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2024-02-29Merge branch 'icc-sm7150' into icc-nextGeorgi Djakov1-0/+150
Add dt-bindings and interconnect driver support for the Qualcomm SM7150 SoC. * icc-sm7150 dt-bindings: interconnect: Add Qualcomm SM7150 DT bindings interconnect: qcom: Add SM7150 driver support Link: https://lore.kernel.org/r/20240222174250.80493-1-danila@jiaxyga.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-02-29dt-bindings: interconnect: Add Qualcomm SM7150 DT bindingsDanila Tikhonov1-0/+150
The Qualcomm SM7150 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Danila Tikhonov <danila@jiaxyga.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240222174250.80493-2-danila@jiaxyga.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-02-26Merge branch 'icc-cleanup' into icc-nextGeorgi Djakov1-24/+0
* icc-cleanup interconnect: qcom: sm8550: Remove bogus per-RSC BCMs and nodes dt-bindings: interconnect: Remove bogus interconnect nodes interconnect: qcom: x1e80100: Remove bogus per-RSC BCMs and nodes interconnect: qcom: sa8775p: constify pointer to qcom_icc_node interconnect: qcom: sm8250: constify pointer to qcom_icc_node interconnect: qcom: sm6115: constify pointer to qcom_icc_node interconnect: qcom: sa8775p: constify pointer to qcom_icc_bcm interconnect: qcom: x1e80100: constify pointer to qcom_icc_bcm dt-bindings: interconnect: qcom,rpmh: Fix bouncing @codeaurora address interconnect: constify of_phandle_args in xlate Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-01-31dt-bindings: interconnect: Remove bogus interconnect nodesKonrad Dybcio1-24/+0
The downstream kernel has infrastructure for passing votes from different interconnect nodes onto different RPMh RSCs. This neither implemented, not is going to be implemented upstream (in favor of a different solution using ICC tags through the same node). Unfortunately, as it happens, meaningless (in the upstream context) parts of the vendor driver were copied, ending up causing havoc - since all "per-RSC" (in quotes because they all point to the main APPS one) BCMs defined within the driver overwrite the value in RPMh on every aggregation. To both avoid keeping bogus code around and possibly introducing impossible-to-track-down bugs (busses shutting down for no reason), get rid of the duplicated ICC node definitions. Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240102-topic-x1e_fixes-v1-2-70723e08d5f6@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-01-31dt-bindings: interconnect: Add Qualcomm MSM8909 DT bindingsAdam Skladowski1-0/+93
Add bindings for Qualcomm MSM8909 Network-On-Chip interconnect devices. [Stephan: Drop separate mm-snoc that exists downstream since it's actually the same NoC as SNoC in hardware] Signed-off-by: Adam Skladowski <a39.skl@gmail.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com> Link: https://lore.kernel.org/r/20231220-icc-msm8909-v2-1-3b68bbed2891@kernkonzept.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-12-17Merge branch 'icc-sm6115' of ↵Bjorn Andersson1-0/+111
https://git.kernel.org/pub/scm/linux/kernel/git/djakov/icc into HEAD Merge the SM6115 interconnect binding to allow referecing the interconnect header files and the ports defined in these.
2023-12-08Merge branch 'icc-x1e80100' of ↵Bjorn Andersson1-0/+207
https://git.kernel.org/pub/scm/linux/kernel/git/djakov/icc into arm64-for-6.8 Merge the X1E80100 interconnect binding to get access to the interconnect port constants.
2023-12-06dt-bindings: interconnect: Add Qualcomm SM6115 NoCKonrad Dybcio1-0/+111
Add bindings for Qualcomm SM6115 Network-On-Chip interconnect. Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20231125-topic-6115icc-v3-1-bd8907b8cfd7@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-11-24dt-bindings: interconnect: Add Qualcomm X1E80100 SoCRajendra Nayak1-0/+207
The Qualcomm X1E80100 SoC has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Co-developed-by: Abel Vesa <abel.vesa@linaro.org> Signed-off-by: Abel Vesa <abel.vesa@linaro.org> Signed-off-by: Rajendra Nayak <quic_rjendra@quicinc.com> Co-developed-by: Sibi Sankar <quic_sibis@quicinc.com> Signed-off-by: Sibi Sankar <quic_sibis@quicinc.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20231123135028.29433-2-quic_sibis@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-11-24dt-bindings: interconnect: document the RPMh Network-On-Chip Interconnect in ↵Neil Armstrong1-0/+154
Qualcomm SM8650 SoC Document the RPMh Network-On-Chip Interconnect of the SM8650 platform. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org> Link: https://lore.kernel.org/r/20231123-topic-sm8650-upstream-interconnect-v2-1-7e050874f59b@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-10-10dt-bindings: interconnect: Add compatibles for SDX75Rohit Agarwal1-0/+102
Add dt-bindings compatibles and interconnect IDs for Qualcomm SDX75 platform. Signed-off-by: Rohit Agarwal <quic_rohiagar@quicinc.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/1694614256-24109-2-git-send-email-quic_rohiagar@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-07-18Merge branch 'icc-sm8250-qup' into icc-nextGeorgi Djakov1-0/+7
SM8250 (like SM8150 but unlike all other QUP-equipped SoCs) doesn't provide a qup-core path. Adjust the bindings and drivers as necessary, and then describe the icc paths in the device tree. This makes it possible for interconnect sync_state succeed so long as you don't use UFS. * icc-sm8250-qup dt-bindings: interconnect: qcom,rpmh: Add SM8250 QUP virt dt-bindings: interconnect: qcom,sm8250: Add QUP virt interconnect: qcom: sm8250: Fix QUP0 nodes Link: https://lore.kernel.org/r/20230703-topic-8250_qup_icc-v2-0-9ba0a9460be2@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-07-16dt-bindings: interconnect: qcom,sm8250: Add QUP virtKonrad Dybcio1-0/+7
Add the required defines for QUP_virt nodes. Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20230703-topic-8250_qup_icc-v2-2-9ba0a9460be2@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-07-15dt-bindings: interconnect: Add Qcom RPM ICC bindingsKonrad Dybcio1-0/+13
The SMD RPM interconnect driver requires different icc tags to the RPMh driver. Add bindings to reflect that. Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org> Acked-by: Georgi Djakov <djakov@kernel.org> Link: https://lore.kernel.org/r/20230526-topic-smd_icc-v7-1-09c78c175546@linaro.org Signed-off-by: Bjorn Andersson <andersson@kernel.org>
2023-05-18dt-bindings: interconnect/msm8996-cbf: add defines to be used by CBFDmitry Baryshkov1-0/+12
On msm8996 CBF interconnects power and performance CPU clusters. Add corresponding interconnect defines to be used in device trees. Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Tested-by: Yassine Oudjana <y.oudjana@protonmail.com> Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20230512001334.2983048-2-dmitry.baryshkov@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-02-06Merge branch 'icc-sa8775p' into icc-nextGeorgi Djakov1-0/+231
* icc-sa8775p dt-bindings: interconnect: qcom: document the interconnects for sa8775p interconnect: qcom: add a driver for sa8775p dt-bindings: interconnect: qcom,sa8775p-rpmh: fix a typo Link: https://lore.kernel.org/r/20230118140825.242544-2-brgl@bgdev.pl Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-02-06Merge branch 'icc-sdm670' into icc-nextGeorgi Djakov1-0/+136
* icc-sdm670 dt-bindings: interconnect: add sdm670 interconnects interconnect: qcom: add sdm670 interconnects Link: https://lore.kernel.org/r/20230111005155.50452-1-mailingradian@gmail.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-02-06Merge branch 'icc-ip0-migration' into icc-nextGeorgi Djakov6-16/+2
Commits 2f3724930eb4 ("interconnect: qcom: sc7180: Drop IP0 interconnects") and 2fb251c26560 ("interconnect: qcom: sdx55: Drop IP0 interconnects") removed IP0 interconnects (and ipa-virt devices support) in favour of the RPMH clocks. Follow this example for other platforms defining IP0 RPMH resource. While we are at it, remove several leftover from the mentioned patches. * icc-ip0-migration: interconnect: qcom: sdx55: drop IP0 remnants interconnect: qcom: sc7180: drop IP0 remnants interconnect: move ignore_list out of of_count_icc_providers() interconnect: qcom: sm8150: Drop IP0 interconnects interconnect: qcom: sm8250: Drop IP0 interconnects interconnect: qcom: sc8180x: Drop IP0 interconnects interconnect: qcom: sc8280xp: Drop IP0 interconnects dt-bindings: interconnect: qcom: Remove ipa-virt compatibles dt-bindings: interconnect: qcom: drop IPA_CORE related defines Link: https://lore.kernel.org/r/20230109002935.244320-1-dmitry.baryshkov@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-01-19dt-bindings: interconnect: qcom: document the interconnects for sa8775pBartosz Golaszewski1-0/+231
Add a DT binding document for the RPMh interconnects on Qualcomm sa8775p platforms. Signed-off-by: Bartosz Golaszewski <bartosz.golaszewski@linaro.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20230118140825.242544-2-brgl@bgdev.pl Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-01-19dt-bindings: interconnect: add sdm670 interconnectsRichard Acayan1-0/+136
There are controllable interconnects on Snapdragon 670. Add the compatible strings to the documentation and interconnect ID definitions. The device tree header was generated by linux-interconnect-driver-generator and the copyright year was changed. Signed-off-by: Richard Acayan <mailingradian@gmail.com> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20230111005155.50452-2-mailingradian@gmail.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-01-18dt-bindings: interconnect: qcom: drop IPA_CORE related definesDmitry Baryshkov6-16/+2
These interconnects are modeled as clks, not interconnects, therefore remove corresponding defines from the binding as they're unused. Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20230109002935.244320-10-dmitry.baryshkov@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-01-05Merge branch 'icc-qdu1000' into icc-nextGeorgi Djakov1-0/+98
Add dt bindings and driver support for the Qualcomm QDU1000 and QRU1000 SoCs. The Qualcomm Technologies, Inc. Distributed Unit 1000 and Radio Unit 1000 are new SoCs meant for enabling Open RAN solutions. See more at https://www.qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/qualcomm_5g_ran_platforms_product_brief.pdf Link: https://lore.kernel.org/r/20221216230914.21771-1-quic_molvera@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-01-05dt-bindings: interconnect: Add QDU1000/QRU1000 devicesMelody Olvera1-0/+98
Add separate schema for QDU1000 and QRU1000 interconnect devices to document the different NoCs on these platforms. Signed-off-by: Melody Olvera <quic_molvera@quicinc.com> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20221216230914.21771-2-quic_molvera@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-12-29dt-bindings: interconnect: Add Qualcomm SM8550Abel Vesa1-0/+189
The Qualcomm SM8550 SoC has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Abel Vesa <abel.vesa@linaro.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20221202232054.2666830-2-abel.vesa@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-07-15Merge branch 'icc-imx8mp' into icc-nextGeorgi Djakov1-0/+59
This patchset is to support i.MX8MP NoC settings, i.MX8MP NoC initial value after power up is invalid, need set a valid value after related power domain up. This patchset also includes two patch[1,2] during my development to enable the ICC feature for i.MX8MP. I not include ddrc DVFS in this patchset, ths patchset is only to support NoC value mode/priority/ext_control being set to a valid value that suggested by i.MX Chip Design Team. The value is same as NXP downstream one inside Arm Trusted Firmware: https://source.codeaurora.org/external/imx/imx-atf/tree/plat/imx/imx8m/i/gpc.c?h=lf_v2.4#n97 Link: https://lore.kernel.org/r/20220703091132.1412063-1-peng.fan@oss.nxp.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-07-04dt-bindings: interconnect: add fsl,imx8mp.hPeng Fan1-0/+59
Add fsl,imx8mp.h for i.MX8MP Signed-off-by: Peng Fan <peng.fan@nxp.com> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20220703091132.1412063-3-peng.fan@oss.nxp.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-06-20dt-bindings: interconnect: Add Qualcomm SM6350 NoC supportLuca Weiss1-0/+148
Add bindings for Qualcomm SM6350 Network-On-Chip interconnect devices. As SM6350 has two pairs of NoCs sharing the same reg, allow this in the binding documentation, as was done for qcm2290. Signed-off-by: Luca Weiss <luca.weiss@fairphone.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20220525144404.200390-4-luca.weiss@fairphone.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-05-18Merge branch 'icc-sc8180x' into icc-nextGeorgi Djakov1-0/+7
This contains a few fixes for the sc8180x interconnect provider driver to make it functional. * icc-sc8180x dt-bindings: interconnect: Add SC8180X QUP0 virt provider interconnect: qcom: sc8180x: Modernize sc8180x probe interconnect: qcom: sc8180x: Fix QUP0 nodes interconnect: qcom: sc8180x: Mark some BCMs keepalive Link: https://lore.kernel.org/r/20220503211925.1022169-1-bjorn.andersson@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-05-18interconnect: qcom: sc8180x: Fix QUP0 nodesBjorn Andersson1-0/+7
The QUP0 BCM relates to some internal property of the QUPs, and should be configured independently of the path to the QUP. In line with other platforms expose QUP_CORE endpoints in order allow this configuration. Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20220503211925.1022169-4-bjorn.andersson@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-05-18Merge branch 'icc-sdx65' into icc-nextGeorgi Djakov1-0/+67
This adds interconnect driver support for SDX65 platform for scaling the bandwidth requirements over RPMh. Link: https://lore.kernel.org/r/1649854415-11174-1-git-send-email-quic_rohiagar@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-04-26dt-bindings: interconnect: Add Qualcomm SDX65 DT bindingsRohit Agarwal1-0/+67
Add interconnect IDs for Qualcomm SDX65 platform. Signed-off-by: Rohit Agarwal <quic_rohiagar@quicinc.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/1649854415-11174-2-git-send-email-quic_rohiagar@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-04-22dt-bindings: interconnect: qcom: Add sc8280xp bindingBjorn Andersson1-0/+232
The Qualcomm SC8280XP platform has the usual set of busses, add a binding for these interconnect providers and port definitions to allow interconnect paths to be expressed in the sc8280xp DeviceTree. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com> Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20220408214835.624494-1-bjorn.andersson@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-12-15Merge branch 'icc-qcm2290' into icc-nextGeorgi Djakov1-0/+94
Add support for QCM2290 including a few prep changes. * icc-qcm2290 interconnect: icc-rpm: Define ICC device type interconnect: icc-rpm: Add QNOC type QoS support interconnect: icc-rpm: Support child NoC device probe dt-bindings: interconnect: Add Qualcomm QCM2290 NoC support interconnect: qcom: Add QCM2290 driver support Link: https://lore.kernel.org/r/20211215002324.1727-1-shawn.guo@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-12-15dt-bindings: interconnect: Add Qualcomm QCM2290 NoC supportShawn Guo1-0/+94
Add bindings for Qualcomm QCM2290 Network-On-Chip interconnect devices. Signed-off-by: Shawn Guo <shawn.guo@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20211215002324.1727-5-shawn.guo@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-12-15Merge branch 'icc-sm8450' into icc-nextGeorgi Djakov1-0/+171
This add device tree binding and driver for interconnect providers found in SM8450 SoC. * icc-sm8450 dt-bindings: interconnect: Add Qualcomm SM8450 DT bindings interconnect: qcom: Add SM8450 interconnect provider driver Link: https://lore.kernel.org/r/20211209084842.189627-1-vkoul@kernel.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-12-15dt-bindings: interconnect: Add Qualcomm SM8450 DT bindingsVinod Koul1-0/+171
The Qualcomm SM8450 SoC has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand Signed-off-by: Vinod Koul <vkoul@kernel.org> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20211209084842.189627-2-vkoul@kernel.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-11-22dt-bindings: interconnect: Add Qualcomm MSM8996 DT bindingsYassine Oudjana1-0/+163
Add bindings for interconnects on Qualcomm MSM8996. Signed-off-by: Yassine Oudjana <y.oudjana@protonmail.com> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Tested-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> #db820c Link: https://lore.kernel.org/r/20211021132329.234942-4-y.oudjana@protonmail.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-08-09dt-bindings: interconnect: Add Qualcomm SC8180x DT bindingsGeorgi Djakov1-0/+185
Add compatibles and port definitions for the SC8180x RPMH interconnect providers. Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> [bjorn: Split defines from driver patch and added binding update] Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20210723194243.3675795-1-bjorn.andersson@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-05-11dt-bindings: interconnect: Add Qualcomm SC7280 DT bindingsOdelu Kukatla1-0/+165
The Qualcomm SC7280 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Odelu Kukatla <okukatla@codeaurora.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/1619517059-12109-2-git-send-email-okukatla@codeaurora.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-04-02Merge branch 'icc-sm8350' into icc-nextGeorgi Djakov1-0/+172
This adds interconnect support for SM8350 SoC. * icc-sm8350 dt-bindings: interconnect: Add Qualcomm SM8350 DT bindings interconnect: qcom: Add SM8350 interconnect provider driver interconnect: qcom: sm8350: Use the correct ids interconnect: qcom: sm8350: Add missing link between nodes Link: https://lore.kernel.org/r/20210318094617.951212-1-vkoul@kernel.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-03-27dt-bindings: interconnect: Add Qualcomm SM8350 DT bindingsVinod Koul1-0/+172
The Qualcomm SM8350 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Vinod Koul <vkoul@kernel.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20210318094617.951212-2-vkoul@kernel.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-03-08dt-bindings: interconnect: Add bindings for Qualcomm SDM660 NoCAngeloGioacchino Del Regno1-0/+116
Add the bindings for the Qualcomm SDM660-class NoC, valid for SDM630, SDM636, SDM660 and SDA variants. Signed-off-by: AngeloGioacchino Del Regno <kholk11@gmail.com> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20201017133718.31327-2-kholk11@gmail.com Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-02-01Merge branch 'icc-sdx55' into icc-nextGeorgi Djakov1-0/+76
Add interconnect driver support for SDX55 platform for scaling the bandwidth requirements over RPMh. * icc-sdx55 dt-bindings: interconnect: Add Qualcomm SDX55 DT bindings interconnect: qcom: Add SDX55 interconnect provider driver Link: https://lore.kernel.org/r/20210121053254.8355-1-manivannan.sadhasivam@linaro.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-01-27dt-bindings: interconnect: Add Qualcomm SDX55 DT bindingsManivannan Sadhasivam1-0/+76
The Qualcomm SDX55 platform has several bus fabrics that could be controlled and tuned dynamically over RPMh according to the bandwidth demand. Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org> Link: https://lore.kernel.org/r/20210121053254.8355-2-manivannan.sadhasivam@linaro.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-01-05dt-bindings: interconnect: Add Qualcomm MSM8939 DT bindingsJun Nie1-0/+105
The Qualcomm MSM8939 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Jun Nie <jun.nie@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20201204075345.5161-5-jun.nie@linaro.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-11-30dt-bindings: interconnect: sdm845: Add IDs for the QUP portsGeorgi Djakov1-0/+2
The QUP ports exist in the topology, but are not exposed as an endpoints in DT. Fix this by creating IDs and attach them to their NoCs, so that the various QUP drivers (i2c/spi/uart etc.) are able to request their interconnect paths and scale their bandwidth. Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> Link: https://lore.kernel.org/r/20201105135211.7160-1-georgi.djakov@linaro.org Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
2020-09-08dt-bindings: interconnect: Add EPSS L3 DT binding on SM8250Sibi Sankar1-0/+3
Add Epoch Subsystem (EPSS) L3 interconnect provider binding on SM8250 SoCs. Signed-off-by: Sibi Sankar <sibis@codeaurora.org> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20200801123049.32398-5-sibis@codeaurora.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-09-08dt-bindings: interconnect: Add generic qcom bindingsMike Tipton1-0/+26
Add generic qcom interconnect bindings that are common across platforms. In particular, these include QCOM_ICC_TAG_* macros that clients can use when calling icc_set_tag(). Signed-off-by: Mike Tipton <mdtipton@codeaurora.org> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20200903192149.30385-3-mdtipton@codeaurora.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-09-08dt-bindings: interconnect: Add Qualcomm SM8250 DT bindingsJonathan Marek1-0/+172
The Qualcomm SM8250 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Jonathan Marek <jonathan@marek.ca> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Sibi Sankar <sibis@codeaurora.org> Link: https://lore.kernel.org/r/20200728023811.5607-4-jonathan@marek.ca Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-09-08dt-bindings: interconnect: Add Qualcomm SM8150 DT bindingsJonathan Marek1-0/+162
The Qualcomm SM8150 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Jonathan Marek <jonathan@marek.ca> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Sibi Sankar <sibis@codeaurora.org> Link: https://lore.kernel.org/r/20200728023811.5607-3-jonathan@marek.ca Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
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