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authorMiquel Raynal <miquel.raynal@bootlin.com>2024-03-15 14:00:45 +0300
committerMiquel Raynal <miquel.raynal@bootlin.com>2024-03-15 14:00:45 +0300
commit09888e973cc9d3615dbab5d178eecb58d8a0b7ab (patch)
treef2728f4e4fd45f7ab5d9fed920f87724598e812e /include/dt-bindings
parent2842dc9bc1a53893eec62ec9e49beb3b501702d0 (diff)
parent4120aa0e3961f68f1f8cfe6b4c3c809ffea31fdc (diff)
downloadlinux-09888e973cc9d3615dbab5d178eecb58d8a0b7ab.tar.xz
Merge tag 'nand/for-6.9' into mtd/next
Raw NAND The main series brought is an update of the Broadcom support to support all BCMBCA SoCs and their specificity (ECC, write protection, configuration straps), plus a few misc fixes and changes in the main driver. Device tree updates are also part of this PR, initially because of a misunderstanding on my side. The STM32_FMC2 controller driver is also upgraded to properly support MP1 and MP25 SoCs. A new compatible is added for an Atmel flavor. Among all these feature changes, there is as well a load of continuous read related fixes, avoiding more corner conditions and clarifying the logic. Finally a few miscellaneous fixes are made to the core, the lpx32xx_mlc, fsl_lbc, Meson and Atmel controller driver, as well as final one in the Hynix vendor driver. SPI-NAND The ESMT support has been extended to match 5 bytes ID to avoid collisions. Winbond support on its side receives support for W25N04KV chips.
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