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authorAnton Tikhomirov <av.tikhomirov@samsung.com>2012-02-15 12:04:56 +0400
committerFelipe Balbi <balbi@ti.com>2012-03-02 14:11:28 +0400
commitd28a9689c93195d39f91f35a9519876688605b65 (patch)
tree39d7c0b3f80657039cefc3996c20010bdbabbed0 /drivers/usb/dwc3/Makefile
parentf6bafc6a1c9d58f0c234ac5052b9c09b0747348c (diff)
downloadlinux-d28a9689c93195d39f91f35a9519876688605b65.tar.xz
usb: dwc3: Add Exynos Specific Glue layer
Adds Exynos Specific Glue layer to support USB peripherals on Samsung Exynos5 chips. [ balbi@ti.com : prevent compilation of Exynos glue layer on platforms which don't provide clk API implementation ] Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com> Signed-off-by: Felipe Balbi <balbi@ti.com>
Diffstat (limited to 'drivers/usb/dwc3/Makefile')
-rw-r--r--drivers/usb/dwc3/Makefile13
1 files changed, 13 insertions, 0 deletions
diff --git a/drivers/usb/dwc3/Makefile b/drivers/usb/dwc3/Makefile
index 900ae74357f1..d441fe4c180b 100644
--- a/drivers/usb/dwc3/Makefile
+++ b/drivers/usb/dwc3/Makefile
@@ -28,6 +28,19 @@ endif
obj-$(CONFIG_USB_DWC3) += dwc3-omap.o
+##
+# REVISIT Samsung Exynos platform needs the clk API which isn't
+# defined on all architectures. If we allow dwc3-exynos.c compile
+# always we will fail the linking phase on those architectures
+# which don't provide clk api implementation and that's unnaceptable.
+#
+# When Samsung's platform start supporting pm_runtime, this check
+# for HAVE_CLK should be removed.
+##
+ifneq ($(CONFIG_HAVE_CLK),)
+ obj-$(CONFIG_USB_DWC3) += dwc3-exynos.o
+endif
+
ifneq ($(CONFIG_PCI),)
obj-$(CONFIG_USB_DWC3) += dwc3-pci.o
endif