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In comparison to other Amlogic chips, there is one key difference.
The offset for the sec_ao base, also known as u_efuse_off, is special,
while other aspects remain the same.
Signed-off-by: Dmitry Rokosov <ddrokosov@salutedevices.com>
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240328191322.17551-3-ddrokosov@salutedevices.com
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This macro has the advantage over SIMPLE_DEV_PM_OPS that we don't have to
care about when the functions are actually used, so the corresponding
__maybe_unused can be dropped.
Also make use of pm_ptr() to discard all PM related stuff if CONFIG_PM
isn't enabled.
Signed-off-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231116112633.668826-3-u.kleine-koenig@pengutronix.de
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amlogic_thermal_disable() returned zero unconditionally and
amlogic_thermal_remove() already ignores the return value.
Make it return no value and modify amlogic_thermal_suspend to not check
the value.
This patch introduces no semantic changes, but makes it more obvious for
a human reader that amlogic_thermal_suspend() cannot fail.
Signed-off-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231116112633.668826-2-u.kleine-koenig@pengutronix.de
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The .remove() callback for a platform driver returns an int which makes
many driver authors wrongly assume it's possible to do error handling by
returning an error code. However the value returned is ignored (apart
from emitting a warning) and this typically results in resource leaks.
To improve here there is a quest to make the remove callback return
void. In the first step of this quest all drivers are converted to
.remove_new(), which already returns void. Eventually after all drivers
are converted, .remove_new() will be renamed to .remove().
amlogic_thermal_disable() always returned zero. Change it to return no
value and then trivially convert the driver to .remove_new() and fix a
whitespace inconsitency en passant.
Signed-off-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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The DT of_device.h and of_platform.h date back to the separate
of_platform_bus_type before it as merged into the regular platform bus.
As part of that merge prepping Arm DT support 13 years ago, they
"temporarily" include each other. They also include platform_device.h
and of.h. As a result, there's a pretty much random mix of those include
files used throughout the tree. In order to detangle these headers and
replace the implicit includes with struct declarations, users need to
explicitly include the correct includes.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Reviewed-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-3-frank.li@vivo.com
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Replace the open-code with dev_err_probe() to simplify the code.
Signed-off-by: Ye Xingchen <ye.xingchen@zte.com.cn>
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/202303241020110014476@zte.com.cn
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The devres variant of thermal_add_hwmon_sysfs() only takes the thermal
zone structure pointer as parameter.
Actually, it uses the tz->device to add it in the devres list.
It is preferable to use the device registering the thermal zone
instead of the thermal zone device itself. That prevents the driver
accessing the thermal zone structure internals and it is from my POV
more correct regarding how devm_ is used.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com> #amlogic_thermal
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Use the devdata accessor introduced in the previous patch.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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As the name states "thermal_core.h" is the header file for the core
components of the thermal framework.
Too many drivers are including it. Hopefully the recent cleanups
helped to self encapsulate the code a bit more and prevented the
drivers to need this header.
Remove this inclusion in every place where it is possible.
Some other drivers did a confusion with the core header and the one
exported in linux/thermal.h. They include the former instead of the
latter. The changes also fix this.
The tegra/soctherm driver still remains as it uses an internal
function which need to be replaced.
The Intel HFI driver uses the netlink internal framework core and
should be changed to prevent to deal with the internals.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # armada_thermal.c
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> # uniphier_thermal.c
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> # rcar_gen3_thermal.c
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> # amlogic_thermal.c
Acked-by: Florian Fainelli <f.fainelli@gmail.com> # bcm2835_thermal.c
Acked-by: Thierry Reding <treding@nvidia.com> # tegra30-tsensor.c
Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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The thermal OF code has a new API allowing to migrate the OF
initialization to a simpler approach. The ops are no longer device
tree specific and are the generic ones provided by the core code.
Convert the ops to the thermal_zone_device_ops format and use the new
API to register the thermal zone with these generic ops.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220804224349.1926752-14-daniel.lezcano@linexp.org
Reviewed-by: Neil Armstrong <narmstrong@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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The function devm_platform_ioremap_resource has already contains error
message, so remove the redundant dev_err here.
Signed-off-by: Tang Bin <tangbin@cmss.chinamobile.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210222061105.6008-1-tangbin@cmss.chinamobile.com
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Many monitoring tools read the CPU temperature using the hwmon
interface. Expose the thermal sensors on Amlogic boards as hwmon
devices.
Without this lm_sensors' "sensors" tool does not find any temperature
sensors. Now it prints:
cpu_thermal-virtual-0
Adapter: Virtual device
temp1: +44.7 C (crit = +110.0 C)
ddr_thermal-virtual-0
Adapter: Virtual device
temp1: +45.9 C (crit = +110.0 C)
Signed-off-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Reviewed-by: Neil Armstrong <narmstrong@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201115190658.631578-1-martin.blumenstingl@googlemail.com
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Fix up the following warning when compiled with make W=1:
linux.git/drivers/thermal/amlogic_thermal.c:78: warning: Function parameter or member 'A' not described in 'amlogic_thermal_soc_calib_data'
linux.git/drivers/thermal/amlogic_thermal.c:78: warning: Function parameter or member 'B' not described in 'amlogic_thermal_soc_calib_data'
linux.git/drivers/thermal/amlogic_thermal.c:78: warning: Function parameter or member 'm' not described in 'amlogic_thermal_soc_calib_data'
linux.git/drivers/thermal/amlogic_thermal.c:78: warning: Function parameter or member 'n' not described in 'amlogic_thermal_soc_calib_data'
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/139c9191f1a18d528b5f94376facf40291d28244.1574242756.git.amit.kucheria@linaro.org
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Amlogic G12A and G12B SoCs integrate two thermal sensors
with the same design. One is located close to the DDR controller
and the other one is located close to the PLLs (between the CPU and GPU).
The calibration data for each of the thermal sensors instance is stored
in a different location within the AO region.
Implement reading the temperature from each thermal sensor.
The IP block has more functionality, which may be added to this driver
in the future:
- chip reset when the temperature exceeds a configurable threshold
- up to four interrupts when the temperature has risen above a
configurable threshold
- up to four interrupts when the temperature has fallen below a
configurable threshold
Tested-by: Christian Hewitt <christianshewitt@gmail.com>
Tested-by: Kevin Hilman <khilman@baylibre.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Guillaume La Roque <glaroque@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191004090114.30694-3-glaroque@baylibre.com
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