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authorKapileshwar Singh <kapileshwar.singh@arm.com>2015-02-18 19:04:21 +0300
committerEduardo Valentin <edubezval@gmail.com>2015-05-05 07:27:50 +0300
commit6cd9e9f629f11b9412d4e9aa294c029dbb36b3cf (patch)
tree33ef735ad3704b0596eab47e24a22853ca9c31a1 /Documentation/thermal
parent5ebe6afaf0057ac3eaeb98defd5456894b446d22 (diff)
downloadlinux-6cd9e9f629f11b9412d4e9aa294c029dbb36b3cf.tar.xz
thermal: of: fix cooling device weights in device tree
Currently you can specify the weight of the cooling device in the device tree but that information is not populated to the thermal_bind_params where the fair share governor expects it to be. The of thermal zone device doesn't have a thermal_bind_params structure and arguably it's better to pass the weight inside the thermal_instance as it is specific to the bind of a cooling device to a thermal zone parameter. Core thermal code is fixed to populate the weight in the instance from the thermal_bind_params, so platform code that was passing the weight inside the thermal_bind_params continue to work seamlessly. While we are at it, create a default value for the weight parameter for those thermal zones that currently don't define it and remove the hardcoded default in of-thermal. Cc: Zhang Rui <rui.zhang@intel.com> Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net> Cc: Len Brown <lenb@kernel.org> Cc: Peter Feuerer <peter@piie.net> Cc: Darren Hart <dvhart@infradead.org> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Kukjin Kim <kgene@kernel.org> Cc: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Diffstat (limited to 'Documentation/thermal')
-rw-r--r--Documentation/thermal/sysfs-api.txt4
1 files changed, 3 insertions, 1 deletions
diff --git a/Documentation/thermal/sysfs-api.txt b/Documentation/thermal/sysfs-api.txt
index 87519cb379ee..7ec632ed9769 100644
--- a/Documentation/thermal/sysfs-api.txt
+++ b/Documentation/thermal/sysfs-api.txt
@@ -95,7 +95,7 @@ temperature) and throttle appropriate devices.
1.3 interface for binding a thermal zone device with a thermal cooling device
1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
int trip, struct thermal_cooling_device *cdev,
- unsigned long upper, unsigned long lower);
+ unsigned long upper, unsigned long lower, unsigned int weight);
This interface function bind a thermal cooling device to the certain trip
point of a thermal zone device.
@@ -110,6 +110,8 @@ temperature) and throttle appropriate devices.
lower:the Minimum cooling state can be used for this trip point.
THERMAL_NO_LIMIT means no lower limit,
and the cooling device can be in cooling state 0.
+ weight: the influence of this cooling device in this thermal
+ zone. See 1.4.1 below for more information.
1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
int trip, struct thermal_cooling_device *cdev);