt-bindings: treewide: Update @st.com email address to @foss.st.comPatrice Chotard1-1/+1
Not all @st.com email address are concerned, only people who have a specific @foss.st.com email will see their entry updated. For some people, who left the company, remove their email. Cc: Alexandre Torgue <alexandre.torgue@foss.st.com> Cc: Arnaud Pouliquen <arnaud.pouliquen@foss.st.com> Cc: Fabien Dessenne <fabien.dessenne@foss.st.com> Cc: Christophe Roullier <christophe.roullier@foss.st.com> Cc: Gabriel Fernandez <gabriel.fernandez@foss.st.com> Cc: Lionel Debieve <lionel.debieve@foss.st.com> Cc: Amelie Delaunay <amelie.delaunay@foss.st.com> Cc: Pierre-Yves MORDRET <pierre-yves.mordret@foss.st.com> Cc: Ludovic Barre <ludovic.barre@foss.st.com> Cc: Christophe Kerello <christophe.kerello@foss.st.com> Cc: pascal Paillet <p.paillet@foss.st.com> Cc: Erwan Le Ray <erwan.leray@foss.st.com> Cc: Philippe CORNU <philippe.cornu@foss.st.com> Cc: Yannick Fertre <yannick.fertre@foss.st.com> Cc: Fabrice Gasnier <fabrice.gasnier@foss.st.com> Cc: Olivier Moysan <olivier.moysan@foss.st.com> Cc: Hugues Fruchet <hugues.fruchet@foss.st.com> Signed-off-by: Patrice Chotard <patrice.chotard@foss.st.com> Reviewed-by: Mathieu Poirier <mathieu.poirier@linaro.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com> Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Lee Jones <lee.jones@linaro.org> Acked-By: Vinod Koul <vkoul@kernel.org> Acked-by: Miquel Raynal <miquel.raynal@bootlin.com> Link: https://lore.kernel.org/r/20211110150144.18272-6-patrice.chotard@foss.st.com Signed-off-by: Rob Herring <robh@kernel.org>
2021-10-18dt-bindings: thermal: uniphier: Add binding for NX1 SoCKunihiko Hayashi1-0/+1
Update thermal binding document for UniPhier NX1 SoC. Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> Link: https://lore.kernel.org/r/1634520891-16801-2-git-send-email-hayashi.kunihiko@socionext.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2021-10-17dt-bindings: thermal: remove redundant comments from rockchip-thermal.yamlJohan Jonker1-8/+8
Remove redundent comments from rockchip-thermal.yaml Sort compatibles in alphabetical order. Signed-off-by: Johan Jonker <jbx6244@gmail.com> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20210930110517.14323-2-jbx6244@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2021-10-17dt-bindings: thermal: allow more resets for tsadc node in rockchip-thermal.yamlJohan Jonker1-2/+5
The tsadc node in rk356x.dtsi has more resets defined then currently allowed by rockchip-thermal.yaml, so fix that in the documentation. The driver now uses the devm_reset_control_array_get() function, so reset-names is no longer required, but keep it for legacy reasons. Signed-off-by: Johan Jonker <jbx6244@gmail.com> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20210930110517.14323-1-jbx6244@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2021-10-15dt-bindings: thermal: qcom: add HC variant of adc-thermal monitor bindingsBjorn Andersson1-0/+149
The HC generation of the ADC Thermal Monitor is quite similar to the 5th generation, but differs in valid values for a few properties. Create a new binding for the HC version of the hardware, rather than sprinkle conditionals throughout the existing binding. Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20211005032531.2251928-2-bjorn.andersson@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2021-09-11Merge tag 'thermal-v5.15-rc1' of ↵Linus Torvalds2-1/+83
git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux Pull thermal updates from Daniel Lezcano: - Add the tegra3 thermal sensor and fix the compilation testing on tegra by adding a dependency on ARCH_TEGRA along with COMPILE_TEST (Dmitry Osipenko) - Fix the error code for the exynos when devm_get_clk() fails (Dan Carpenter) - Add the TCC cooling support for AlderLake platform (Sumeet Pawnikar) - Add support for hardware trip points for the rcar gen3 thermal driver and store TSC id as unsigned int (Niklas Söderlund) - Replace the deprecated CPU-hotplug functions get_online_cpus() and put_online_cpus (Sebastian Andrzej Siewior) - Add the thermal tools directory in the MAINTAINERS file (Daniel Lezcano) - Fix the Makefile and the cross compilation flags for the userspace 'tmon' tool (Rolf Eike Beer) - Allow to use the IMOK independently from the GDDV on Int340x (Sumeet Pawnikar) - Fix the stub thermal_cooling_device_register() function prototype which does not match the real function (Arnd Bergmann) - Make the thermal trip point optional in the DT bindings (Maxime Ripard) - Fix a typo in a comment in the core code (Geert Uytterhoeven) - Reduce the verbosity of the trace in the SoC thermal tegra driver (Dmitry Osipenko) - Add the support for the LMh (Limit Management hardware) driver on the QCom platforms (Thara Gopinath) - Allow processing of HWP interrupt by adding a weak function in the Intel driver (Srinivas Pandruvada) - Prevent an abort of the sensor probe is a channel is not used (Matthias Kaehlcke) * tag 'thermal-v5.15-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: thermal/drivers/qcom/spmi-adc-tm5: Don't abort probing if a sensor is not used thermal/drivers/intel: Allow processing of HWP interrupt dt-bindings: thermal: Add dt binding for QCOM LMh thermal/drivers/qcom: Add support for LMh driver firmware: qcom_scm: Introduce SCM calls to access LMh thermal/drivers/tegra-soctherm: Silence message about clamped temperature thermal: Spelling s/scallbacks/callbacks/ dt-bindings: thermal: Make trips node optional thermal/core: Fix thermal_cooling_device_register() prototype thermal/drivers/int340x: Use IMOK independently tools/thermal/tmon: Add cross compiling support thermal/tools/tmon: Improve the Makefile MAINTAINERS: Add missing userspace thermal tools to the thermal section thermal/drivers/intel_powerclamp: Replace deprecated CPU-hotplug functions. thermal/drivers/rcar_gen3_thermal: Store TSC id as unsigned int thermal/drivers/rcar_gen3_thermal: Add support for hardware trip points drivers/thermal/intel: Add TCC cooling support for AlderLake platform thermal/drivers/exynos: Fix an error code in exynos_tmu_probe() thermal/drivers/tegra: Correct compile-testing of drivers thermal/drivers/tegra: Add driver for Tegra30 thermal sensor
2021-08-18dt-bindings: thermal: Add dt binding for QCOM LMhThara Gopinath1-0/+82
Add dt binding documentation to describe Qualcomm Limits Management Hardware node. Signed-off-by: Thara Gopinath <thara.gopinath@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210809191605.3742979-8-thara.gopinath@linaro.org
2021-08-14dt-bindings: thermal: Make trips node optionalMaxime Ripard1-1/+1
Even though the previous binding made it a required child node, the implementation in Linux never made it mandatory and just ignored thermal zones without trip points. This was even effectively encouraged, since the thermal core wouldn't allow a thermal sensor to probe without a thermal zone. In the case where you had a thermal device that had multiple sensors but with enough knowledge to provide trip points for only a few of them, this meant that the only way to make that driver probe was to provide a thermal zone without the trips node required by the binding. This obviously led to a fair number of device trees doing exactly that, making the initial binding requirement ineffective. Let's make it clear by dropping that requirement. Cc: Amit Kucheria <amitk@kernel.org> Cc: Daniel Lezcano <daniel.lezcano@linaro.org> Cc: linux-pm@vger.kernel.org Cc: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Maxime Ripard <maxime@cerno.tech> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210721140424.725744-34-maxime@cerno.tech
2021-08-04arm64: dts: qcom: sdm630: Add TSENS nodeKonrad Dybcio1-0/+1
This will enable temperature reporting for various SoC components. Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@somainline.org> Signed-off-by: Konrad Dybcio <konrad.dybcio@somainline.org> Link: https://lore.kernel.org/r/20210728222542.54269-15-konrad.dybcio@somainline.org Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
2021-07-10Merge tag 'thermal-v5.14-rc1' of ↵Linus Torvalds4-85/+171
git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux Pull thermal updates from Daniel Lezcano: - Add rk3568 sensor support (Finley Xiao) - Add missing MODULE_DEVICE_TABLE for the Spreadtrum sensor (Chunyan Zhang) - Export additionnal attributes for the int340x thermal processor (Srinivas Pandruvada) - Add SC7280 compatible for the tsens driver (Rajeshwari Ravindra Kamble) - Fix kernel documentation for thermal_zone_device_unregister() and use devm_platform_get_and_ioremap_resource() (Yang Yingliang) - Fix coefficient calculations for the rcar_gen3 sensor driver (Niklas Söderlund) - Fix shadowing variable rcar_gen3_ths_tj_1 (Geert Uytterhoeven) - Add missing of_node_put() for the iMX and Spreadtrum sensors (Krzysztof Kozlowski) - Add tegra3 thermal sensor DT bindings (Dmitry Osipenko) - Stop the thermal zone monitoring when unregistering it to prevent a temperature update without the 'get_temp' callback (Dmitry Osipenko) - Add rk3568 DT bindings, convert bindings to yaml schemas and add the corresponding compatible in the Rockchip sensor (Ezequiel Garcia) - Add the sc8180x compatible for the Qualcomm tsensor (Bjorn Andersson) - Use the find_first_zero_bit() function instead of custom code (Andy Shevchenko) - Fix the kernel doc for the device cooling device (Yang Li) - Reorg the processor thermal int340x to set the scene for the PCI mmio driver (Srinivas Pandruvada) - Add PCI MMIO driver for the int340x processor thermal driver (Srinivas Pandruvada) - Add hwmon sensors for the mediatek sensor (Frank Wunderlich) - Fix warning for return value reported by Smatch for the int340x thermal processor (Srinivas Pandruvada) - Fix wrong register access and decoding for the int340x thermal processor (Srinivas Pandruvada) * tag 'thermal-v5.14-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (23 commits) thermal/drivers/int340x/processor_thermal: Fix tcc setting thermal/drivers/int340x/processor_thermal: Fix warning for return value thermal/drivers/mediatek: Add sensors-support thermal/drivers/int340x/processor_thermal: Add PCI MMIO based thermal driver thermal/drivers/int340x/processor_thermal: Split enumeration and processing part thermal: devfreq_cooling: Fix kernel-doc thermal/drivers/intel/intel_soc_dts_iosf: Switch to use find_first_zero_bit() dt-bindings: thermal: tsens: Add sc8180x compatible dt-bindings: rockchip-thermal: Support the RK3568 SoC compatible dt-bindings: thermal: convert rockchip-thermal to json-schema thermal/core/thermal_of: Stop zone device before unregistering it dt-bindings: thermal: Add binding for Tegra30 thermal sensor thermal/drivers/sprd: Add missing of_node_put for loop iteration thermal/drivers/imx_sc: Add missing of_node_put for loop iteration thermal/drivers/rcar_gen3_thermal: Do not shadow rcar_gen3_ths_tj_1 thermal/drivers/rcar_gen3_thermal: Fix coefficient calculations thermal/drivers/st: Use devm_platform_get_and_ioremap_resource() thermal/core: Correct function name thermal_zone_device_unregister() dt-bindings: thermal: tsens: Add compatible string to TSENS binding for SC7280 thermal/drivers/int340x: processor_thermal: Export additional attributes ...
2021-07-04dt-bindings: thermal: tsens: Add sc8180x compatibleBjorn Andersson1-0/+1
The Qualcomm sc8180x platform has the usual tsens blocks, add compatible for this. Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org> Acked-by: Thara Gopinath <thara.gopinath@linaro.org> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210608201638.2136344-1-bjorn.andersson@linaro.org
2021-07-04dt-bindings: rockchip-thermal: Support the RK3568 SoC compatibleEzequiel Garcia1-0/+1
Add a new compatible for the thermal sensor device on RK3568 SoCs. Signed-off-by: Ezequiel Garcia <ezequiel@collabora.com> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210506175514.168365-4-ezequiel@collabora.com
2021-07-04dt-bindings: thermal: convert rockchip-thermal to json-schemaEzequiel Garcia2-85/+95
Convert Rockchip Thermal sensor dt-bindings to YAML. Signed-off-by: Ezequiel Garcia <ezequiel@collabora.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210506175514.168365-3-ezequiel@collabora.com
2021-07-04dt-bindings: thermal: Add binding for Tegra30 thermal sensorDmitry Osipenko1-0/+73
All NVIDIA Tegra30 SoCs have on-chip sensors which monitor temperature and voltage of the SoC. Sensors also controls CPU x2 freq throttle and emits emergency shutdown signal. TSENSOR has has two separate channels for each sensor placed in a different parts of the SoC. Add binding for the sensor hardware. Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Dmitry Osipenko <digetx@gmail.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210616190417.32214-2-digetx@gmail.com
2021-06-21dt-bindings: Drop redundant minItems/maxItemsRob Herring2-3/+0
If a property has an 'items' list, then a 'minItems' or 'maxItems' with the same size as the list is redundant and can be dropped. Note that is DT schema specific behavior and not standard json-schema behavior. The tooling will fixup the final schema adding any unspecified minItems/maxItems. This condition is partially checked with the meta-schema already, but only if both 'minItems' and 'maxItems' are equal to the 'items' length. An improved meta-schema is pending. Cc: Jens Axboe <axboe@kernel.dk> Cc: Stephen Boyd <sboyd@kernel.org> Cc: Herbert Xu <herbert@gondor.apana.org.au> Cc: "David S. Miller" <davem@davemloft.net> Cc: David Airlie <airlied@linux.ie> Cc: Daniel Vetter <daniel@ffwll.ch> Cc: Bartosz Golaszewski <bgolaszewski@baylibre.com> Cc: Kamal Dasu <kdasu.kdev@gmail.com> Cc: Lars-Peter Clausen <lars@metafoo.de> Cc: Thomas Gleixner <tglx@linutronix.de> Cc: Marc Zyngier <maz@kernel.org> Cc: Joerg Roedel <joro@8bytes.org> Cc: Mauro Carvalho Chehab <mchehab@kernel.org> Cc: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com> Cc: Jakub Kicinski <kuba@kernel.org> Cc: Wolfgang Grandegger <wg@grandegger.com> Cc: Andrew Lunn <andrew@lunn.ch> Cc: Vivien Didelot <vivien.didelot@gmail.com> Cc: Vladimir Oltean <olteanv@gmail.com> Cc: Bjorn Helgaas <bhelgaas@google.com> Cc: Kishon Vijay Abraham I <kishon@ti.com> Cc: Linus Walleij <linus.walleij@linaro.org> Cc: "Uwe Kleine-König" <u.kleine-koenig@pengutronix.de> Cc: Lee Jones <lee.jones@linaro.org> Cc: Ohad Ben-Cohen <ohad@wizery.com> Cc: Mathieu Poirier <mathieu.poirier@linaro.org> Cc: Paul Walmsley <paul.walmsley@sifive.com> Cc: Palmer Dabbelt <palmer@dabbelt.com> Cc: Albert Ou <aou@eecs.berkeley.edu> Cc: Alessandro Zummo <a.zummo@towertech.it> Cc: Alexandre Belloni <alexandre.belloni@bootlin.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Daniel Lezcano <daniel.lezcano@linaro.org> Cc: Wim Van Sebroeck <wim@linux-watchdog.org> Cc: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Rob Herring <robh@kernel.org> Acked-by: Marc Kleine-Budde <mkl@pengutronix.de> Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # for MMC Acked-by: Jassi Brar <jassisinghbrar@gmail.com> Acked-By: Vinod Koul <vkoul@kernel.org> Reviewed-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Reviewed-by: Arnaud Pouliquen <arnaud.pouliquen@st.com> Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Philipp Zabel <p.zabel@pengutronix.de> Acked-by: Wolfram Sang <wsa@kernel.org> # for I2C Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> Link: https://lore.kernel.org/r/20210615191543.1043414-1-robh@kernel.org
2021-06-12dt-bindings: thermal: tsens: Add compatible string to TSENS binding for SC7280Rajeshwari Ravindra Kamble1-0/+1
Adding compatible string in TSENS dt-bindings for SC7280. Signed-off-by: Rajeshwari Ravindra Kamble <rkambl@codeaurora.org> Reviewed-by: Matthias Kaehlcke <mka@chromium.org> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1620367641-23383-2-git-send-email-rkambl@codeaurora.org
2021-05-05Merge tag 'thermal-v5.13-rc1' of ↵Linus Torvalds5-53/+149
git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux Pull thermal updates from Daniel Lezcano: - Remove duplicate error message for the amlogic driver (Tang Bin) - Fix spellos in comments for the tegra and sun8i (Bhaskar Chowdhury) - Add the missing fifth node on the rcar_gen3 sensor (Niklas Söderlund) - Remove duplicate include in ti-bandgap (Zhang Yunkai) - Assign error code in the error path in the function thermal_of_populate_bind_params() (Jia-Ju Bai) - Fix spelling mistake in a comment 'disabed' -> 'disabled' (Colin Ian King) - Use the device name instead of auto-numbering for a better identification of the cooling device (Daniel Lezcano) - Improve a bit the division accuracy in the power allocator governor (Jeson Gao) - Enable the missing third sensor on msm8976 (Konrad Dybcio) - Add QCom tsens driver co-maintainer (Thara Gopinath) - Fix memory leak and use after free errors in the core code (Daniel Lezcano) - Add the MDM9607 compatible bindings (Konrad Dybcio) - Fix trivial spello in the copyright name for Hisilicon (Hao Fang) - Fix negative index array access when converting the frequency to power in the energy model (Brian-sy Yang) - Add support for Gen2 new PMIC support for Qcom SPMI (David Collins) - Update maintainer file for CPU cooling device section (Lukasz Luba) - Fix missing put_device on error in the Qcom tsens driver (Guangqing Zhu) - Add compatible DT binding for sm8350 (Robert Foss) - Add support for the MDM9607's tsens driver (Konrad Dybcio) - Remove duplicate error messages in thermal_mmio and the bcm2835 driver (Ruiqi Gong) - Add the Thermal Temperature Cooling driver (Zhang Rui) - Remove duplicate error messages in the Hisilicon sensor driver (Ye Bin) - Use the devm_platform_ioremap_resource_byname() function instead of a couple of corresponding calls (dingsenjie) - Sort the headers alphabetically in the ti-bandgap driver (Zhen Lei) - Add missing property in the DT thermal sensor binding (Rafał Miłecki) - Remove dead code in the ti-bandgap sensor driver (Lin Ruizhe) - Convert the BRCM DT bindings to the yaml schema (Rafał Miłecki) - Replace the thermal_notify_framework() call by a call to the thermal_zone_device_update() function. Remove the function as well as the corresponding documentation (Thara Gopinath) - Add support for the ipq8064-tsens sensor along with a set of cleanups and code preparation (Ansuel Smith) - Add a lockless __thermal_cdev_update() function to improve the locking scheme in the core code and governors (Lukasz Luba) - Fix multiple cooling device notification changes (Lukasz Luba) - Remove unneeded variable initialization (Colin Ian King) * tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (55 commits) thermal/drivers/mtk_thermal: Remove redundant initializations of several variables thermal/core/power allocator: Use the lockless __thermal_cdev_update() function thermal/core/fair share: Use the lockless __thermal_cdev_update() function thermal/core/fair share: Lock the thermal zone while looping over instances thermal/core/power_allocator: Update once cooling devices when temp is low thermal/core/power_allocator: Maintain the device statistics from going stale thermal/core: Create a helper __thermal_cdev_update() without a lock dt-bindings: thermal: tsens: Document ipq8064 bindings thermal/drivers/tsens: Add support for ipq8064-tsens thermal/drivers/tsens: Drop unused define for msm8960 thermal/drivers/tsens: Replace custom 8960 apis with generic apis thermal/drivers/tsens: Fix bug in sensor enable for msm8960 thermal/drivers/tsens: Use init_common for msm8960 thermal/drivers/tsens: Add VER_0 tsens version thermal/drivers/tsens: Convert msm8960 to reg_field thermal/drivers/tsens: Don't hardcode sensor slope Documentation: driver-api: thermal: Remove thermal_notify_framework from documentation thermal/core: Remove thermal_notify_framework iwlwifi: mvm: tt: Replace thermal_notify_framework dt-bindings: thermal: brcm,ns-thermal: Convert to the json-schema ...
2021-04-22dt-bindings: thermal: tsens: Document ipq8064 bindingsAnsuel Smith1-8/+48
Document the use of bindings used for msm8960 tsens based devices. msm8960 use the same gcc regs and is set as a child of the qcom gcc. Signed-off-by: Ansuel Smith <ansuelsmth@gmail.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210420183343.2272-10-ansuelsmth@gmail.com
2021-04-21dt-bindings: thermal: brcm,ns-thermal: Convert to the json-schemaRafał Miłecki2-37/+60
This helps validating DTS files. Signed-off-by: Rafał Miłecki <rafal@milecki.pl> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210420210104.10555-1-zajec5@gmail.com
2021-04-20dt-bindings: thermal: thermal-sensor: require "#thermal-sensor-cells"Rafał Miłecki1-0/+3
This property is required for every thermal sensor as it's used when using phandles. Signed-off-by: Rafał Miłecki <rafal@milecki.pl> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210415112121.4999-1-zajec5@gmail.com
2021-04-15dt-bindings: thermal: qcom-tsens: Add compatible for sm8350Robert Foss1-0/+1
Add tsens bindings for sm8350. Signed-off-by: Robert Foss <robert.foss@linaro.org> Reviewed-by: Vinod Koul <vkoul@kernel.org> Acked-by: Rob Herring <robh@kernel.org> Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210324124308.1265626-1-robert.foss@linaro.org
2021-04-15dt-bindings: tsens: qcom: Document MDM9607 compatibleKonrad Dybcio1-0/+2
Add the compatible for MDM9607. Signed-off-by: Konrad Dybcio <konrad.dybcio@somainline.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20210319220802.198215-1-konrad.dybcio@somainline.org
2021-03-24dt-bindings: Drop type references on common propertiesRob Herring1-1/+0
Users of common properties shouldn't have a type definition as the common schemas already have one. Drop all the unnecessary type references in the tree. A meta-schema update to catch these is pending. Cc: Maxime Ripard <mripard@kernel.org> Cc: Linus Walleij <linus.walleij@linaro.org> Cc: Bartosz Golaszewski <bgolaszewski@baylibre.com> Cc: Bjorn Andersson <bjorn.andersson@linaro.org> Cc: Krzysztof Kozlowski <krzk@kernel.org> Cc: "David S. Miller" <davem@davemloft.net> Cc: Jakub Kicinski <kuba@kernel.org> Cc: Ohad Ben-Cohen <ohad@wizery.com> Cc: Cheng-Yi Chiang <cychiang@chromium.org> Cc: Benson Leung <bleung@chromium.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Daniel Lezcano <daniel.lezcano@linaro.org> Cc: Stefan Wahren <wahrenst@gmx.net> Cc: Masahiro Yamada <yamada.masahiro@socionext.com> Cc: Odelu Kukatla <okukatla@codeaurora.org> Cc: linux-gpio@vger.kernel.org Cc: linux-pm@vger.kernel.org Cc: linux-can@vger.kernel.org Cc: netdev@vger.kernel.org Cc: linux-remoteproc@vger.kernel.org Cc: alsa-devel@alsa-project.org Cc: linux-usb@vger.kernel.org Signed-off-by: Rob Herring <robh@kernel.org> Acked-by: Dmity Baryshkov <dmitry.baryshkov@linaro.org> Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Suman Anna <s-anna@ti.com> Acked-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Acked-by: Marc Kleine-Budde <mkl@pengutronix.de> Reviewed-by: Srinivas Kandagatla <srinivas.kandagatla@linaro.org> Acked-by: Maxime Ripard <maxime@cerno.tech> Reviewed-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de> Link: https://lore.kernel.org/r/20210316194858.3527845-1-robh@kernel.org
2021-03-24dt-bindings: More cleanup of standard unit propertiesRob Herring1-1/+0
Properties with standard unit suffixes already have a type and don't need type references. Fix a few more cases which have gotten added. Cc: Bjorn Andersson <bjorn.andersson@linaro.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Daniel Lezcano <daniel.lezcano@linaro.org> Cc: Linus Walleij <linus.walleij@linaro.org> Cc: Kevin Tsai <ktsai@capellamicro.com> Cc: linux-iio@vger.kernel.org Cc: linux-input@vger.kernel.org Cc: linux-pm@vger.kernel.org Signed-off-by: Rob Herring <robh@kernel.org> Acked-by: Dmity Baryshkov <dmitry.baryshkov@linaro.org> Acked-by: Mark Brown <broonie@kernel.org> Reviewed-by: Luca Ceresoli <luca@lucaceresoli.net> Acked-by: Sebastian Reichel <sre@kernel.org> Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> Link: https://lore.kernel.org/r/20210316194824.3526913-1-robh@kernel.org
2021-03-10dt-bindings: thermal: rcar-gen3-thermal: Support five TSC nodes on r8a779a0Niklas Söderlund1-8/+35
When adding support for V3U (r8a779a0) it was incorrectly recorded it supports four nodes, while in fact it supports five. The fifth node is named TSC0 and breaks the existing naming schema starting at 1. Work around this by separately defining the reg property for V3U and others. Restore the maximum number of nodes to three for other compatibles as it was before erroneously increasing it for V3U. Fixes: d7fdfb6541f3be88 ("dt-bindings: thermal: rcar-gen3-thermal: Add r8a779a0 support") Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210310110716.3297544-1-niklas.soderlund+renesas@ragnatech.se
2021-02-22Merge tag 'devicetree-for-5.12' of ↵Linus Torvalds1-6/+6
git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux Pull devicetree updates from Rob Herring: - Sync dtc to upstream version v1.6.0-51-g183df9e9c2b9 and build host fdtoverlay - Add kbuild support to build DT overlays (%.dtbo) - Drop NULLifying match table in of_match_device(). In preparation for this, there are several driver cleanups to use (of_)?device_get_match_data(). - Drop pointless wrappers from DT struct device API - Convert USB binding schemas to use graph schema and remove old plain text graph binding doc - Convert spi-nor and v3d GPU bindings to DT schema - Tree wide schema fixes for if/then schemas, array size constraints, and undocumented compatible strings in examples - Handle 'no-map' correctly for already reserved memblock regions * tag 'devicetree-for-5.12' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (35 commits) driver core: platform: Drop of_device_node_put() wrapper of: Remove of_dev_{get,put}() dt-bindings: usb: Change descibe to describe in usbmisc-imx.txt dt-bindings: can: rcar_canfd: Group tuples in pin control properties dt-bindings: power: renesas,apmu: Group tuples in cpus properties dt-bindings: mtd: spi-nor: Convert to DT schema format dt-bindings: Use portable sort for version cmp dt-bindings: ethernet-controller: fix fixed-link specification dt-bindings: irqchip: Add node name to PRUSS INTC dt-bindings: interconnect: Fix the expected number of cells dt-bindings: Fix errors in 'if' schemas dt-bindings: iommu: renesas,ipmmu-vmsa: Make 'power-domains' conditionally required dt-bindings: Fix undocumented compatible strings in examples kbuild: Add support to build overlays (%.dtbo) scripts: dtc: Remove the unused fdtdump.c file scripts: dtc: Build fdtoverlay tool scripts/dtc: Update to upstream version v1.6.0-51-g183df9e9c2b9 scripts: dtc: Fetch fdtoverlay.c from external DTC project dt-bindings: thermal: sun8i: Fix misplaced schema keyword in compatible strings dt-bindings: iio: dac: Fix AD5686 references ...
2021-02-15dt-bindings: thermal: qcom: add adc-thermal monitor bindingsDmitry Baryshkov1-0/+153
Add bindings for thermal monitor, part of Qualcomm PMIC5 chips. It is a close counterpart of VADC part of those PMICs. Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210205000118.493610-2-dmitry.baryshkov@linaro.org
2021-02-04dt-bindings: thermal: sun8i: Fix misplaced schema keyword in compatible stringsRob Herring1-6/+6
A compatible string 'enum' mistakenly has 'const: ' in the compatible strings. Remove these. Fixes: 0b28594d67a8 ("dt-bindings: thermal: Add YAML schema for sun8i-thermal driver bindings") Cc: Vasily Khoruzhick <anarsoul@gmail.com> Cc: Yangtao Li <tiny.windzz@gmail.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Daniel Lezcano <daniel.lezcano@linaro.org> Cc: Amit Kucheria <amitk@kernel.org> Cc: Maxime Ripard <mripard@kernel.org> Cc: Chen-Yu Tsai <wens@csie.org> Cc: Jernej Skrabec <jernej.skrabec@siol.net> Cc: linux-pm@vger.kernel.org Signed-off-by: Rob Herring <robh@kernel.org> Acked-by: Maxime Ripard <mripard@kernel.org> Link: https://lore.kernel.org/r/20210202181538.3936235-1-robh@kernel.org
2021-02-03thermal/drivers/zx: Remove zx driverArnd Bergmann1-116/+0
The zte zx platform is getting removed, so this driver is no longer needed. Cc: Jun Nie <jun.nie@linaro.org> Cc: Shawn Guo <shawnguo@kernel.org> Signed-off-by: Arnd Bergmann <arnd@arndb.de> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210120162400.4115366-3-arnd@kernel.org
2021-02-03thermal/drivers/tango: Remove tango driverArnd Bergmann1-17/+0
The tango platform is getting removed, so the driver is no longer needed. Cc: Marc Gonzalez <marc.w.gonzalez@free.fr> Cc: Mans Rullgard <mans@mansr.com> Signed-off-by: Arnd Bergmann <arnd@arndb.de> Acked-by: Mans Rullgard <mans@mansr.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210120162400.4115366-2-arnd@kernel.org
2020-12-08dt-bindings: thermal: rcar-gen3-thermal: Add r8a779a0 supportNiklas Söderlund1-2/+15
Add support for R-Car V3U. The V3U IP differs a bit from its siblings in such way that it have 4 TSC nodes and the interrupts are not routed to the INTC-AP but to the ECM. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20201126223028.3119044-2-niklas.soderlund+renesas@ragnatech.se
2020-11-12dt-bindings: thermal: rcar-thermal: Improve schema validationGeert Uytterhoeven1-19/+29
- Factor out common required properties, - "interrupts", "clocks", and "power-domains" are required on R-Mobile APE6, too, - Invert logic to simplify descriptions. Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Niklas Söderlund <niklas.soderlund@ragnatech.se> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20201028153541.1736279-1-geert+renesas@glider.be
2020-10-27dt-bindings: thermal: mediatek: add documentation for MT8516 SoCFabien Parent1-0/+1
Add binding documentation for the MediaTek MT8516 SoC. The SoC thermal IP is similar to MT2701. Signed-off-by: Fabien Parent <fparent@baylibre.com> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20201021164231.3029956-2-fparent@baylibre.com
2020-10-27dt-bindings: thermal: mediatek: make resets property optionalFabien Parent1-1/+1
MT8516 Thermal IP does not support reset. Make the resets property optional in order to be able to support MT8516 SoC. Signed-off-by: Fabien Parent <fparent@baylibre.com> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20201021164231.3029956-1-fparent@baylibre.com
2020-10-17Merge tag 'thermal-v5.10-rc1' of ↵Linus Torvalds2-1/+6
git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux Pull thermal updates from Daniel Lezcano: - Fix Kconfig typo "acces" -> "access" (Colin Ian King) - Use dev_error_probe() to simplify the error handling on imx and imx8 platforms (Anson Huang) - Use dedicated kobj_to_dev() instead of container_of() in the sysfs core code (Tian Tao) - Fix coding style by adding braces to a one line conditional statement on rcar (Geert Uytterhoeven) - Add DT binding documentation for the r8a774e1 platform and update the Kconfig description supporting RZ/G2 SoCs (Lad Prabhakar) - Simplify the return expression of stm_thermal_prepare on the stm32 platform (Qinglang Miao) - Fix the unit in the function documentation for the idle injection cooling device (Zhuguang Qing) - Remove an unecessary mutex_init() in the core code (Qinglang Miao) - Add support for keep alive events in the core code and the specific int340x (Srinivas Pandruvada) - Remove unused thermal zone variable in devfreq and cpufreq cooling devices (Zhuguang Qing) - Add the A100's THS controller support (Yangtao Li) - Add power management on the omap3's bandgap sensor (Adam Ford) - Fix a missing nlmsg_free in the netlink core error path (Jing Xiangfeng) * tag 'thermal-v5.10-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: thermal: core: Adding missing nlmsg_free() in thermal_genl_sampling_temp() thermal: ti-soc-thermal: Enable addition power management thermal: sun8i: Add A100's THS controller support thermal: sun8i: add TEMP_CALIB_MASK for calibration data in sun50i_h6_ths_calibrate dt-bindings: thermal: sun8i: Add binding for A100's THS controller thermal: cooling: Remove unused variable *tz thermal: int340x: Add keep alive response method thermal: core: Add new event for sending keep alive notifications thermal: int340x: Provide notification for OEM variable change thermal: core: remove unnecessary mutex_init() thermal/idle_inject: Fix comment of idle_duration_us and name of latency_ns thermal: Kconfig: Update description for RCAR_GEN3_THERMAL config thermal: stm32: simplify the return expression of stm_thermal_prepare() dt-bindings: thermal: rcar-gen3-thermal: Add r8a774e1 support thermal: rcar_thermal: Add missing braces to conditional statement thermal: Use kobj_to_dev() instead of container_of() thermal: imx8mm: Use dev_err_probe() to simplify error handling thermal: imx: Use dev_err_probe() to simplify error handling drivers: thermal: Kconfig: fix spelling mistake "acces" -> "access"
2020-10-12dt-bindings: thermal: sun8i: Add binding for A100's THS controllerYangtao Li1-1/+5
Add a binding for A100's ths controller. Signed-off-by: Yangtao Li <frank@allwinnertech.com> Reviewed-by: Rob Herring <robh@kernel.org> Acked-by: Maxime Ripard <mripard@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/8280af8ad82ed340c0ef1c171684aaad91600679.1595572867.git.frank@allwinnertech.com
2020-10-12dt-bindings: thermal: rcar-gen3-thermal: Add r8a774e1 supportLad Prabhakar1-0/+1
Document RZ/G2H (R8A774E1) SoC bindings. Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1594811350-14066-3-git-send-email-prabhakar.mahadev-lad.rj@bp.renesas.com
2020-10-07dt-bindings: Explicitly allow additional properties in common schemasRob Herring2-0/+4
In order to add meta-schema checks for additional/unevaluatedProperties being present, all schema need to make this explicit. As common/shared schema are included by other schemas, they should always allow for additionalProperties. Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Krzysztof Kozlowski <krzk@kernel.org> Acked-by: Sebastian Reichel <sre@kernel.org> Acked-by: Chanwoo Choi <cw00.choi@samsung.com> Acked-By: Vinod Koul <vkoul@kernel.org> Acked-by: Lee Jones <lee.jones@linaro.org> Acked-by: Geert Uytterhoeven <geert+renesas@glider.be> Acked-by: Srinivas Kandagatla <srinivas.kandagatla@linaro.org> Acked-by: Ulf Hansson <ulf.hansson@linaro.org> Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> Acked-by: Guenter Roeck <linux@roeck-us.net> Link: https://lore.kernel.org/r/20201005183830.486085-5-robh@kernel.org Signed-off-by: Rob Herring <robh@kernel.org>
2020-10-06dt-bindings: Another round of adding missing 'additionalProperties'Rob Herring4-0/+13
Another round of wack-a-mole. The json-schema default is additional unknown properties are allowed, but for DT all properties should be defined. Cc: Linus Walleij <linus.walleij@linaro.org> Cc: Stephen Boyd <sboyd@kernel.org> Cc: Shawn Guo <shawnguo@kernel.org> Cc: Bjorn Andersson <bjorn.andersson@linaro.org> Cc: Baolin Wang <baolin.wang7@gmail.com> Cc: Mauro Carvalho Chehab <mchehab@kernel.org> Cc: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com> Cc: "David S. Miller" <davem@davemloft.net> Cc: Bjorn Helgaas <bhelgaas@google.com> Cc: Liam Girdwood <lgirdwood@gmail.com> Cc: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Guenter Roeck <linux@roeck-us.net> Reviewed-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Acked-By: Vinod Koul <vkoul@kernel.org> Acked-by: Lee Jones <lee.jones@linaro.org> Acked-by: Ulf Hansson <ulf.hansson@linaro.org> Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> # for iio Acked-by: Thierry Reding <treding@nvidia.com> Acked-by: Mark Brown <broonie@kernel.org> Reviewd-by: Corey Minyard <cminyard@mvista.com> Acked-by: Pavel Machek <pavel@ucw.cz> Acked-by: Sebastian Reichel <sre@kernel.org> Link: https://lore.kernel.org/r/20201002234143.3570746-1-robh@kernel.org Signed-off-by: Rob Herring <robh@kernel.org>
generated by cgit v1.2.3 (git 2.39.0) at 2024-09-15 01:53:41 +0300