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author | Priyanka Jain <Priyanka.Jain@freescale.com> | 2013-09-25 09:11:19 +0400 |
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committer | York Sun <yorksun@freescale.com> | 2013-10-17 03:15:16 +0400 |
commit | 0dd38a35f462b3ba28a49cda2dc80ef57eb52acd (patch) | |
tree | bfb78890aed1b2b08a3ecbeaaefcc03e79e6b9c2 /include | |
parent | 262737f05aa94b29d24f21d7eae89756c242df8e (diff) | |
download | u-boot-0dd38a35f462b3ba28a49cda2dc80ef57eb52acd.tar.xz |
powerpc: Fix CamelCase warnings in DDR related code
Some DDR related structures present in fsl_ddr_dimm_params.h, fsl_ddr_sdram.h, ddr_spd.h
has various parameters with embedded acronyms capitalized that trigger the CamelCase
warning in checkpatch.pl
Convert those variable names to smallcase naming convention and modify all files
which are using these structures with modified structures.
Signed-off-by: Priyanka Jain <Priyanka.Jain@freescale.com>
Diffstat (limited to 'include')
-rw-r--r-- | include/ddr_spd.h | 48 |
1 files changed, 24 insertions, 24 deletions
diff --git a/include/ddr_spd.h b/include/ddr_spd.h index f5809e5e1b..15a3e8d351 100644 --- a/include/ddr_spd.h +++ b/include/ddr_spd.h @@ -126,8 +126,8 @@ typedef struct ddr2_spd_eeprom_s { unsigned char tdqsq; /* 44 Max DQS to DQ skew (tDQSQ max) */ unsigned char tqhs; /* 45 Max Read DataHold skew (tQHS) */ unsigned char pll_relock; /* 46 PLL Relock time */ - unsigned char Tcasemax; /* 47 Tcasemax */ - unsigned char psiTAdram; /* 48 Thermal Resistance of DRAM Package from + unsigned char t_casemax; /* 47 Tcasemax */ + unsigned char psi_ta_dram; /* 48 Thermal Resistance of DRAM Package from Top (Case) to Ambient (Psi T-A DRAM) */ unsigned char dt0_mode; /* 49 DRAM Case Temperature Rise from Ambient due to Activate-Precharge/Mode Bits @@ -153,9 +153,9 @@ typedef struct ddr2_spd_eeprom_s { unsigned char dt7; /* 57 DRAM Case Temperature Rise from Ambient due to Bank Interleave Reads with Auto-Precharge (DT7) */ - unsigned char psiTApll; /* 58 Thermal Resistance of PLL Package form + unsigned char psi_ta_pll; /* 58 Thermal Resistance of PLL Package form Top (Case) to Ambient (Psi T-A PLL) */ - unsigned char psiTAreg; /* 59 Thermal Reisitance of Register Package + unsigned char psi_ta_reg; /* 59 Thermal Reisitance of Register Package from Top (Case) to Ambient (Psi T-A Register) */ unsigned char dtpllactive; /* 60 PLL Case Temperature Rise from Ambient @@ -191,41 +191,41 @@ typedef struct ddr3_spd_eeprom_s { Dividend / Divisor */ unsigned char mtb_dividend; /* 10 Medium Timebase (MTB) Dividend */ unsigned char mtb_divisor; /* 11 Medium Timebase (MTB) Divisor */ - unsigned char tCK_min; /* 12 SDRAM Minimum Cycle Time */ + unsigned char tck_min; /* 12 SDRAM Minimum Cycle Time */ unsigned char res_13; /* 13 Reserved */ unsigned char caslat_lsb; /* 14 CAS Latencies Supported, Least Significant Byte */ unsigned char caslat_msb; /* 15 CAS Latencies Supported, Most Significant Byte */ - unsigned char tAA_min; /* 16 Min CAS Latency Time */ - unsigned char tWR_min; /* 17 Min Write REcovery Time */ - unsigned char tRCD_min; /* 18 Min RAS# to CAS# Delay Time */ - unsigned char tRRD_min; /* 19 Min Row Active to + unsigned char taa_min; /* 16 Min CAS Latency Time */ + unsigned char twr_min; /* 17 Min Write REcovery Time */ + unsigned char trcd_min; /* 18 Min RAS# to CAS# Delay Time */ + unsigned char trrd_min; /* 19 Min Row Active to Row Active Delay Time */ - unsigned char tRP_min; /* 20 Min Row Precharge Delay Time */ - unsigned char tRAS_tRC_ext; /* 21 Upper Nibbles for tRAS and tRC */ - unsigned char tRAS_min_lsb; /* 22 Min Active to Precharge + unsigned char trp_min; /* 20 Min Row Precharge Delay Time */ + unsigned char tras_trc_ext; /* 21 Upper Nibbles for tRAS and tRC */ + unsigned char tras_min_lsb; /* 22 Min Active to Precharge Delay Time */ - unsigned char tRC_min_lsb; /* 23 Min Active to Active/Refresh + unsigned char trc_min_lsb; /* 23 Min Active to Active/Refresh Delay Time, LSB */ - unsigned char tRFC_min_lsb; /* 24 Min Refresh Recovery Delay Time */ - unsigned char tRFC_min_msb; /* 25 Min Refresh Recovery Delay Time */ - unsigned char tWTR_min; /* 26 Min Internal Write to + unsigned char trfc_min_lsb; /* 24 Min Refresh Recovery Delay Time */ + unsigned char trfc_min_msb; /* 25 Min Refresh Recovery Delay Time */ + unsigned char twtr_min; /* 26 Min Internal Write to Read Command Delay Time */ - unsigned char tRTP_min; /* 27 Min Internal Read to Precharge + unsigned char trtp_min; /* 27 Min Internal Read to Precharge Command Delay Time */ - unsigned char tFAW_msb; /* 28 Upper Nibble for tFAW */ - unsigned char tFAW_min; /* 29 Min Four Activate Window + unsigned char tfaw_msb; /* 28 Upper Nibble for tFAW */ + unsigned char tfaw_min; /* 29 Min Four Activate Window Delay Time*/ unsigned char opt_features; /* 30 SDRAM Optional Features */ unsigned char therm_ref_opt; /* 31 SDRAM Thermal and Refresh Opts */ unsigned char therm_sensor; /* 32 Module Thermal Sensor */ unsigned char device_type; /* 33 SDRAM device type */ - int8_t fine_tCK_min; /* 34 Fine offset for tCKmin */ - int8_t fine_tAA_min; /* 35 Fine offset for tAAmin */ - int8_t fine_tRCD_min; /* 36 Fine offset for tRCDmin */ - int8_t fine_tRP_min; /* 37 Fine offset for tRPmin */ - int8_t fine_tRC_min; /* 38 Fine offset for tRCmin */ + int8_t fine_tck_min; /* 34 Fine offset for tCKmin */ + int8_t fine_taa_min; /* 35 Fine offset for tAAmin */ + int8_t fine_trcd_min; /* 36 Fine offset for tRCDmin */ + int8_t fine_trp_min; /* 37 Fine offset for tRPmin */ + int8_t fine_trc_min; /* 38 Fine offset for tRCmin */ unsigned char res_39_59[21]; /* 39-59 Reserved, General Section */ /* Module-Specific Section: Bytes 60-116 */ |