Age | Commit message (Collapse) | Author | Files | Lines | |
---|---|---|---|---|---|
2012-03-02 | usb: dwc3: Add Exynos Specific Glue layer | Anton Tikhomirov | 1 | -0/+24 | |
Adds Exynos Specific Glue layer to support USB peripherals on Samsung Exynos5 chips. [ balbi@ti.com : prevent compilation of Exynos glue layer on platforms which don't provide clk API implementation ] Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com> Signed-off-by: Felipe Balbi <balbi@ti.com> |