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2023-07-28Merge branch '2023-07-27-TI-K2-K3-updates'Tom Rini14-109/+118
- Resync some of the K3 DTS files with the kernel, and pull in some required related updates to keep drivers in sync with the dts files now. Bring in some incremental fixes on top of one of the series I applied recently as well as updating the iot2050 platform. Also do a few small updates to the K2 platforms.
2023-07-28configs: keystone2: Change to using env filesAndrew Davis5-0/+93
Move to using .env file for setting up environment variables for K2x_evm. Signed-off-by: Andrew Davis <afd@ti.com> Reviewed-by: Tom Rini <trini@konsulko.com>
2023-07-28env: ti: mmc.env: Move mmc related args to common placeVignesh Raghavendra5-74/+0
All K3 SoCs use same set of args to load kernel for MMC. So move this to common place to avoid duplication. Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com> Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com> Reviewed-by: Nikhil M Jain <n-jain1@ti.com>
2023-07-28boards: siemens: iot2050: Unify PG1 and PG2/M.2 configurations againJan Kiszka3-35/+23
This avoids having to maintain to defconfigs that are 99% equivalent. The approach is to use binman to generate two flash images, flash-pg1.bin and flash-pg2.bin. With the help of a template dtsi, we can avoid duplicating the common binman image definitions. Suggested-by: Andrew Davis <afd@ti.com> Reviewed-by: Simon Glass <sjg@chromium.org> Signed-off-by: Jan Kiszka <jan.kiszka@siemens.com>
2023-07-28boards: siemens: iot2050: Fix boot configurationJan Kiszka1-0/+2
The common env bits now come via ti_armv7_common.env, include it. Furthermore restore the board-specific boot targets and their ordering that is now enforced k3-wide differently. Finally, enable CONFIG_LEGACY_IMAGE_FORMAT explicitly which got lost while turning FIT_SIGNATURE on by default for k3 devices. Fixes: 53873974 ("include: armv7: Enable distroboot across all configs") Fixes: 4ae1a247 ("env: Make common bootcmd across all k3 devices") Fixes: 86fab110 ("Kconfig: Enable FIT_SIGNATURE if ARM64") Signed-off-by: Jan Kiszka <jan.kiszka@siemens.com>
2023-07-28board: rockchip: Add Hardkernel ODROID-M1Jonas Karlman4-0/+27
Hardkernel ODROID-M1 is a single board computer with a RK3568B2 SoC, a slightly modified version of the RK3568 SoC. Features tested on a ODROID-M1 8GB v1.0 2022-06-13: - SD-card boot - eMMC boot - SPI Flash boot - PCIe/NVMe/AHCI - SATA port - USB host Device tree is imported from linux v6.4. Signed-off-by: Jonas Karlman <jonas@kwiboo.se> Reviewed-by: Stefan Agner <stefan@agner.ch> Tested-by: Stefan Agner <stefan@agner.ch> Reviewed-by: Kever Yang <kever.yang@rock-chips.com>
2023-07-28arm: rockchip: Add Radxa ROCK 4SEChristopher Obbard1-0/+6
Add board-specific devicetree/config for the RK3399T-based Radxa ROCK 4SE board. This board offers similar peripherals in a similar form-factor to the existing ROCK Pi 4B but uses the cost-optimised RK3399T processor (which has different OPP table than the RK3399) and other minimal hardware changes. Kernel tag: next-20230719 Kernel commits: - 86a0e14a82ea ("arm64: dts: rockchip: Add Radxa ROCK 4SE") Signed-off-by: Christopher Obbard <chris.obbard@collabora.com> Reviewed-by: Kever Yang <kever.yang@rock-chips.com>
2023-07-28rockchip: evb_rk3229: Update/fix READMEAlex Bee1-24/+48
This updates the evb_rk3229's README on howto create / use the FIT image created by binman. Also fix some wrong paths and update filenames which have changed in recent upstream optee-os versions. Signed-off-by: Alex Bee <knaerzche@gmail.com> Reviewed-by: Kever Yang <kever.yang@rock-chips.com>
2023-07-28board: rockchip: Add Edgeble Neural Compute Module 6BJagan Teki1-0/+1
Neural Compute Module 6B(Neu6B) is a 96boards SoM-CB compute module based on Rockchip RK3588J from Edgeble AI. Add support for this SoM and IO board. Signed-off-by: Jagan Teki <jagan@edgeble.ai> Reviewed-by: Kever Yang <kever.yang@rock-chips.com>
2023-07-28rockchip: rk3568: Add support for FriendlyARM NanoPi R5CTianling Shen1-0/+7
FriendlyARM NanoPi R5C is an open-sourced mini IoT gateway device. Specification: - Rockchip RK3568 - 1/4GB LPDDR4X RAM - 8/32GB eMMC - SD card slot - M.2 Connector - 2x USB 3.0 Port - 2x 2500 Base-T (PCIe, r8125) - HDMI 2.0 - MIPI DSI/CSI - USB Type C 5V The device tree is taken from kernel v6.4-rc1. Reviewed-by: Kever Yang <kever.yang@rock-chips.com> Signed-off-by: Tianling Shen <cnsztl@gmail.com>
2023-07-28rockchip: rk3568: Add support for FriendlyARM NanoPi R5STianling Shen1-0/+8
FriendlyARM NanoPi R5S is an open-sourced mini IoT gateway device. Board Specifications - Rockchip RK3568 - 2 or 4GB LPDDR4X - 8GB or 16GB eMMC, SD card slot - GbE LAN (Native) - 2x 2.5G LAN (PCIe) - M.2 Connector - HDMI 2.0, MIPI DSI/CSI - 2xUSB 3.0 Host - USB Type C PD, 5V/9V/12V - GPIO: 12-pin 0.5mm FPC connector The device tree is taken from kernel v6.4-rc1. Reviewed-by: Kever Yang <kever.yang@rock-chips.com> Signed-off-by: Tianling Shen <cnsztl@gmail.com>
2023-07-28rockchip: rk3328: Add support for Orange Pi R1 Plus LTSTianling Shen1-0/+6
The OrangePi R1 Plus LTS is a minor variant of OrangePi R1 Plus with the on-board NIC chip changed from rtl8211e to yt8531c, and RAM type changed from DDR4 to LPDDR3. The device tree is taken from kernel v6.4-rc1. Signed-off-by: Tianling Shen <cnsztl@gmail.com> Reviewed-by: Kever Yang <kever.yang@rock-chips.com>
2023-07-28rockchip: rk3328: Add support for Orange Pi R1 PlusTianling Shen1-0/+6
Orange Pi R1 Plus is a Rockchip RK3328 based SBC by Xunlong. This device is similar to the NanoPi R2S, and has a 16MB SPI NOR (mx25l12805d). The reset button is changed to directly reset the power supply, another detail is that both network ports have independent MAC addresses. The device tree and description are taken from kernel v6.3-rc1. Reviewed-by: Kever Yang <kever.yang@rock-chips.com> Signed-off-by: Tianling Shen <cnsztl@gmail.com>
2023-07-28board: rockchip: Add panel auto-detection for Anbernic RGxx3Chris Morgan1-0/+196
Add support to automatically detect the panel for the Anbernic RGxx3. This is done by creating a "pseudo driver" that provides only the bare minimum to start the DSI controller and DSI DPHY. Once started, we then can query the panel for its panel ID and compare it to a table of known values. The panel compatible string (which corresponds to the upstream Linux driver) is then defined as an environment variable "panel". The panel compatible string is also changed automatically via an ft_board_setup() call if what is detected differs from what is in the loaded tree. This way, end users can use the same bootloader without having to worry about which panel they have (as there is no obvious way of knowing). Signed-off-by: Chris Morgan <macromorgan@hotmail.com> Reviewed-by: Kever Yang <kever.yang@rock-chips.com>
2023-07-28board: rockchip: Add support for RG353PS to RGxx3Chris Morgan1-40/+86
Add support for the RG353PS to the Anbernic RGxx3. This device is a slightly pared down version of the RG353P with no eMMC, no touchscreen, and only 1GB of RAM. Refactor board logic so that all supported devices are defined with ADC values and that future boards can be added by just defining the board values in the device array. Signed-off-by: Chris Morgan <macromorgan@hotmail.com> Reviewed-by: Kever Yang <kever.yang@rock-chips.com>
2023-07-28rockchip: board: Update Odroid Go2 to Support Additional RevisionsChris Morgan1-0/+103
Update the board.c file for the Odroid Go Advance to support the Black Edition and the Odroid Go Super. The Odroid Go Advance Black Edition differs from the original model with the addition of 2 extra buttons and an ESP8266 WiFi module. The Odroid Go Super adds an additional 2 buttons compared to the Black Edition, along with a larger panel and larger battery. This change uses the value of ADC0 to determine which of these 3 models it is, and then changes the ${fdtfile} environment variable to match the proper devicetree name in mainline Linux. Tested on an Odroid Go Advance (first revision) and an Odroid Go Super. The correct ${fdtfile} variable was set for each device. Signed-off-by: Chris Morgan <macromorgan@hotmail.com> Reviewed-by: Kever Yang <kever.yang@rock-chips.com>
2023-07-26board: m68k add missing maintainerAngelo Dureghello6-6/+6
Add myself as a maintainer for orphaned boards. All these boards are covered by buildman m68k test. Signed-off-by: Angelo Dureghello <angelo@kernel-space.org>
2023-07-25MAINTAINERS: Take maintainership of TI KeyStone2 supportAndrew Davis1-10/+7
Add arch/arm/mach-keystone/ into K2 board directory MAINTAINERS file. Convert current entries into regex match style. Assign maintainership to myself. Signed-off-by: Andrew Davis <afd@ti.com>
2023-07-25MAINTAINERS: Add some missing directories or filesTom Rini13-5/+14
In a few cases we have MAINTAINERS entries that are missing obvious paths or files. Typically this means a board directory that did not list itself, but in a few cases we have a Kconfig file or similar. Signed-off-by: Tom Rini <trini@konsulko.com> Reviewed-by: Simon Glass <sjg@chromium.org>
2023-07-25MAINTAINERS: Deal with '+' in pathsTom Rini3-3/+5
The listed paths are allowed to contain wildcards. This includes the '+' character which we have as a literal part of the path in a few cases. Escape the '+' here so that files are matched. Signed-off-by: Tom Rini <trini@konsulko.com> Reviewed-by: Simon Glass <sjg@chromium.org>
2023-07-25MAINTAINERS: Fix path typos and similarTom Rini19-23/+23
We have a number of cases where the in-tree path of files and where they presumably were when the first version of a patch were posted differ slightly. Correct these to point at where the files are now. Signed-off-by: Tom Rini <trini@konsulko.com> Reviewed-by: Simon Glass <sjg@chromium.org>
2023-07-25MAINTAINERS: Add a number of "common" directoriesTom Rini42-0/+47
A number of platforms have "common" directories that are in turn not listed by the board MAINTAINERS file. Add these directories in many cases. Signed-off-by: Tom Rini <trini@konsulko.com> Reviewed-by: Simon Glass <sjg@chromium.org>
2023-07-25xes: Remove leftover codeTom Rini5-184/+0
The platforms here have been removed, but the common code directory was forgotten. Clean up. Signed-off-by: Tom Rini <trini@konsulko.com> Reviewed-by: Simon Glass <sjg@chromium.org>
2023-07-25arm: Remove leftover MAINTAINERS filesTom Rini4-31/+0
These platforms have been removed, but the MAINTAINERS file was missed, clean up. Signed-off-by: Tom Rini <trini@konsulko.com> Reviewed-by: Simon Glass <sjg@chromium.org>
2023-07-25arm: Remove more remnants of bcmcygnusTom Rini2-91/+0
Remove some leftover files from the bcmcygnus platform. Signed-off-by: Tom Rini <trini@konsulko.com> Reviewed-by: Simon Glass <sjg@chromium.org>
2023-07-25sunxi: Add MAINTAINERS entry for Lctech Pi F1C200sTom Rini1-0/+5
This defconfig was added without a MAINTAINERS entry, add one. Signed-off-by: Tom Rini <trini@konsulko.com> Reviewed-by: Simon Glass <sjg@chromium.org>
2023-07-25rockchip: Add MAINTAINERS entry for Radxa Rock 4C+Tom Rini1-0/+6
This defconfig was added without a MAINTAINERS entry, add one. Signed-off-by: Tom Rini <trini@konsulko.com> Reviewed-by: Simon Glass <sjg@chromium.org>
2023-07-25MAINTAINERS: Add some missing defconfig files to existing entriesTom Rini6-1/+8
We have a few places where defconfigs were added (or renamed) and not included in their previously listed MAINTAINERS entry, correct this. Signed-off-by: Tom Rini <trini@konsulko.com> Acked-by: Adam Ford <aford173@gmail.com> Reviewed-by: Simon Glass <sjg@chromium.org>
2023-07-25MAINTAINERS: Correct minor mistakes on some file listingsTom Rini3-3/+3
There are a few entries where minor mistakes mean that we don't match up with obviously expected files, correct those. Signed-off-by: Tom Rini <trini@konsulko.com> Reviewed-by: Simon Glass <sjg@chromium.org>
2023-07-22board: ti: keys: add .key and .crt for fit signature signingManorit Chawdhry2-0/+84
Fit signature mechanism through the standards require the presence of .key and .crt in the folder with the same name, since we are using our custMpk only for the signing, update the format to that of standards to be compatible for packaging easily. Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
2023-07-22environment: ti: Make get_fdt_mmc commonAndrew Davis6-6/+0
Since get_fdt_mmc is common, factor it out into mmc.env and remove it from each platform env file along with changing the directory path to reflect the standards. Use it in mmcloados but keep loadfdt defined in case it is still used by some external uEnv.txt script. Signed-off-by: Andrew Davis <afd@ti.com> Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
2023-07-22environment: ti: Prefix ARM64 DTB names with directoryAndrew Davis6-12/+12
In Linux the ARM64 DTSs are stored in vendor directories to help organize the files and prevent naming collisions. The deployed DTBs will mirror this and so the vendor prefix should be added to the variable used to locate these files. Suggested-by: Ryan Eatmon <reatmon@ti.com> Signed-off-by: Andrew Davis <afd@ti.com> Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com> Reviewed-by: Nikhil M Jain <n-jain1@ti.com>
2023-07-22board: ti: am64x: am64x.env: set fdtfile env variableKamlesh Gurudasani1-0/+1
Set fdtfile env variable similar to other k3 socs. Signed-off-by: Kamlesh Gurudasani <kamlesh@ti.com> Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com> Reviewed-by: Nikhil M Jain <n-jain1@ti.com>
2023-07-22doc: board: ti: Update documentation for binman flowNeha Malcom Francis1-350/+0
Earlier documentation specified builds for generating bootloader images using an external TI repository k3-image-gen and core-secdev-k3. Modify this to using the binman flow so that user understands how to build the final boot images. Reviewed-by: Simon Glass <sjg@chromium.org> Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-22am62a: dts: binman: Package tiboot3.bin, tispl.bin, u-boot.imgNeha Malcom Francis1-0/+2
Support added for HS-SE, HS-FS and GP boot binaries for AM62ax. HS-SE: * tiboot3-am62ax-hs-evm.bin * tispl.bin * u-boot.img HS-FS: * tiboot3-am62ax-hs-fs-evm.bin * tispl.bin * u-boot.img GP: * tiboot3.bin --> tiboot3-am62ax-gp-evm.bin * tispl.bin_unsigned * u-boot.img_unsigned It is to be noted that the bootflow followed by AM62ax requires: tiboot3.bin: * R5 SPL * R5 SPL dtbs * TIFS * board-cfg * pm-cfg * sec-cfg * rm-cfg tispl.bin: * DM * ATF * OP-TEE * A72 SPL * A72 SPL dtbs u-boot.img: * A72 U-Boot * A72 U-Boot dtbs Reviewed-by: Simon Glass <sjg@chromium.org> [afd@ti.com: changed output binary names appropriately] Signed-off-by: Andrew Davis <afd@ti.com> Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-22am62a: yaml: Add board configs for AM62axNeha Malcom Francis5-0/+2589
Added YAML configs for AM62ax Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-22am625: dts: binman: Package tiboot3.bin, tispl.bin and u-boot.imgNeha Malcom Francis1-0/+2
Support added for HS-SE, HS-FS and GP boot binaries for AM62. HS-SE: * tiboot3-am62x-hs-evm.bin * tispl.bin * u-boot.img HS-FS: * tiboot3-am62x-hs-fs-evm.bin * tispl.bin * u-boot.img GP: * tiboot3.bin --> tiboot3-am62x-gp-evm.bin * tispl.bin_unsigned * u-boot.img_unsigned It is to be noted that the bootflow followed by AM62 requires: tiboot3.bin: * R5 SPL * R5 SPL dtbs * TIFS * board-cfg * pm-cfg * sec-cfg * rm-cfg tispl.bin: * DM * ATF * OP-TEE * A72 SPL * A72 SPL dtbs u-boot.img: * A72 U-Boot * A72 U-Boot dtbs Reviewed-by: Simon Glass <sjg@chromium.org> [afd@ti.com: changed output binary names appropriately] Signed-off-by: Andrew Davis <afd@ti.com> Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-22am62: yaml: Add board configs for AM62Neha Malcom Francis4-0/+1515
Added YAML configs for AM62 Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-22j721s2: dts: binman: Package tiboot3.bin, tispl.bin and u-boot.imgNeha Malcom Francis1-0/+2
Support has been added for both HS-SE, HS-FS and GP images. HS-SE: * tiboot3-j721s2-hs-evm.bin * tispl.bin * u-boot.img HS-FS: * tiboot3-j721s2-hs-fs-evm.bin * tispl.bin * u-boot.img GP: * tiboot3.bin --> tiboot3-j721s2-gp-evm.bin * tispl.bin_unsigned * u-boot.img_unsigned It is to be noted that the bootflow followed by J721S2 requires: tiboot3.bin: * R5 SPL * R5 SPL dtbs * TIFS * board-cfg * pm-cfg * sec-cfg * rm-cfg tispl.bin: * DM * ATF * OP-TEE * A72 SPL * A72 SPL dtbs u-boot.img: * A72 U-Boot * A72 U-Boot dtbs Reviewed-by: Simon Glass <sjg@chromium.org> [afd@ti.com: changed output binary names appropriately] Signed-off-by: Andrew Davis <afd@ti.com> Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-22j721s2: yaml: Add board configs for J721S2Neha Malcom Francis4-0/+3328
Added YAML configs for J721S2 Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-22am64x: dts: binman: Package tiboot3.bin, tispl.bin u-boot.imgNeha Malcom Francis1-0/+2
Support added for HS and GP boot binaries for AM64x. HS-SE: * tiboot3-am64x_sr2-hs-evm.bin * tispl.bin * u-boot.img HS-FS: * tiboot3-am64x_sr2-hs-fs-evm.bin * tispl.bin * u-boot.img GP: * tiboot3.bin --> tiboot3-am64x-gp-evm.bin * tispl.bin_unsigned * u-boot.img_unsigned Note that the bootflow followed by AM64x requires: tiboot3.bin: * R5 SPL * R5 SPL dtbs * sysfw * board-cfg * pm-cfg * sec-cfg * rm-cfg tispl.bin: * ATF * OP-TEE * A53 SPL * A53 SPL dtbs u-boot.img: * A53 U-Boot * A53 U-Boot dtbs Reviewed-by: Simon Glass <sjg@chromium.org> [afd@ti.com: changed output binary names appropriately] Signed-off-by: Andrew Davis <afd@ti.com> Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-22am64x: yaml: Add board configs for AM64xNeha Malcom Francis4-0/+1828
Added YAML configs for AM64xx Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-22am65: dts: binman: Package tiboot3.bin, sysfw.itb, tispl.bin, u-boot.imgNeha Malcom Francis1-0/+2
Support has been added for both HS-SE(SR 2.0) and GP(SR 2.0) images. HS-SE: * tiboot3-am65x_sr2-hs-evm.bin * sysfw-am65x_sr2-hs-evm.itb * tispl.bin * u-boot.img GP: * tiboot3.bin --> tiboot3-am65x_sr2-gp-evm.bin * sysfw.itb --> sysfw-am65x_sr2-gp-evm.itb * tispl.bin_unsigned * u-boot.img_unsigned Note that the bootflow followed by AM65x requires: tiboot3.bin: * R5 SPL * R5 SPL dtbs sysfw.itb: * sysfw * board-cfg * pm-cfg * sec-cfg * rm-cfg tispl.bin: * ATF * OP-TEE * A53 SPL * A53 SPL dtbs u-boot.img: * A53 U-Boot * A53 U-Boot dtbs Reviewed-by: Simon Glass <sjg@chromium.org> [afd@ti.com: changed output binary names appropriately] Signed-off-by: Andrew Davis <afd@ti.com> Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-22am65x: yaml: Add AM65x board config filesNeha Malcom Francis4-0/+2495
Added YAML configs for AM65x Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-22j7200: dts: binman: Package tiboot3.bin, tispl.bin, u-boot.imgNeha Malcom Francis1-0/+2
Support has been added for both HS-SE(SR 2.0), HS-FS(SR 2.0) and GP images. HS-SE: * tiboot3-j7200_sr2-hs-evm.bin * tispl.bin * u-boot.img HS-FS: * tiboot3-j7200_sr2-hs-fs-evm.bin * tispl.bin * u-boot.img GP: * tiboot3.bin --> tiboot3-j7200-gp-evm.bin * tispl.bin_unsigned * u-boot.img_unsigned It is to be noted that the bootflow followed by J7200 requires: tiboot3.bin: * R5 SPL * R5 SPL dtbs * TIFS * board-cfg * pm-cfg * sec-cfg * rm-cfg tispl.bin: * DM * ATF * OP-TEE * A72 SPL * A72 SPL dtbs u-boot.img: * A72 U-Boot * A72 U-Boot dtbs Reviewed-by: Simon Glass <sjg@chromium.org> [afd@ti.com: changed output binary names appropriately] Signed-off-by: Andrew Davis <afd@ti.com> Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-22j7200: yaml: Add J7200 board config filesNeha Malcom Francis4-0/+2493
Added YAML configs for J7200 Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-22j721e: dts: binman: Package tiboot3.bin, sysfw.itb, tispl.bin, u-boot.imgNeha Malcom Francis1-0/+2
By providing entries in the binman node of the device tree, binman will be able to find and package board config artifacts generated by TIBoardConfig with sysfw.bin and generate the final image sysfw.itb. It will also pick out the R5 SPL and sign it with the help of TI signing entry and generate the final tiboot3.bin. Entries for A72 build have been added to k3-j721e-binman.dtsi to generate tispl.bin and u-boot.img. Support has been added for both HS-SE(SR 1.1), HS-FS(SR 2.0) and GP images In HS-SE, the encrypted system firmware binary must be signed along with the signed certificate binary. HS-SE: * tiboot3-j721e_sr1_1-hs-evm.bin * sysfw-j721e_sr1_1-hs-evm.itb * tispl.bin * u-boot.img HS-FS: * tiboot3-j721e_sr2-hs-fs-evm.bin * sysfw-j721e_sr2-hs-fs-evm.itb * tispl.bin * u-boot.img GP: * tiboot3.bin -->tiboot3-j721e-gp-evm.bin * sysfw.itb --> sysfw-j721e-gp-evm.itb * tispl.bin_unsigned * u-boot.img_unsigned It is to be noted that the bootflow followed by J721E requires: tiboot3.bin: * R5 SPL * R5 SPL dtbs sysfw.itb: * TIFS * board-cfg * pm-cfg * sec-cfg * rm-cfg tispl.bin: * DM * ATF * OP-TEE * A72 SPL * A72 SPL dtbs u-boot.img: * A72 U-Boot * A72 U-Boot dtbs Reviewed-by: Simon Glass <sjg@chromium.org> [afd@ti.com: changed output binary names appropriately] Signed-off-by: Andrew Davis <afd@ti.com> Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-22j721e: schema: yaml: Add general schema and J721E board config filesNeha Malcom Francis5-0/+4038
Schema file in YAML must be provided in board/ti/common for validating input config files and packaging system firmware. The schema includes entries for rm-cfg, board-cfg, pm-cfg and sec-cfg. Board config files must be provided in board/ti/<devicename> in YAML. These can then be consumed for generation of binaries to package system firmware. Added YAML configs for J721E in particular. Signed-off-by: Tarun Sahu <t-sahu@ti.com> [n-francis@ti.com: prepared patch for upstreaming] Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-22binman: ti-secure: Add support for TI signingNeha Malcom Francis2-0/+61
The ti-secure entry contains certificate for binaries that will be loaded or booted by system firmware whereas the ti-secure-rom entry contains certificate for binaries that will be booted by ROM. Support for both these types of certificates is necessary for booting of K3 devices. Reviewed-by: Simon Glass <sjg@chromium.org> [vigneshr@ti.com: fixed inconsist cert generation by multiple packing] Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com> Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21board: ti: am62x: evm: Update function calls for splash screenNikhil M Jain1-26/+15
Use spl_dcache_enable, in place of setup_dram, arch_reserve_mmu to set up pagetable, initialise DRAM and enable Dcache to avoid multiple function calls. Check for CONFIG_SPL_VIDEO in place of CONFIG_SPL_VIDEO_TIDSS to prevent any build failure in case video config is not defined and video related functions are called. Check for CONFIG_SPL_SPLASH_SCREEN and CONFIG_SPL_BMP before calling splash_display to avoid compilation failure. Signed-off-by: Nikhil M Jain <n-jain1@ti.com>
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