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author | Linus Torvalds <torvalds@linux-foundation.org> | 2022-05-25 02:19:30 +0300 |
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committer | Linus Torvalds <torvalds@linux-foundation.org> | 2022-05-25 02:19:30 +0300 |
commit | f4fb8596657c998ca4cdb833bc0f509533a38ddd (patch) | |
tree | f9a02854f216e9a899efca065eb8813dc6492dde /Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml | |
parent | 09583dfed2cb9723da31601cb7080490c2e2e2d7 (diff) | |
parent | bbb544f3349197d1e7f4f9b921b75e919cd45f39 (diff) | |
download | linux-f4fb8596657c998ca4cdb833bc0f509533a38ddd.tar.xz |
Merge tag 'thermal-5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull thermal control updates from Rafael Wysocki:
"These add a thermal library and thermal tools to wrap the netlink
interface into event-based callbacks, improve overheat condition
handling during suspend-to-idle on Intel SoCs, add some new hardware
support, fix bugs and clean up code.
Specifics:
- Add thermal library and thermal tools to encapsulate the netlink
into event based callbacks (Daniel Lezcano, Jiapeng Chong).
- Improve overheat condition handling during suspend-to-idle in the
Intel PCH thermal driver (Zhang Rui).
- Use local ops instead of global ops in devfreq_cooling (Kant Fan).
- Clean up _OSC handling in int340x (Davidlohr Bueso).
- Switch hisi_termal from CONFIG_PM_SLEEP guards to pm_sleep_ptr()
(Hesham Almatary).
- Add new k3 j72xx bangdap driver and the corresponding bindings
(Keerthy).
- Fix missing of_node_put() in the SC iMX driver at probe time
(Miaoqian Lin).
- Fix memory leak in __thermal_cooling_device_register()
when device_register() fails by calling
thermal_cooling_device_destroy_sysfs() (Yang Yingliang).
- Add sc8180x and sc8280xp compatible string in the DT bindings and
lMH support for QCom tsens driver (Bjorn Andersson).
- Fix OTP Calibration Register values conforming to the documentation
on RZ/G2L and bindings documentation for RZ/G2UL (Biju Das).
- Fix type in kerneldoc description for __thermal_bind_params
(Corentin Labbe).
- Fix potential NULL dereference in sr_thermal_probe() on Broadcom
platform (Zheng Yongjun).
- Add change mode ops to the thermal-of sensor (Manaf Meethalavalappu
Pallikunhi).
- Fix non-negative value support by preventing the value to be clamp
to zero (Stefan Wahren).
- Add compatible string and DT bindings for MSM8960 tsens driver
(Dmitry Baryshkov).
- Add hwmon support for K3 driver (Massimiliano Minella).
- Refactor and add multiple generations support for QCom ADC driver
(Jishnu Prakash).
- Use platform_get_irq_optional() to get the interrupt on RCar driver
and document Document RZ/V2L bindings (Lad Prabhakar).
- Remove NULL check after container_of() call from the Intel HFI
thermal driver (Haowen Bai)"
* tag 'thermal-5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (38 commits)
thermal: intel: pch: improve the cooling delay log
thermal: intel: pch: enhance overheat handling
thermal: intel: pch: move cooling delay to suspend_noirq phase
PM: wakeup: expose pm_wakeup_pending to modules
thermal: k3_j72xx_bandgap: Add the bandgap driver support
dt-bindings: thermal: k3-j72xx: Add VTM bindings documentation
thermal/drivers/imx_sc_thermal: Fix refcount leak in imx_sc_thermal_probe
thermal/core: Fix memory leak in __thermal_cooling_device_register()
dt-bindings: thermal: tsens: Add sc8280xp compatible
dt-bindings: thermal: lmh: Add Qualcomm sc8180x compatible
thermal/drivers/qcom/lmh: Add sc8180x compatible
thermal/drivers/rz2gl: Fix OTP Calibration Register values
dt-bindings: thermal: rzg2l-thermal: Document RZ/G2UL bindings
thermal: thermal_of: fix typo on __thermal_bind_params
tools/thermal: remove unneeded semicolon
tools/lib/thermal: remove unneeded semicolon
thermal/drivers/broadcom: Fix potential NULL dereference in sr_thermal_probe
tools/thermal: Add thermal daemon skeleton
tools/thermal: Add a temperature capture tool
tools/thermal: Add util library
...
Diffstat (limited to 'Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml')
-rw-r--r-- | Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml | 110 |
1 files changed, 108 insertions, 2 deletions
diff --git a/Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml b/Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml index 3ea8c0c1f45f..feb390d50696 100644 --- a/Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml +++ b/Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml @@ -10,7 +10,9 @@ maintainers: properties: compatible: - const: qcom,spmi-adc-tm5 + enum: + - qcom,spmi-adc-tm5 + - qcom,spmi-adc-tm5-gen2 reg: maxItems: 1 @@ -33,6 +35,7 @@ properties: qcom,avg-samples: $ref: /schemas/types.yaml#/definitions/uint32 description: Number of samples to be used for measurement. + Not applicable for Gen2 ADC_TM peripheral. enum: - 1 - 2 @@ -45,6 +48,7 @@ properties: $ref: /schemas/types.yaml#/definitions/uint32 description: This parameter is used to decrease ADC sampling rate. Quicker measurements can be made by reducing decimation ratio. + Not applicable for Gen2 ADC_TM peripheral. enum: - 250 - 420 @@ -93,6 +97,29 @@ patternProperties: - const: 1 - enum: [ 1, 3, 4, 6, 20, 8, 10 ] + qcom,avg-samples: + $ref: /schemas/types.yaml#/definitions/uint32 + description: Number of samples to be used for measurement. + This property in child node is applicable only for Gen2 ADC_TM peripheral. + enum: + - 1 + - 2 + - 4 + - 8 + - 16 + default: 1 + + qcom,decimation: + $ref: /schemas/types.yaml#/definitions/uint32 + description: This parameter is used to decrease ADC sampling rate. + Quicker measurements can be made by reducing decimation ratio. + This property in child node is applicable only for Gen2 ADC_TM peripheral. + enum: + - 85 + - 340 + - 1360 + default: 1360 + required: - reg - io-channels @@ -100,6 +127,31 @@ patternProperties: additionalProperties: false +allOf: + - if: + properties: + compatible: + contains: + const: qcom,spmi-adc-tm5 + + then: + patternProperties: + "^([-a-z0-9]*)@[0-7]$": + properties: + qcom,decimation: false + qcom,avg-samples: false + + - if: + properties: + compatible: + contains: + const: qcom,spmi-adc-tm5-gen2 + + then: + properties: + qcom,avg-samples: false + qcom,decimation: false + required: - compatible - reg @@ -124,7 +176,7 @@ examples: #size-cells = <0>; #io-channel-cells = <1>; - /* Other propreties are omitted */ + /* Other properties are omitted */ conn-therm@4f { reg = <ADC5_AMUX_THM3_100K_PU>; qcom,ratiometric; @@ -148,4 +200,58 @@ examples: }; }; }; + + - | + #include <dt-bindings/iio/qcom,spmi-adc7-pmk8350.h> + #include <dt-bindings/iio/qcom,spmi-adc7-pm8350.h> + #include <dt-bindings/interrupt-controller/irq.h> + spmi_bus { + #address-cells = <1>; + #size-cells = <0>; + pmk8350_vadc: adc@3100 { + reg = <0x3100>; + compatible = "qcom,spmi-adc7"; + #address-cells = <1>; + #size-cells = <0>; + #io-channel-cells = <1>; + + /* Other properties are omitted */ + xo-therm@44 { + reg = <PMK8350_ADC7_AMUX_THM1_100K_PU>; + qcom,ratiometric; + qcom,hw-settle-time = <200>; + }; + + conn-therm@47 { + reg = <PM8350_ADC7_AMUX_THM4_100K_PU>; + qcom,ratiometric; + qcom,hw-settle-time = <200>; + }; + }; + + pmk8350_adc_tm: adc-tm@3400 { + compatible = "qcom,spmi-adc-tm5-gen2"; + reg = <0x3400>; + interrupts = <0x0 0x34 0x0 IRQ_TYPE_EDGE_RISING>; + #thermal-sensor-cells = <1>; + #address-cells = <1>; + #size-cells = <0>; + + pmk8350-xo-therm@0 { + reg = <0>; + io-channels = <&pmk8350_vadc PMK8350_ADC7_AMUX_THM1_100K_PU>; + qcom,decimation = <340>; + qcom,ratiometric; + qcom,hw-settle-time-us = <200>; + }; + + conn-therm@1 { + reg = <1>; + io-channels = <&pmk8350_vadc PM8350_ADC7_AMUX_THM4_100K_PU>; + qcom,avg-samples = <2>; + qcom,ratiometric; + qcom,hw-settle-time-us = <200>; + }; + }; + }; ... |