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2020-01-27thermal: exynos: Rename Samsung and Exynos to lowercaseKrzysztof Kozlowski1-1/+1
Fix up inconsistent usage of upper and lowercase letters in "Samsung" and "Exynos" names. "SAMSUNG" and "EXYNOS" are not abbreviations but regular trademarked names. Therefore they should be written with lowercase letters starting with capital letter. The lowercase "Exynos" name is promoted by its manufacturer Samsung Electronics Co., Ltd., in advertisement materials and on website. Although advertisement materials usually use uppercase "SAMSUNG", the lowercase version is used in all legal aspects (e.g. on Wikipedia and in privacy/legal statements on https://www.samsung.com/semiconductor/privacy-global/). Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200104152107.11407-7-krzk@kernel.org
2018-10-15dt-bindings: thermal: samsung: Add SPDX license identifierKrzysztof Kozlowski1-11/+1
Replace GPL license statement with SPDX license identifier (GPL-2.0+). Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org> Signed-off-by: Rob Herring <robh@kernel.org>
2015-01-25thermal: exynos: Provide thermal_exynos.h file to be included in device tree ↵Lukasz Majewski1-0/+28
files This patch is a preparatory patch to be able to read Exynos thermal configuration from the device tree. It turned out that DTC is not able to interpret enums properly and hence it is necessary to #define those values explicitly. For this reason the ./include/dt-bindings/thermal/thermal_exynos.h file has been introduced. Signed-off-by: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>