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This patch adds support for the Wave521cl on the J784S4-evm.
Signed-off-by: Brandon Brnich <b-brnich@ti.com>
Link: https://lore.kernel.org/r/20240220191413.3355007-2-b-brnich@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
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Modify license to include dual licensing as GPL-2.0-only OR MIT
license for SoC and TI evm device tree files. This allows for Linux
kernel device tree to be used in other Operating System ecosystems
such as Zephyr or FreeBSD.
While at this, update the GPL-2.0 to be GPL-2.0-only to be in sync
with latest SPDX conventions (GPL-2.0 is deprecated).
While at this, update the TI copyright year to sync with current year
to indicate license change (and add it at least for one file which was
missing TI copyright).
Cc: Apelete Seketeli <aseketeli@baylibre.com>
Cc: Jerome Neanne <jneanne@baylibre.com>
Cc: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Cc: Tony Lindgren <tony@atomide.com>
Acked-by: Tony Lindgren <tony@atomide.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Nishanth Menon <nm@ti.com>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20240122145539.194512-11-nm@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
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bootph-all as phase tag was added to dt-schema
(dtschema/schemas/bootph.yaml) to cover U-Boot challenges with DT.
That's why add it also to Linux to be aligned with bootloader requirement.
On TI K3 J784S4 SoC, only secure_proxy_mcu and secure_proxy_sa3 nodes are
exclusively used by R5 bootloader, rest of the dts nodes with bootph-* are
used by later boot stages also.
And secure_proxy_mcu and secure_proxy_sa3 are disabled in kernel device
tree, and will be only enabled in R5 bootloader device tree.
So, bootph-pre-ram for secure_proxy_mcu and secure_proxy_sa3 will be
added in R5 bootloader device tree only.
Add bootph-all for all other nodes that are used in the bootloader on
K3 J784S4 SoC, and bootph-pre-ram is not needed specifically for any node
in kernel dts.
Signed-off-by: Apurva Nandan <a-nandan@ti.com>
Reviewed-by: Udit Kumar <u-kumar1@ti.com>
Link: https://lore.kernel.org/r/20230811192030.3480616-2-a-nandan@ti.com
Signed-off-by: Nishanth Menon <nm@ti.com>
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Looks like a couple of http:// links crept in. Use https instead.
While at it, drop unicode encoded character.
Signed-off-by: Nishanth Menon <nm@ti.com>
Link: https://lore.kernel.org/r/20230417225450.1182047-1-nm@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
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VTM stands for Voltage Thermal Management. Add the thermal zones.
Seven sensors mapping to seven thermal zones. Main0, Main1, Main2, Main3,
Main4, WKUP1 & WKUP2 domains respectively.
Signed-off-by: Keerthy <j-keerthy@ti.com>
[bb@ti.com: rebased on v6.3-rc1]
Signed-off-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20230405215328.3755561-5-bb@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
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The DTS uses hardware register values directly in pin controller pin
configuration and not an abstraction of any form.
These definitions were previously put in the bindings header to avoid
code duplication and to provide some context meaning (name), but they
do not fit the purpose of bindings.
Store the constants in a header next to DTS and use them instead of
bindings.
Suggested-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Suggested-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Link: https://lore.kernel.org/all/c4d53e9c-dac0-8ccc-dc86-faada324beba@linaro.org/
Link: https://lore.kernel.org/r/20230315155228.1566883-3-nm@ti.com
Signed-off-by: Nishanth Menon <nm@ti.com>
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The J784S4 SoC belongs to the K3 Multicore SoC architecture
platform, providing advanced system integration in automotive,
ADAS and industrial applications requiring AI at the network edge.
This SoC extends the K3 Jacinto 7 family of SoCs with focus on
raising performance and integration while providing interfaces,
memory architecture and compute performance for multi-sensor, high
concurrency applications.
Some highlights of this SoC are:
* Up to 8 Cortex-A72s, four clusters of lockstep capable dual Cortex-R5F
MCUs, 4 C7x floating point vector DSPs with Matrix Multiply Accelerator
(MMA) for deep learning and CNN.
* 3D GPU: Automotive grade IMG BXS-4-64
* Vision Processing Accelerator (VPAC) with image signal processor and
Depth and Motion Processing Accelerator (DMPAC)
* Three CSI2.0 4L RX plus two CSI2.0 4L TX, two DSI Tx, one eDP/DP and one
DPI interface.
* Integrated gigabit ethernet switch, up to 8 ports (TDA4VH), two ports
support 10Gb USXGMII; Two 4 lane PCIe-GEN3 controllers, USB3.0 Dual-role
device subsystems, Up to 20 MCANs, among other peripherals.
See J784S4 Technical Reference Manual (SPRUJ52 - JUNE 2022)
for further details: http://www.ti.com/lit/zip/spruj52
Signed-off-by: Hari Nagalla <hnagalla@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Apurva Nandan <a-nandan@ti.com>
Reviewed-by: Vaishnav Achath <vaishnav.a@ti.com>
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Link: https://lore.kernel.org/r/20230112142725.77785-4-a-nandan@ti.com
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