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2023-11-01Merge tag 'thermal-6.7-rc1' of ↵Linus Torvalds2-10/+2
git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm Pull thermal control updates from Rafael Wysocki: "These further rework the ACPI thermal driver, after the changes made to it in the previous cycle, to make it easier to grasp, get rid of redundant pieces of internal data structures and eliminate its reliance on a specific ordering of trip point objects in the thermal core, make thermal core adjustments needed for the ACPI thermal driver rework, modify the thermal governor interface so as to use trip pointers for representing trip points in it, switch over multiple thermal drivers to using void platform driver remove callbacks, add support for 2 hardware features to the Intel int340x thermal driver, add support for new hardware on ARM platforms, update documentation, fix problems, clean up code and update the MAINTAINERS record for thermal control. Specifics: - Untangle the initialization and updates of passive and active trip points in the ACPI thermal driver (Rafael Wysocki) - Reduce code duplication related to the initialization and updates of trip points in the ACPI thermal driver (Rafael Wysocki) - Use trip pointers for cooling device binding in the ACPI thermal driver (Rafael Wysocki) - Simplify critical and hot trips representation in the ACPI thermal driver (Rafael Wysocki) - Use trip pointers in thermal governors and in the related part of the thermal core (Rafael Wysocki) - Drop the trips_disabled bitmask that has become redundant from the thermal core (Rafael Wysocki) - Avoid updating trip points when the thermal zone temperature falls into a trip point's hysteresis range (ícolas F. R. A. Prado) - Add power floor notifications support to the int340x thermal control driver (Srinivas Pandruvada) - Rework updating trip points in the int340x thermal driver so that it does not access thermal zone internals directly (Rafael Wysocki) - Use param_get_byte() instead of param_get_int() as the max_idle module parameter .get() callback in the Intel powerclamp thermal driver to avoid possible out-of-bounds access (David Arcari) - Add workload hints support to the int340x thermal driver (Srinivas Pandruvada) - Add support for Mediatek LVTS MT8192 along with suspend/resume routines (Balsam Chihi) - Fix probe for THERMAL_V2 in the Mediatek LVTS driver (Markus Schneider-Pargmann) - Remove duplicate error message from the max76620 driver when thermal_of_zone_register() fails (Thierry Reding) - Add i.MX7D compatible bindings to fix a warning from dtbs_check for the imx6ul platform (Alexander Stein) - Add sa8775p compatible to the QCom tsens driver (Priyansh Jain) - Fix error check in lvts_debugfs_init() to be against PTR_ERR() in the LVTS Mediatek driver (Minjie Du) - Remove unused variable in thermal/tools (Kuan-Wei Chiu) - Document the imx8dl thermal sensor (Fabio Estevam) - Add variable names in callback prototypes to prevent warning from checkpatch.pl in the imx8mm driver (Bragatheswaran Manickavel) - Add missing unevaluatedProperties on child node schemas for tegra124 (Rob Herring) - Add mt7988 support to the Mediatek LVTS driver (Frank Wunderlich)" * tag 'thermal-6.7-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (111 commits) thermal: ACPI: Include the right header file thermal: core: Don't update trip points inside the hysteresis range thermal: core: Pass trip pointer to governor throttle callback thermal: gov_step_wise: Fold update_passive_instance() into its caller thermal: gov_power_allocator: Use trip pointers instead of trip indices thermal: gov_fair_share: Rearrange get_trip_level() thermal: trip: Define for_each_trip() macro thermal: trip: Simplify computing trip indices thermal/qcom/tsens: Drop ops_v0_1 thermal/drivers/mediatek/lvts_thermal: Update calibration data documentation thermal/drivers/mediatek/lvts_thermal: Add mt8192 support thermal/drivers/mediatek/lvts_thermal: Add suspend and resume dt-bindings: thermal: mediatek: Add LVTS thermal controller definition for mt8192 thermal/drivers/mediatek: Fix probe for THERMAL_V2 thermal/drivers/max77620: Remove duplicate error message dt-bindings: timer: add imx7d compatible dt-bindings: net: microchip: Allow nvmem-cell usage dt-bindings: imx-thermal: Add #thermal-sensor-cells property dt-bindings: thermal: tsens: Add sa8775p compatible thermal/drivers/mediatek/lvts_thermal: Fix error check in lvts_debugfs_init() ...
2023-10-19thermal/qcom/tsens: Drop ops_v0_1Dmitry Baryshkov1-6/+0
Since the commit 6812d1dfbca9 ("thermal/drivers/qcom/tsens-v0_1: Fix mdm9607 slope values") the default v0.1 implementation of tsens options is unused by the driver. Drop it now to stop compiler complaining about the unused static const. If it appears there is the need for the default v0.1 ops struct, this commit can be easily reverted without further considerations. Fixes: 6812d1dfbca9 ("thermal/drivers/qcom/tsens-v0_1: Fix mdm9607 slope values") Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20231019144311.1035181-1-dmitry.baryshkov@linaro.org
2023-10-09drivers: thermal: tsens: Annotate struct tsens_priv with __counted_byKees Cook1-1/+1
Prepare for the coming implementation by GCC and Clang of the __counted_by attribute. Flexible array members annotated with __counted_by can have their accesses bounds-checked at run-time checking via CONFIG_UBSAN_BOUNDS (for array indexing) and CONFIG_FORTIFY_SOURCE (for strcpy/memcpy-family functions). As found with Coccinelle[1], add __counted_by for struct tsens_priv. [1] https://github.com/kees/kernel-tools/blob/trunk/coccinelle/examples/counted_by.cocci Cc: Andy Gross <agross@kernel.org> Cc: Bjorn Andersson <andersson@kernel.org> Cc: Konrad Dybcio <konrad.dybcio@linaro.org> Cc: Amit Kucheria <amitk@kernel.org> Cc: Thara Gopinath <thara.gopinath@gmail.com> Cc: "Rafael J. Wysocki" <rafael@kernel.org> Cc: Daniel Lezcano <daniel.lezcano@linaro.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-arm-msm@vger.kernel.org Cc: linux-pm@vger.kernel.org Reviewed-by: "Gustavo A. R. Silva" <gustavoars@kernel.org> Link: https://lore.kernel.org/r/20230922175341.work.919-kees@kernel.org Signed-off-by: Kees Cook <keescook@chromium.org>
2023-09-29thermal: tsens: Convert to platform remove callback returning voidUwe Kleine-König1-4/+2
The .remove() callback for a platform driver returns an int which makes many driver authors wrongly assume it's possible to do error handling by returning an error code. However the value returned is ignored (apart from emitting a warning) and this typically results in resource leaks. To improve here there is a quest to make the remove callback return void. In the first step of this quest all drivers are converted to .remove_new(), which already returns void. Eventually after all drivers are converted, .remove_new() will be renamed to .remove(). Trivially convert this driver from always returning zero in the remove callback to the void returning variant. Signed-off-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-08-16thermal/drivers/tsens: Make tsens_xxxx_nvmem staticMin-Hua Chen2-4/+4
This patch fixes the following sparse warnings: drivers/thermal/qcom/tsens-v1.c:24:40: sparse: warning: symbol 'tsens_qcs404_nvmem' was not declared. Should it be static? drivers/thermal/qcom/tsens-v0_1.c:26:40: sparse: warning: symbol 'tsens_8916_nvmem' was not declared. Should it be static? drivers/thermal/qcom/tsens-v0_1.c:42:40: sparse: warning: symbol 'tsens_8974_nvmem' was not declared. Should it be static? drivers/thermal/qcom/tsens-v0_1.c:64:40: sparse: warning: symbol 'tsens_8974_backup_nvmem' was not declared. Should it be static? No functional change intended. Signed-off-by: Min-Hua Chen <minhuadotchen@gmail.com> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230713160415.149381-1-minhuadotchen@gmail.com
2023-07-31thermal: Explicitly include correct DT includesRob Herring2-2/+0
The DT of_device.h and of_platform.h date back to the separate of_platform_bus_type before it as merged into the regular platform bus. As part of that merge prepping Arm DT support 13 years ago, they "temporarily" include each other. They also include platform_device.h and of.h. As a result, there's a pretty much random mix of those include files used throughout the tree. In order to detangle these headers and replace the implicit includes with struct declarations, users need to explicitly include the correct includes. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-06-26thermal/drivers/qcom/temp-alarm: Use dev_err_probeLuca Weiss1-20/+14
Use the dev_err_probe function instead of dev_err in the probe function so that the printed message includes the return value and also handles -EPROBE_DEFER nicely. Signed-off-by: Luca Weiss <luca@z3ntu.xyz> Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230625-spmi-temp-alarm-defer-v1-1-2d57acf36855@z3ntu.xyz
2023-06-26thermal/drivers/qcom: Remove redundant msg at probe timeYangtao Li3-9/+3
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly print error information. Signed-off-by: Yangtao Li <frank.li@vivo.com> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230620090732.50025-9-frank.li@vivo.com
2023-06-26thermal/drivers/qcom/tsens-v0_1: Add MSM8909 dataStephan Gerhold3-2/+39
The MSM8909 SoC has 5 thermal sensors in a TSENS v0.1 block. Like MDM9607 it uses a non-standard default slope value of 3000 [1] and needs per-sensor "correction factors" to workaround issues with the factory calibration [2]. [1]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LA.UM.7.7.c26-09100-8x09.0/arch/arm/boot/dts/qcom/msm8909.dtsi#L476 [2]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/commit/6df022c6d0c2c1b4a5a6c2124dba4d57910c0911 Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-6-5eb632235ba7@kernkonzept.com
2023-06-26thermal/drivers/qcom/tsens-v0_1: Add mdm9607 correction offsetsStephan Gerhold3-1/+30
According to the msm-3.18 vendor kernel from Qualcomm, mdm9607 needs "correction factors" to adjust for additional offsets observed after the factory calibration values in the fuses [1, 2]. The fixed offsets should be applied unless there is a special calibration mode value that indicates that no offsets are needed [3]. Note that the new calibration mode values are called differently in this patch compared to the vendor kernel: - TSENS_TWO_POINT_CALIB_N_WA -> ONE_PT_CALIB2_NO_OFFSET - TSENS_TWO_POINT_CALIB_N_OFFSET_WA -> TWO_PT_CALIB_NO_OFFSET This is because close inspection of the calibration function [3] reveals that TSENS_TWO_POINT_CALIB_N_WA is actually a "one point" calibration because the if statements skip all "point2" related code for it. [1]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/commit/d9d2db1b82bf3f72f5de0803d55e6849eb5b671e [2]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/commit/d75aef53a760e8ff7bac54049d00c8b2ee1b193e [3]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LE.UM.4.3.2.r1-04200-9x07/drivers/thermal/msm-tsens.c#L2987-3136 Fixes: a2149ab815fc ("thermal/drivers/qcom/tsens-v0_1: Add support for MDM9607") Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-3-5eb632235ba7@kernkonzept.com
2023-06-26thermal/drivers/qcom/tsens-v0_1: Fix mdm9607 slope valuesStephan Gerhold1-1/+17
According to the msm-3.18 vendor kernel from Qualcomm [1], mdm9607 uses a non-standard slope value of 3000 (instead of 3200) for all sensors. Fill it properly similar to the 8939 code added recently. [1]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LE.UM.4.3.2.r1-04200-9x07/arch/arm/boot/dts/qcom/mdm9607.dtsi#L875 Fixes: a2149ab815fc ("thermal/drivers/qcom/tsens-v0_1: Add support for MDM9607") Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-2-5eb632235ba7@kernkonzept.com
2023-06-26thermal/drivers/qcom/tsens: Drop unused legacy structsStephan Gerhold2-58/+0
The old single-cell parsing code was removed for MSM8939, MDM9607 and MSM8976 but for some reason the structs defining the bit positions etc were kept around (unused). Drop them now. Cc: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Fixes: 51d78b8b1beb ("thermal/drivers/tsens: Drop single-cell code for mdm9607") Fixes: dfadb4599ab0 ("thermal/drivers/tsens: Drop single-cell code for msm8939") Fixes: 3a908971f7cb ("thermal/drivers/tsens: Drop single-cell code for msm8976/msm8956") Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-1-5eb632235ba7@kernkonzept.com
2023-06-26thermal/drivers/qcom/tsens-v0_1: Add support for MSM8226Matti Lehtimäki3-2/+30
The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block. The thermal sensors use non-standard slope values. Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Reviewed-by: Luca Weiss <luca@z3ntu.xyz> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230507201225.89694-4-matti.lehtimaki@gmail.com
2023-03-03thermal/hwmon: Use the right device for devm_thermal_add_hwmon_sysfs()Daniel Lezcano3-3/+3
The devres variant of thermal_add_hwmon_sysfs() only takes the thermal zone structure pointer as parameter. Actually, it uses the tz->device to add it in the devres list. It is preferable to use the device registering the thermal zone instead of the thermal zone device itself. That prevents the driver accessing the thermal zone structure internals and it is from my POV more correct regarding how devm_ is used. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com> #amlogic_thermal Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-03-03thermal/core: Use the thermal zone 'devdata' accessor in thermal located driversDaniel Lezcano3-6/+6
The thermal zone device structure is exposed to the different drivers and obviously they access the internals while that should be restricted to the core thermal code. In order to self-encapsulate the thermal core code, we need to prevent the drivers accessing directly the thermal zone structure and provide accessor functions to deal with. Use the devdata accessor introduced in the previous patch. No functional changes intended. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car Acked-by: Mark Brown <broonie@kernel.org> Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062 Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap Acked-by: Linus Walleij <linus.walleij@linaro.org> Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-27Merge tag 'soc-drivers-6.3' of ↵Linus Torvalds1-1/+1
git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc Pull ARM SoC driver updates from Arnd Bergmann: "As usual, there are lots of minor driver changes across SoC platforms from NXP, Amlogic, AMD Zynq, Mediatek, Qualcomm, Apple and Samsung. These usually add support for additional chip variations in existing drivers, but also add features or bugfixes. The SCMI firmware subsystem gains a unified raw userspace interface through debugfs, which can be used for validation purposes. Newly added drivers include: - New power management drivers for StarFive JH7110, Allwinner D1 and Renesas RZ/V2M - A driver for Qualcomm battery and power supply status - A SoC device driver for identifying Nuvoton WPCM450 chips - A regulator coupler driver for Mediatek MT81xxv" * tag 'soc-drivers-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (165 commits) power: supply: Introduce Qualcomm PMIC GLINK power supply soc: apple: rtkit: Do not copy the reg state structure to the stack soc: sunxi: SUN20I_PPU should depend on PM memory: renesas-rpc-if: Remove redundant division of dummy soc: qcom: socinfo: Add IDs for IPQ5332 and its variant dt-bindings: arm: qcom,ids: Add IDs for IPQ5332 and its variant dt-bindings: power: qcom,rpmpd: add RPMH_REGULATOR_LEVEL_LOW_SVS_L1 firmware: qcom_scm: Move qcom_scm.h to include/linux/firmware/qcom/ MAINTAINERS: Update qcom CPR maintainer entry dt-bindings: firmware: document Qualcomm SM8550 SCM dt-bindings: firmware: qcom,scm: add qcom,scm-sa8775p compatible soc: qcom: socinfo: Add Soc IDs for IPQ8064 and variants dt-bindings: arm: qcom,ids: Add Soc IDs for IPQ8064 and variants soc: qcom: socinfo: Add support for new field in revision 17 soc: qcom: smd-rpm: Add IPQ9574 compatible soc: qcom: pmic_glink: remove redundant calculation of svid soc: qcom: stats: Populate all subsystem debugfs files dt-bindings: soc: qcom,rpmh-rsc: Update to allow for generic nodes soc: qcom: pmic_glink: add CONFIG_NET/CONFIG_OF dependencies soc: qcom: pmic_glink: Introduce altmode support ...
2023-02-15thermal: Remove core header inclusion from driversDaniel Lezcano1-1/+0
As the name states "thermal_core.h" is the header file for the core components of the thermal framework. Too many drivers are including it. Hopefully the recent cleanups helped to self encapsulate the code a bit more and prevented the drivers to need this header. Remove this inclusion in every place where it is possible. Some other drivers did a confusion with the core header and the one exported in linux/thermal.h. They include the former instead of the latter. The changes also fix this. The tegra/soctherm driver still remains as it uses an internal function which need to be replaced. The Intel HFI driver uses the netlink internal framework core and should be changed to prevent to deal with the internals. No functional changes intended. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # armada_thermal.c Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> # uniphier_thermal.c Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> # rcar_gen3_thermal.c Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> # amlogic_thermal.c Acked-by: Florian Fainelli <f.fainelli@gmail.com> # bcm2835_thermal.c Acked-by: Thierry Reding <treding@nvidia.com> # tegra30-tsensor.c Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-09firmware: qcom_scm: Move qcom_scm.h to include/linux/firmware/qcom/Elliot Berman1-1/+1
Move include/linux/qcom_scm.h to include/linux/firmware/qcom/qcom_scm.h. This removes 1 of a few remaining Qualcomm-specific headers into a more approciate subdirectory under include/. Suggested-by: Bjorn Andersson <andersson@kernel.org> Signed-off-by: Elliot Berman <quic_eberman@quicinc.com> Reviewed-by: Guru Das Srinagesh <quic_gurus@quicinc.com> Acked-by: Mukesh Ojha <quic_mojha@quicinc.com> Signed-off-by: Bjorn Andersson <andersson@kernel.org> Link: https://lore.kernel.org/r/20230203210956.3580811-1-quic_eberman@quicinc.com
2023-01-18thermal/drivers/qcom-spmi-adc-tm5: Use asm intead of asm-genericAndy Shevchenko1-1/+2
There is no point to specify asm-generic for the unaligned.h. Drop the 'generic' suffix. Signed-off-by: Andy Shevchenko <andriy.shevchenko@linux.intel.com> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20230103145339.40501-1-andriy.shevchenko@linux.intel.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2023-01-16thermal/drivers/qcom: Remove duplicate set next trip point interrupt codeDaniel Lezcano1-49/+2
The tsens driver reprogram the next trip points in the irq handler. This function then call thermal_zone_device_update(). However, thermal_zone_device_update() calls thermal_zone_set_trips() and from there it calls the backend 'set_trips' ops. This one in turn reprogram the next trip points (low/high). Consequently, the code setting the next trip points interrupt in the interrupt handle is not needed and could be removed. Reviewed-by: Bjorn Andersson <andersson@kernel.org> Acked-by: Amit Kucheria <amitk@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230116101955.3961427-1-daniel.lezcano@linaro.org
2023-01-16thermal/drivers/tsens: Drop single-cell code for msm8976/msm8956Dmitry Baryshkov1-27/+2
There is no dtsi file for msm8976 in the kernel sources. Drop the compatibility with unofficial dtsi and remove support for handling the single-cell calibration data on msm8976. Cc: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> Link: https://lore.kernel.org/r/20230101194034.831222-15-dmitry.baryshkov@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2023-01-16thermal/drivers/tsens: Drop single-cell code for msm8939Dmitry Baryshkov1-25/+1
There is no dtsi file for msm8939 in the kernel sources. Drop the compatibility with unofficial dtsi and remove support for handling the single-cell calibration data on msm8939. Cc: Shawn Guo <shawn.guo@linaro.org> Cc: Bryan O'Donoghue <bryan.odonoghue@linaro.org> Reviewed-by: Bryan O'Donoghue <bryan.odonoghue@linaro.org> Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Acked-by: Shawn Guo <shawn.guo@linaro.org> Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20230101194034.831222-14-dmitry.baryshkov@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2023-01-16thermal/drivers/tsens: Drop single-cell code for mdm9607Dmitry Baryshkov1-31/+7
There is no dtsi file for mdm9607 in the kernel sources. Drop the compatibility with unofficial dtsi and remove support for handling the single-cell calibration data on mdm9607. Cc: Konrad Dybcio <konrad.dybcio@linaro.org> Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20230101194034.831222-13-dmitry.baryshkov@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2023-01-16thermal/drivers/tsens: Rework legacy calibration data parsersDmitry Baryshkov4-662/+297
Rework existing calibration parsing code to use simple data structure describing data layout. This allows us to drop all the mask & shift values, replacing them with data tables. The code for msm8974 is not reworked, as it has separate calibration and backup data. Reported-by: kernel test robot <lkp@intel.com> Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20230101194034.831222-12-dmitry.baryshkov@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2023-01-16thermal/drivers/tsens: Support using nvmem cells for msm8974 calibrationDmitry Baryshkov3-8/+84
MSM8974 has two sets of calibration data: main one and backup. Add support for parsing both sets of calibration data from nvmem cells. Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20230101194034.831222-11-dmitry.baryshkov@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2023-01-16thermal/drivers/tsens: Support using nvmem cells for calibration dataDmitry Baryshkov4-1/+106
Add a unified function using nvmem cells for parsing the calibration data rather than parsing the calibration blob manually. Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20230101194034.831222-10-dmitry.baryshkov@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2023-01-16thermal/drivers/tsens: limit num_sensors to 9 for msm8939Dmitry Baryshkov1-9/+4
On msm8939 last (hwid=10) sensor was added in the hw revision 3.0. Calibration data for it was placed outside of the main calibration data blob, so it is not accessible by the current blob-parsing code. Moreover data for the sensor's p2 is not contiguous in the fuses. This makes it hard to use nvmem_cell API to parse calibration data in a generic way. Since the sensor doesn't seem to be actually used by the existing hardware, disable the sensor for now. Fixes: 332bc8ebab2c ("thermal: qcom: tsens-v0_1: Add support for MSM8939") Cc: Bryan O'Donoghue <bryan.odonoghue@linaro.org> Cc: Shawn Guo <shawn.guo@linaro.org> Acked-by: Shawn Guo <shawn.guo@linaro.org> Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Reviewed-by: Bryan O'Donoghue <bryan.odonoghue@linaro.org> Link: https://lore.kernel.org/r/20230101194034.831222-9-dmitry.baryshkov@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2023-01-16thermal/drivers/tsens: fix slope values for msm8939Dmitry Baryshkov1-1/+16
According to the vendor kernels (msm-3.10, 3.14 and 3.18), msm8939 uses non-standard slope values for calibrating the sensors. Fill them accordingly. Fixes: 332bc8ebab2c ("thermal: qcom: tsens-v0_1: Add support for MSM8939") Cc: Bryan O'Donoghue <bryan.odonoghue@linaro.org> Cc: Shawn Guo <shawn.guo@linaro.org> Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Acked-by: Shawn Guo <shawn.guo@linaro.org> Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Reviewed-by: Bryan O'Donoghue <bryan.odonoghue@linaro.org> Link: https://lore.kernel.org/r/20230101194034.831222-8-dmitry.baryshkov@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2023-01-16thermal/drivers/tsens: Sort out msm8976 vs msm8956 dataDmitry Baryshkov3-27/+34
Tsens driver mentions that msm8976 data should be used for both msm8976 and msm8956 SoCs. This is not quite correct, as according to the vendor kernels, msm8976 should use standard slope values (3200), while msm8956 really uses the slope values found in the driver. Add separate compatibility string for msm8956, move slope value overrides to the corresponding init function and use the standard compute_intercept_slope() function for both platforms. Fixes: 0e580290170d ("thermal: qcom: tsens-v1: Add support for MSM8956 and MSM8976") Cc: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20230101194034.831222-7-dmitry.baryshkov@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2023-01-16thermal/drivers/tsens: Drop msm8976-specific definesDmitry Baryshkov1-7/+2
Drop msm8976-specific defines, which duplicate generic ones. Fixes: 0e580290170d ("thermal: qcom: tsens-v1: Add support for MSM8956 and MSM8976") Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20230101194034.831222-6-dmitry.baryshkov@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2023-01-16thermal/drivers/tsens: Drop unnecessary hw_idsDmitry Baryshkov2-2/+0
The tsens driver defaults to using hw_id equal to the index of the sensor. Thus it is superfluous to declare such hw_id arrays. Drop such arrays from mdm9607 and msm8976 data. Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20230101194034.831222-5-dmitry.baryshkov@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2023-01-06thermal/drivers/qcom: Fix lock inversionJohan Hovold1-0/+5
The thermal-zone-device lock is held by core when setting trip points and the driver takes its chip lock in the corresponding callback. Fetching the thermal trip points using thermal_zone_get_trip() also involves taking the thermal-zone-device lock, which means that the chip lock can not be held when doing so. Drop the chip lock temporarily during probe to avoid the lock inversion that was detected by lockdep: ====================================================== WARNING: possible circular locking dependency detected 6.1.0-next-20221213 #122 Not tainted ------------------------------------------------------ systemd-udevd/264 is trying to acquire lock: ffff741e444a0920 (&chip->lock){+.+.}-{3:3}, at: qpnp_tm_get_temp+0xb4/0x1b0 [qcom_spmi_temp_alarm] but task is already holding lock: ffff741e44341618 (&tz->lock){+.+.}-{3:3}, at: thermal_zone_device_update+0x2c/0x70 which lock already depends on the new lock. Fixes: 78c3e2429be8 ("thermal/drivers/qcom: Use generic thermal_zone_get_trip() function") Signed-off-by: Johan Hovold <johan+linaro@kernel.org> Link: https://lore.kernel.org/r/20221214131617.2447-5-johan+linaro@kernel.org Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2023-01-06thermal/drivers/qcom: Fix set_trip_temp() deadlockJohan Hovold1-1/+1
The set_trip_temp() callback is used when changing the trip temperature through sysfs. As it is called with the thermal-zone-device lock held it must not use thermal_zone_get_trip() directly or it will deadlock. Fixes: 78c3e2429be8 ("thermal/drivers/qcom: Use generic thermal_zone_get_trip() function") Signed-off-by: Johan Hovold <johan+linaro@kernel.org> Link: https://lore.kernel.org/r/20221214131617.2447-2-johan+linaro@kernel.org Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2023-01-06thermal/drivers/qcom: Use generic thermal_zone_get_trip() functionDaniel Lezcano1-22/+17
The thermal framework gives the possibility to register the trip points with the thermal zone. When that is done, no get_trip_* ops are needed and they can be removed. Convert ops content logic into generic trip points and register them with the thermal zone. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Amit Kucheria <amitk@kernel.org> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20221003092602.1323944-14-daniel.lezcano@linaro.org
2022-12-14thermal/drivers/qcom/lmh: Fix irq handler return valueBjorn Andersson1-1/+1
After enough invocations the LMh irq is eventually reported as bad, because the handler doesn't return IRQ_HANDLED, fix this. Fixes: 53bca371cdf7 ("thermal/drivers/qcom: Add support for LMh driver") Reported-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20220316180322.88132-1-bjorn.andersson@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14thermal/drivers/qcom: Demote error log of thermal zone register to debugManivannan Sadhasivam1-1/+1
devm_thermal_of_zone_register() can fail with -ENODEV if thermal zone for the channel is not represented in DT. This is perfectly fine since not all sensors needs to be used for thermal zones but only a few in real world. So demote the error log to debug to avoid spamming users. Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org> Link: https://lore.kernel.org/r/20221029052933.32421-1-manivannan.sadhasivam@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14thermal/drivers/qcom/temp-alarm: Fix inaccurate warning for gen2Luca Weiss1-1/+2
On gen2 chips the stage2 threshold is not 140 degC but 125 degC. Make the warning message clearer by using this variable and also by including the temperature that was checked for. Fixes: aa92b3310c55 ("thermal/drivers/qcom-spmi-temp-alarm: Add support for GEN2 rev 1 PMIC peripherals") Signed-off-by: Luca Weiss <luca.weiss@fairphone.com> Reviewed-by: Amit Kucheria <amitk@kernel.org> Link: https://lore.kernel.org/r/20221020145237.942146-1-luca.weiss@fairphone.com Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14thermal: qcom-spmi-adc-tm5: suppress probe-deferral error messageJohan Hovold1-4/+2
Drivers should not be logging errors on probe deferral. Switch to using dev_err_probe() to log failures when parsing the devicetree to avoid errors like: qcom-spmi-adc-tm5 c440000.spmi:pmic@0:adc-tm@3400: get dt data failed: -517 when a channel is not yet available. Signed-off-by: Johan Hovold <johan+linaro@kernel.org> Reviewed-by: Manivannan Sadhasivam <mani@kernel.org> Reviewed-by: Andrew Halaney <ahalaney@redhat.com> Link: https://lore.kernel.org/r/20221102152630.696-1-johan+linaro@kernel.org Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14thermal/drivers/qcom/tsens: Rework debugfs file structureChristian Marangi1-10/+3
The current tsens debugfs structure is composed by: - a tsens dir in debugfs with a version file - a directory for each tsens istance with sensors file to dump all the sensors value. This works on the assumption that we have the same version for each istance but this assumption seems fragile and with more than one tsens istance results in the version file not tracking each of them. A better approach is to just create a subdirectory for each tsens istance and put there version and sensors debugfs file. Using this new implementation results in less code since debugfs entry are created only on successful tsens probe. Signed-off-by: Christian Marangi <ansuelsmth@gmail.com> Link: https://lore.kernel.org/r/20221022125657.22530-4-ansuelsmth@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14thermal/drivers/qcom/tsens: Fix wrong version id dbg_version_showChristian Marangi1-1/+1
For VER_0 the version was incorrectly reported as 0.1.0. Fix that and correctly report the major version for this old tsens revision. Signed-off-by: Christian Marangi <ansuelsmth@gmail.com> Link: https://lore.kernel.org/r/20221022125657.22530-3-ansuelsmth@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14thermal/drivers/qcom/tsens: Init debugfs only with successful probeChristian Marangi1-3/+5
Calibrate and tsens_register can fail or PROBE_DEFER. This will cause a double or a wrong init of the debugfs information. Init debugfs only with successful probe fixing warning about directory already present. Signed-off-by: Christian Marangi <ansuelsmth@gmail.com> Acked-by: Thara Gopinath <thara.gopinath@linaro.org> Link: https://lore.kernel.org/r/20221022125657.22530-2-ansuelsmth@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14thermal/drivers/tsens: Add IPQ8074 supportRobert Marko3-1/+21
Qualcomm IPQ8074 uses tsens v2.3 IP, however unlike other tsens v2 IP it only has one IRQ, that is used for up/low as well as critical. It also does not support negative trip temperatures. Signed-off-by: Robert Marko <robimarko@gmail.com> Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20220818220245.338396-4-robimarko@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-12-14thermal/drivers/tsens: Allow configuring min and max tripsRobert Marko6-2/+14
IPQ8074 and IPQ6018 dont support negative trip temperatures and support up to 204 degrees C as the max trip temperature. So, instead of always setting the -40 as min and 120 degrees C as max allow it to be configured as part of the features. Signed-off-by: Robert Marko <robimarko@gmail.com> Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20220818220245.338396-3-robimarko@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-12-14thermal/drivers/tsens: Add support for combined interruptRobert Marko6-6/+38
Despite using tsens v2.3 IP, IPQ8074 and IPQ6018 only have one IRQ for signaling both up/low and critical trips. Signed-off-by: Robert Marko <robimarko@gmail.com> Reviewed-by: Bjorn Andersson <andersson@kernel.org> Link: https://lore.kernel.org/r/20220818220245.338396-2-robimarko@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-10-10Merge tag 'thermal-6.1-rc1-2' of ↵Linus Torvalds1-1/+1
git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm Pull more thermal control updates from Rafael Wysocki: "These fix assorted issues in the thermal core and ARM thermal drivers. Specifics: - Use platform data to get the sensor ID instead of parsing the device in imx_sc thermal driver and remove the dedicated OF function from the core code (Daniel Lezcano). - Fix Kconfig dependency for the QCom tsens thermal driver (Jonathan Cameron). - Add missing const annotation to the RCar ops thermal driver (Lad Prabhakar). - Drop duplicate parameter check from thermal_zone_device_register_with_trips() (Lad Prabhakar). - Fix NULL pointer dereference in trip_point_temp_store() by making it check if the ->set_trip_temp() operation is present (Lad Prabhakar). - Fix the MSM8939 fourth sensor hardware ID in the QCom tsens thermal driver (Vincent Knecht)" * tag 'thermal-6.1-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: thermal/drivers/qcom/tsens-v0_1: Fix MSM8939 fourth sensor hw_id thermal/core: Add a check before calling set_trip_temp() thermal/core: Drop valid pointer check for type thermal/drivers/rcar_thermal: Constify static thermal_zone_device_ops thermal/drivers/qcom: Drop false build dependency of all QCOM drivers on QCOM_TSENS thermal/of: Remove the thermal_zone_of_get_sensor_id() function thermal/drivers/imx_sc: Rely on the platform data to get the resource id
2022-10-08Merge tag 'char-misc-6.1-rc1' of ↵Linus Torvalds2-2/+3
git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc Pull char/misc and other driver updates from Greg KH: "Here is the large set of char/misc and other small driver subsystem changes for 6.1-rc1. Loads of different things in here: - IIO driver updates, additions, and changes. Probably the largest part of the diffstat - habanalabs driver update with support for new hardware and features, the second largest part of the diff. - fpga subsystem driver updates and additions - mhi subsystem updates - Coresight driver updates - gnss subsystem updates - extcon driver updates - icc subsystem updates - fsi subsystem updates - nvmem subsystem and driver updates - misc driver updates - speakup driver additions for new features - lots of tiny driver updates and cleanups All of these have been in the linux-next tree for a while with no reported issues" * tag 'char-misc-6.1-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc: (411 commits) w1: Split memcpy() of struct cn_msg flexible array spmi: pmic-arb: increase SPMI transaction timeout delay spmi: pmic-arb: block access for invalid PMIC arbiter v5 SPMI writes spmi: pmic-arb: correct duplicate APID to PPID mapping logic spmi: pmic-arb: add support to dispatch interrupt based on IRQ status spmi: pmic-arb: check apid against limits before calling irq handler spmi: pmic-arb: do not ack and clear peripheral interrupts in cleanup_irq spmi: pmic-arb: handle spurious interrupt spmi: pmic-arb: add a print in cleanup_irq drivers: spmi: Directly use ida_alloc()/free() MAINTAINERS: add TI ECAP driver info counter: ti-ecap-capture: capture driver support for ECAP Documentation: ABI: sysfs-bus-counter: add frequency & num_overflows items dt-bindings: counter: add ti,am62-ecap-capture.yaml counter: Introduce the COUNTER_COMP_ARRAY component type counter: Consolidate Counter extension sysfs attribute creation counter: Introduce the Count capture component counter: 104-quad-8: Add Signal polarity component counter: Introduce the Signal polarity component counter: interrupt-cnt: Implement watch_validate callback ...
2022-10-04thermal/drivers/qcom/tsens-v0_1: Fix MSM8939 fourth sensor hw_idVincent Knecht1-1/+1
Reading temperature from this sensor fails with 'Invalid argument'. Looking at old vendor dts [1], its hw_id should be 3 instead of 4. Change this hw_id accordingly. [1] https://github.com/msm8916-mainline/android_kernel_qcom_msm8916/blob/master/arch/arm/boot/dts/qcom/msm8939-common.dtsi#L511 Fixes: 332bc8ebab2c ("thermal: qcom: tsens-v0_1: Add support for MSM8939") Signed-off-by: Vincent Knecht <vincent.knecht@mailoo.org> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Reviewed-by: Bjorn Andersson <andersson@kernel.org> Reviewed-by: Bryan O'Donoghue <bryan.odonoghue@linaro.org> Link: https://lore.kernel.org/r/20220811105014.7194-1-vincent.knecht@mailoo.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-09-24nvmem: prefix all symbols with NVMEM_Rafał Miłecki1-1/+1
This unifies all NVMEM symbols. They follow one style now. Reviewed-by: Matthias Brugger <matthias.bgg@gmail.com> Acked-by: Arnd Bergmann <arnd@arndb.de> Signed-off-by: Rafał Miłecki <rafal@milecki.pl> Signed-off-by: Srinivas Kandagatla <srinivas.kandagatla@linaro.org> Link: https://lore.kernel.org/r/20220916122100.170016-8-srinivas.kandagatla@linaro.org Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2022-08-17thermal/drivers/qcom/spmi-adc-tm5: Remove unnecessary print function dev_err()Jiapeng Chong1-3/+1
The print function dev_err() is redundant because platform_get_irq() already prints an error. ./drivers/thermal/qcom/qcom-spmi-adc-tm5.c:1029:2-9: line 1029 is redundant because platform_get_irq() already prints an error. Link: https://bugzilla.openanolis.cn/show_bug.cgi?id=1846 Reported-by: Abaci Robot <abaci@linux.alibaba.com> Signed-off-by: Jiapeng Chong <jiapeng.chong@linux.alibaba.com> Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20220809034346.128607-1-jiapeng.chong@linux.alibaba.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-08-17thermal/drivers/qcom: Switch to new of APIDaniel Lezcano3-24/+23
The thermal OF code has a new API allowing to migrate the OF initialization to a simpler approach. The ops are no longer device tree specific and are the generic ones provided by the core code. Convert the ops to the thermal_zone_device_ops format and use the new API to register the thermal zone with these generic ops. Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20220804224349.1926752-12-daniel.lezcano@linexp.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
generated by cgit v1.2.3 (git 2.39.0) at 2024-08-28 10:22:54 +0300