diff options
author | Anton Tikhomirov <av.tikhomirov@samsung.com> | 2012-02-15 12:04:56 +0400 |
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committer | Felipe Balbi <balbi@ti.com> | 2012-03-02 14:11:28 +0400 |
commit | d28a9689c93195d39f91f35a9519876688605b65 (patch) | |
tree | 39d7c0b3f80657039cefc3996c20010bdbabbed0 /include | |
parent | f6bafc6a1c9d58f0c234ac5052b9c09b0747348c (diff) | |
download | linux-d28a9689c93195d39f91f35a9519876688605b65.tar.xz |
usb: dwc3: Add Exynos Specific Glue layer
Adds Exynos Specific Glue layer to support USB peripherals
on Samsung Exynos5 chips.
[ balbi@ti.com : prevent compilation of Exynos glue layer
on platforms which don't provide clk API implementation ]
Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
Diffstat (limited to 'include')
-rw-r--r-- | include/linux/platform_data/dwc3-exynos.h | 24 |
1 files changed, 24 insertions, 0 deletions
diff --git a/include/linux/platform_data/dwc3-exynos.h b/include/linux/platform_data/dwc3-exynos.h new file mode 100644 index 000000000000..5eb7da9b3772 --- /dev/null +++ b/include/linux/platform_data/dwc3-exynos.h @@ -0,0 +1,24 @@ +/** + * dwc3-exynos.h - Samsung EXYNOS DWC3 Specific Glue layer, header. + * + * Copyright (c) 2012 Samsung Electronics Co., Ltd. + * http://www.samsung.com + * + * Author: Anton Tikhomirov <av.tikhomirov@samsung.com> + * + * This program is free software; you can redistribute it and/or modify + * it under the terms of the GNU General Public License as published by + * the Free Software Foundation; either version 2 of the License, or + * (at your option) any later version. + */ + +#ifndef _DWC3_EXYNOS_H_ +#define _DWC3_EXYNOS_H_ + +struct dwc3_exynos_data { + int phy_type; + int (*phy_init)(struct platform_device *pdev, int type); + int (*phy_exit)(struct platform_device *pdev, int type); +}; + +#endif /* _DWC3_EXYNOS_H_ */ |